Product Information

CHP1-100-6801-G-7-LF

CHP1-100-6801-G-7-LF electronic component of TT Electronics

Datasheet
Res Metal Glaze 2512 6.8K Ohm 2% 1W ±100ppm/°C Melf Pad SMD Automotive T/R

Manufacturer: TT Electronics
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

54: USD 0.1366 ea
Line Total: USD 7.38

2813 - Global Stock
Ships to you between
Mon. 20 May to Fri. 24 May
MOQ: 54  Multiples: 1
Pack Size: 1
Availability Price Quantity
2813 - WHS 1


Ships to you between Mon. 20 May to Fri. 24 May

MOQ : 1
Multiples : 1

Stock Image

CHP1-100-6801-G-7-LF
TT Electronics

1 : USD 0.1435

2813 - WHS 2


Ships to you between Mon. 20 May to Fri. 24 May

MOQ : 54
Multiples : 1

Stock Image

CHP1-100-6801-G-7-LF
TT Electronics

54 : USD 0.1366

     
Manufacturer
Product Category
Tolerance
Termination Style
Resistance Value Ohm
Maximum Voltage Rating V
Current Sensing
Power Rating W
Technology
Maximum Operating Temperature °C
Temperature Coefficient Ppm/°C
Temperature Range @ Derated Power °C
Fail Safe Fusible Resistor
Anti-Surge
Anti-Sulfurated
Case Size
Number Of Terminals
Packaging
Package Type
Package Shape
Package/Case
Product Diameter Mm
Product Length Mm
Mounting
LoadingGif

