X-On Electronics has gained recognition as a prominent supplier of TE0745-02-81C11-A System-On-Modules - SOM across the USA, India, Europe, Australia, and various other global locations. TE0745-02-81C11-A System-On-Modules - SOM are a product manufactured by Trenz Electronic. We provide cost-effective solutions for System-On-Modules - SOM, ensuring timely deliveries around the world.

TE0745-02-81C11-A Trenz Electronic

TE0745-02-81C11-A electronic component of Trenz Electronic
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Part No.TE0745-02-81C11-A
Manufacturer: Trenz Electronic
Category: System-On-Modules - SOM
Description: System-On-Modules - SOM SoM with Xilinx Zynq XC7Z035-1FBG676C 1 GByte DDR3L SDRAM 5.2 x 7.6 cm
Datasheet: TE0745-02-81C11-A Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



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MOQ : 1
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1 : USD 866.345
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We are delighted to provide the TE0745-02-81C11-A from our System-On-Modules - SOM category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the TE0745-02-81C11-A and other electronic components in the System-On-Modules - SOM category and beyond.

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TE0745 TRM Revision v.97 Exported on 2020-12-14 Online version of this document: TE0745 TRM Revision: v.97 1 Table of Contents 1 Table of Contents..................................................................................................................................................... 2 2 Table of Figures........................................................................................................................................................ 4 3 Table of Tables ......................................................................................................................................................... 5 4 Overview................................................................................................................................................................... 7 4.1 Key Features............................................................................................................................................................. 7 4.2 Block Diagram .......................................................................................................................................................... 7 4.3 Main Components .................................................................................................................................................... 8 4.4 Initial Delivery State................................................................................................................................................. 9 4.5 Configuration Signals ............................................................................................................................................ 10 5 Signals, Interfaces and Pins................................................................................................................................... 12 5.1 Board to Board (B2B) I/Os ..................................................................................................................................... 12 5.2 System Controller I/O Pins .................................................................................................................................... 13 5.3 I2C Interface ........................................................................................................................................................... 15 5.4 MGT Lanes .............................................................................................................................................................. 16 5.5 MIO Pins .................................................................................................................................................................. 18 6 On-board Peripherals ............................................................................................................................................ 20 6.1 Quad SPI Flash Memory ......................................................................................................................................... 20 6.2 DDR3 SDRAM .......................................................................................................................................................... 21 6.3 RTC.......................................................................................................................................................................... 21 6.4 Programmable PLL Clock ...................................................................................................................................... 22 6.5 System Controller CPLD ........................................................................................................................................ 23 6.6 USB ULPI PHY ......................................................................................................................................................... 24 6.7 MAC Address EEPROM............................................................................................................................................ 24 6.8 EEPROM .................................................................................................................................................................. 24 6.9 Ethernet PHY .......................................................................................................................................................... 24 6.10 LEDs ........................................................................................................................................................................ 25 6.11 Clock Sources ......................................................................................................................................................... 26 7 Power and Power-On Sequence............................................................................................................................ 27 7.1 Power Supply ......................................................................................................................................................... 27 7.2 Power Consumption .............................................................................................................................................. 27 7.3 Power Distribution Dependencies ........................................................................................................................ 28 7.4 Power-On Sequence .............................................................................................................................................. 28 7.5 Voltage Monitor Circuit .......................................................................................................................................... 29 7.6 Power Rails ............................................................................................................................................................. 29 7.7 Bank Voltages......................................................................................................................................................... 31 Copyright 2020Trenz Electronic GmbH 2 of 44

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