Resistors
Cylindrical High Power
Metal Glaze
thick film element
fired at 1000C
SurfCHPace Mount Metal Glaze
to solid ceramic
Cylindrical High Power
CHP Series
TM
Surface Mount Metal Glaze
Up to 2 watts
TM
Metal Glaze
Up to 1000 volts thick lm element
red at 1000C High
to solid ceramic
0.2 ohm to 2.2 megohm range temperature
Up to 2 watts
dielectric
RoHS-compliant version available
coating
Up to 1000 volts
150C maximum operating temperature
0.2 ohm to 2.2 megohm range Solder over
High
nickel barrier
temperature
RoHS-compliant version available
dielectric
coating
150C maximum operating temperature
Solder over
All Pb-free parts comply with EU Directive 2011/65/EU (RoHS2)
nickel barrier
Electrical Data
Indus-
IRC try Size Maximum Working Maximum Resistance Product Tolerance TCR
1
Type Foot- Code Power Rating Voltage Voltage Range (ohms) Category (%) (ppm/C)
print
0.1 to 0.99 Low Range 1, 2, 5 100
CHP 1/8 1206 B & C 1/4W @ 70C 200 400 1.0 to 1.0 M Standard 1, 2, 5 50, 100
20 to 348K Tight Tolerance 0.25, 0.5 50, 100
0.1 to 0.99 Low Range 1, 2, 5 100
CHP 1/2 2010 D & E 1/2W @ 70C 300 600
1.0 to 348K Standard 1, 2, 5 50, 100
0.1 to 0.99 Low Range 1, 2, 5 100
CHP 1 2512 F 1W @ 70C 350 700 1.0 to 2.21M Standard 1, 2, 5 50, 100
20 to 348K Tight Tolerance 0.25, 0.5 50, 100
0.2 to 0.99 Low Range 1, 2, 5 100
2W @ 25C
CHP 2 3610 H 500 1000
1.33W @ 70C
1.0 to 2.21M Standard 1, 2, 5 50, 100
See pages 2 & 3 for product dimensions, recommended solder pads, and standard packaging. Not to exceed P x R Con sult factory for tighter TCR, tolerance, or resistance values.
Environmental Data
Characteristics Maximum Change Test Method
Characteristics Maximum Change Test Method
MIL-PRF-55342H, 4.8.3
Thermal Shock 0.25% +.01
Temperature Coef cient As speci ed MIL-R-55342H (MIL-STD-202, Method 107G: +150C / -65C)Par 3.16 (-55C + 125C)
MIL-PRF-55342H, 4.8.5
Thermal Shock 0.5% + 0.01 ohm MIL-R-55342H Par 3.9 (-65C + 150C, 5 cycles)
Low Temperature Operation 0.25% +.01
(-65C)
Low Temperature Operation 0.25% + 0.01 ohm MIL-R-55342H Par 3.11 (-65C @ working voltage)
0.5% +.01
Short Time Overload MIL-PRF-55342H, 4.8.6
1% for R>100K
0.5% + 0.01 ohm MIL-R-55342H Par 3.12
Short Time Overload
MIL-PRF-55342H, 4.8.7
1% for R>100K ohm 2.5 x P x R for 5 seconds
High Temperature Exposure 0.5% +.01
(150C x 100 Hours)
High Temperature Exposure 0.5% + 0.01 ohm MIL-R-55342H Par 3.13 (-150C for 100 hours)
Resistance to Bonding Exposure 0.25% +.01 MIL-PRF-55342H, 4.8.8.2
Resistance to Bonding 0.25% + 0.01 ohm MIL-R-55342H MIL-PRF-55342H, 4.8.8.2Par 3.14.2 (Re ow soldered to board at 260C for 10 seconds)
Moisture Resistance 0.5% +.01
(MIL-STD-202, Method 106G)
Exposure 95% minimum coverage MIL-STD-202, Method 208 (245C for 5 seconds)
MIL-PRF-55342H, 4.8.10
Temperature Coefficient As specified
(MIL-STD-202, Method 304)
Solderability 0.5% + 0.01 ohm MIL-R-55342H Par 3.18 (10 cycles, total 240 hours)
MIL-PRF-55342H, 4.8.11
Life Test 1% +.01
(MIL-STD-202, Method 108A: 2000 Hours @ 70C)
Moisture Resistance 0.5% + 0.01 ohm MIL-R-55342H Par 3.15 (2000 hours at 70C intermittent)
MIL-PRF-55342H, 4.8.12
SolderabilityLife Test 1% + 0.01 ohm95% minimum coverage
1200 (MIL-STD-202, Method 208H)gram push from underside of mounted chip for 60 seconds
Terminal Adhesion Strength no mechanical damage
1% +.01 IRC defined
Terminal Adhesion Strength (push) 1% + 0.01 ohm Chip mounted in center of 90mm long board, de ected 1mm so as to
(no mechanical damage) 1200 gram push from underside of mounted device for 60 sec
no mechanical damage exert pull on chip contacts for 5 seconds
IRC-defined
1% +.01
General NoteTerminal Adhesion Strength (flex) Device mounted in center of 90mm long board, deflected 1 mm to exert
(no mechanical damage)
IRC reserves the right to make changes in product speci cation without notice or liability.