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Cylindrical High Power Surface Mount Metal Glaze CHP Metal Glaze CHP Series thick fi lm element fi red at 1000C Cylindrical High Power to solid ceramic Up to 2 watts TM Surface Mount Metal Glaze Up to 1000 volts TM Metal Glaze 0.2 ohm to 2.2 megohm range thick lm element red at 1000C RoHS-compliant version available to solid ceramic Up to 2 s w atts High 150C maximum operating temperature s Up to 1000 v olts temperature dielectric s 0.2 ohm to 2.2 megohm r ange High coating temperature s RoHS-compliant v ersion available dielectric Solder over coating s 150C maxim um operating temperature nickel barrier Solder over nickel barrier Electrical Data Indus- IRC try Size Maximum Working Maximum Resistance Product Tolerance TCR Type Foot- Code1 Power Rating Voltage Voltage Range (ohms) Category (%) (ppm/C) print 0.1 to 0.99 Low Range 1, 2, 5 100 CHP 1/8 1206 B & C 1/4W 70C 200 400 1.0 to 1.0 M Standard 1, 2, 5 50, 100 20 to 348K Tight Tolerance 0.25, 0.5 50, 100 0.1 to 0.99 Low Range 1, 2, 5 100 CHP 1/2 2010 D & E 1/2W 70C 300 600 1.0 to 348K Standard 1, 2, 5 50, 100 0.1 to 0.99 Low Range 1, 2, 5 100 CHP 1 2512 F 1W 70C 350 700 1.0 to 2.21M Standard 1, 2, 5 50, 100 20 to 348K Tight Tolerance 0.25, 0.5 50, 100 0.2 to 0.99 Low Range 1, 2, 5 100 2W 25C CHP 2 3610 H 500 1000 1.33W 70C 1.0 to 2.21M Standard 1, 2, 5 50, 100 See pages 2 & 3 for product dimensions, recommended solder pads, and standard packaging. Not to exceed P x R Consult factory for tighter TCR, tolerance, or resistance values. Environmental Data Characteristics Maximum Change Test Method Characteristics Maximum Change Test Method MIL-PRF-55342H, 4.8.3 Thermal Shock 0.25% +.01 Temperature Coef cient As speci ed MIL-R-55342H Par 3.16 (-55C + 125C) (MIL-STD-202, Method 107G: +150C / -65C) MIL-PRF-55342H, 4.8.5 Thermal Shock 0.5% + 0.01 ohm MIL-R-55342H Par 3.9 (-65C + 150C, 5 cycles) Low Temperature Operation 0.25% +.01 (-65C) Low Temperature Operation 0.25% + 0.01 ohm MIL-R-55342H Par 3.11 (-65C working voltage) 0.5% +.01 Short Time Overload MIL-PRF-55342H, 4.8.6 1% for R>100K 0.5% + 0.01 ohm MIL-R-55342H Par 3.12 Short Time Overload 1% for R>100K ohm 2.5 x P x R for 5 seconds MIL-PRF-55342H, 4.8.7 High Temperature Exposure 0.5% +.01 (150C x 100 Hours) High Temperature Exposure 0.5% + 0.01 ohm MIL-R-55342H Par 3.13 (-150C for 100 hours) Resistance to Bonding Exposure 0.25% +.01 MIL-PRF-55342H, 4.8.8.2 Resistance to Bonding 0.25% + 0.01 ohm MIL-R-55342H Par 3.14.2 (Re ow soldered to board at 260C for 10 seconds) MIL-PRF-55342H, 4.8.8.2 Moisture Resistance 0.5% +.01 (MIL-STD-202, Method 106G) Exposure 95% minimum coverage MIL-STD-202, Method 208 (245C for 5 seconds) MIL-PRF-55342H, 4.8.10 Temperature Coefficient As specified (MIL-STD-202, Method 304) Solderability 0.5% + 0.01 ohm MIL-R-55342H Par 3.18 (10 cycles, total 240 hours) MIL-PRF-55342H, 4.8.11 Life Test 1% +.01 Moisture Resistance 0.5% + 0.01 ohm MIL-R-55342H Par 3.15 (2000 hours at 70C intermittent) (MIL-STD-202, Method 108A: 2000 Hours 70C) MIL-PRF-55342H, 4.8.12 Life Test 1% + 0.01 ohm Solderability 95% minimum coverage 1200 gram push from underside of mounted chip for 60 seconds (MIL-STD-202, Method 208H) Terminal Adhesion Strength no mechanical damage 1% +.01 IRC defined 1% + 0.01 ohm Chip mounted in center of 90mm long board, de ected 1mm so as to Terminal Adhesion Strength (push) (no mechanical damage) 1200 gram push from underside of mounted device for 60 sec no mechanical damage exert pull on chip contacts for 5 seconds IRC-defined 1% +.01 General Note Terminal Adhesion Strength (flex) Device mounted in center of 90mm long board, deflected 1 mm to exert IRC reserves the right to make changes in product speci cation without notice or liability. (no mechanical damage) All information is subject to IRCs own data and is considered accurate at time of going to print. pull on contacts for 5 seconds A subsidiary of TT electronics plc IRC Wire and Film Technologies Division s 3OUTH 3TAPLES 3TREET s Or pus Christi TeXAS 53 Telephone: s F acsimile: s Website: www.irctt.com (0 3Er ies Issue March 3HEET OF General Note TT electronics reserves the right to make changes in product specification without notice or liability. All information is subject to TT electronics own data and is considered accurate at time of going to print. www.bitechnologies.com www.irctt.com www.welwyn-tt.com TT electronics plc 09.12Cylindrical High Power CHP Surface Mount Metal Glaze Cylindrical High Power CHP Series TM Surface Mount Metal Glaze Physical Data L C W Dimensions (Inches and (mm)) Industry IRC Type Size Code Footprint Actual Size L W C 0.128 0.007 0.057 0.006 0.020 0.010 CHP 1/8 B 1206 (3.25 0.18) (1.45 0.15) (0.51 0.25) 0.128 0.007 0.063 0.010 0.020 0.010 MRC 1/2 C 1206 (3.25 0.18) (1.60 0.25) (0.51 0.25) 0.079 (nom.) -0.006 / +0.011 0.200 0.010 0.030 0.010 CHP 1/2 D 2010 (2.01 (nom.) -0.15 / +0.28) (5.08 0.25) (0.761 0.25) 0.079 (nom.) -0.006 / +0.011 0.251 0.010 0.040 0.010 CHP 1 F 2512 (6.38 0.25) (1.02 0.25) (2.01 (nom.) -0.15 / +0.28) 0.367 0.010 0.105 (nom.) -0.006 / +0.011 0.050 0.010 CHP 2 H 3610 (2.67 (nom.) -0.15 / +0.28) (9.32 0.25) (1.27 0.25) Recommended Solder Pad Dimensions (Re ow): F C A A B E D Dimensions (Inches and mm)) Size Industry Code Footprint A B C D E F 0.076 0.093 0.058 0.098 0.032 0.211 B & C 1206 (1.93) (2.36) (1.47) (2.49) (0.81) (5.36) 0.111 0.126 0.096 0.152 0.040 0.318 D 2010 (2.82) (3.20) (2.44) (3.86) (1.02) (8.08) 0.170 0.160 0.072 0.132 0.044 0.412 E 2010 (4.32) (4.06) (1.83) (3.35) (1.12) (10.46) 0.121 0.126 0.127 0.183 0.040 0.369 F 2512 (3.07) (3.20) (3.23) (4.65) (1.02) (9.37) 0.170 0.160 0.213 0.273 0.044 0.553 H 3610 (4.32) (4.06) (5.41) (6.93) (1.12) (14.05) IRC Wire and Film Technologies Division Rs 3OUTH 3TAPLES 3TREET s O PUS HR ISTI TE XAS 53 T:ELEPHONE F s ACSIMILE: s WEBSITE: WWW IRCTT COM R (0 3E H C R A IES )SSUE - 3HEET OF General Note TT electronics reserves the right to make changes in product specification without notice or liability. All information is subject to TT electronics own data and is considered accurate at time of going to print. www.bitechnologies.com www.irctt.com www.welwyn-tt.com TT electronics plc 09.12

Tariff Desc

8532.24.00 43 no --Ceramic dielectric, multilayer Free

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