X-On Electronics has gained recognition as a prominent supplier of TE0782-02-045-2I System-On-Modules - SOM across the USA, India, Europe, Australia, and various other global locations. TE0782-02-045-2I System-On-Modules - SOM are a product manufactured by Trenz Electronic. We provide cost-effective solutions for System-On-Modules - SOM, ensuring timely deliveries around the world.

TE0782-02-045-2I Trenz Electronic

TE0782-02-045-2I electronic component of Trenz Electronic
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Part No.TE0782-02-045-2I
Manufacturer: Trenz Electronic
Category: System-On-Modules - SOM
Description: System-On-Modules - SOM High-Performance Xilinx Zynq Z-7045 Module ind. temp.range 8.5 x 8.5 cm
Datasheet: TE0782-02-045-2I Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



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MOQ : 1
Multiples : 1
1 : USD 1958.8686
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We are delighted to provide the TE0782-02-045-2I from our System-On-Modules - SOM category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the TE0782-02-045-2I and other electronic components in the System-On-Modules - SOM category and beyond.

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TE0782 TRM Revision: v.33 Exported on: 07/20/2018TE0782 TRM v.33 1 Table of Contents 1 Table of Contents........................................................................................................................................ 2 2 Overview...................................................................................................................................................... 4 2.1 Key Features................................................................................................................................................ 4 2.2 Block Diagram ............................................................................................................................................. 5 2.3 Main Components....................................................................................................................................... 7 2.4 Initial Delivery State.................................................................................................................................... 8 3 Boot Process................................................................................................................................................ 9 4 Signals, Interfaces and Pins...................................................................................................................... 10 4.1 Board to Board (B2B) I/Os ........................................................................................................................ 10 4.2 MGT Lanes ................................................................................................................................................. 10 4.3 JTAG Interface........................................................................................................................................... 12 4.4 System Controller CPLD I/O Pins.............................................................................................................. 13 4.5 Default PS MIO Mapping ........................................................................................................................... 14 4.6 Gigabit Ethernet ........................................................................................................................................ 15 4.7 USB Interface............................................................................................................................................. 15 4.8 I2C Interface .............................................................................................................................................. 17 4.9 Pin Definitions ........................................................................................................................................... 17 5 On-board Peripherals ............................................................................................................................... 18 5.1 System Controller CPLD ........................................................................................................................... 18 5.2 eMMC Flash Memory ................................................................................................................................. 18 5.3 DDR4 Memory............................................................................................................................................ 18 5.4 Quad SPI Flash Memory............................................................................................................................ 18 5.5 Gigabit Ethernet PHYs............................................................................................................................... 18 5.6 High-speed USB ULPI PHYs ...................................................................................................................... 18 5.7 MAC Address EEPROMs ............................................................................................................................. 18 5.8 Configuration EEPROM ............................................................................................................................. 19 5.9 Programmable Clock Generator .............................................................................................................. 19 5.10 Oscillators.................................................................................................................................................. 19 5.11 On-board LEDs .......................................................................................................................................... 20 6 Power and Power-on Sequence............................................................................................................... 21 6.1 Power Supply ............................................................................................................................................ 21 6.2 Power Consumption ................................................................................................................................. 21 6.3 Power Distribution Dependencies ........................................................................................................... 21 6.4 Power-On Sequence ................................................................................................................................. 22 6.5 Power Rails................................................................................................................................................ 23 Copyright 2018Trenz Electronic GmbH 2 of 32

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