pull on contacts for 5 seconds
All information is subject to IRCs own data and is considered accurate at time of going to print.
A subsidiary of
TT electronics plc
IRC Wire and Film Technologies Division 4222 South Staples Street Corpus Christi Texas 78411 USA
General Note
Telephone: 361 992 7900 Facsimile: 361 992 3377 Website: www.irctt.com CHP Series Issue March 2011 Sheet 1 of 3
BI Technologies IRC Welwyn
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics own data and is considered accurate at time of going to print.
Cylindrical High Power
CHP
Surface Mount Metal Glaze
Cylindrical High Power
CHP Series
TM
Surface Mount Metal Glaze
Physical Data
L
C
W
Dimensions (Inches and (mm))
Industry
IRC Type Size Code Footprint Actual Size L W C
0.128 0.007 0.057 0.006 0.020 0.010
CHP 1/8 B 1206
(3.25 0.18) (1.45 0.15) (0.51 0.25)
0.079 (nom.) -0.006 / +0.011
0.200 0.010 0.030 0.010
CHP 1/2 D 2010
(2.01 (nom.) -0.15 / +0.28)
(5.08 0.25) (0.761 0.25)
0.079 (nom.) -0.006 / +0.011
0.251 0.010 0.040 0.010
CHP 1 F 2512
(6.38 0.25) (1.02 0.25)
(2.01 (nom.) -0.15 / +0.28)
0.105 (nom.) -0.006 / +0.011
0.367 0.010 0.050 0.010
CHP 2 H 3610
(9.32 0.25) (2.67 (nom.) -0.15 / +0.28) (1.27 0.25)
Recommended Solder Pad Dimensions (Re ow):
F
A C A
B
E
D
Dimensions (Inches and mm))
Size Industry
Code Footprint
ABC D E F
0.076 0.093 0.058 0.098 0.032 0.211
B & C 1206
(1.93) (2.36) (1.47) (2.49) (0.81) (5.36)
0.111 0.126 0.096 0.152 0.040 0.318
D 2010
(2.82) (3.20) (2.44) (3.86) (1.02) (8.08)
0.170 0.160 0.072 0.132 0.044 0.412
E 2010
(4.32) (4.06) (1.83) (3.35) (1.12) (10.46)
0.121 0.126 0.127 0.183 0.040 0.369
F 2512
(3.07) (3.20) (3.23) (4.65) (1.02) (9.37)
0.170 0.160 0.213 0.273 0.044 0.553
H 3610
(4.32) (4.06) (5.41) (6.93) (1.12) (14.05)
IRC Wire and Film Technologies Division 4222 South Staples Street Corpus Christi Texas 78411 USA
CHP Series Issue March 2011 Sheet 2 of 3
Telephone: 361 992 7900 Facsimile: 361 992 3377 Website: www.irctt.com
General Note
BI Technologies IRC Welwyn
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics own data and is considered accurate at time of going to print.