HTC-2512LF30K1F TT Electronics

High Temperature Thick Film Chip Resistors HTC Series Operation to 200C Excellent high temperature stability Improved working voltage ratings Pb-free wrap-around terminations Standard chip sizes available from 1206 to 2512 Electrical Data Characteristic 1206 2010 2512 1W to 10MW 1%, 5% Resistance Range 10W to 1MW 0.5%, 5%, 1% 150C Power Rating 200mW 500mW 750mW Max Voltage Rating 200V 400V 500V Absolute TCR 100ppm/C Operating Temperature -55C to +200C 1 2 2 2 Pad/Trace Area 80mm 200mm 300mm Termination Wrap-around Pb-free with leach resistant Ni barrier 1 Note : Recommended minimum pad and adjacent trace area for each termination for rated power on FR4 PCB. Environmental Data Specification Test Method 2 Maximum Typical MIL-STD-202 Method 108 Load Life 1.00% 0.25% (Rated Power for 1000hrs 150C) High Temperature Exposure 1000 hours 200C 1.00% 0.20% MIL-PRF-55342H Short Time Overload 1.00% 0.10% (6.25X rated power for 5secs) Moisture Resistance MIL-STD-202 Method 106G 1.00% 0.25% Thermal Shock MIL-STD-202 Method 107G Condition B 0.25% 0.05% Resistance to Soldering Heat MIL-STD-202 Method 210F 0.25% 0.05% MIL-STD-202 Method 208 Solderability >95% Coverage (245C, 5 seconds) 2 Note : 0.01W added for all resistance values <10W. General Note IRC reserves the right to make changes in product specification without notice or liability. All information is subject to IRCs own data and is considered accurate at time of going to print. A subsidiary of TTelectronics plc Advanced Film Division 4222 South Staples Street Corpus Christi Texas 78411 USA Telephone: 361 992 7900 Facsimile: 361 992 3377 Website: www.irctt.com HTC Series Issue July 2009High Temperature Thick Film Chip Resistors Physical Data L Protective Overcoat Overglaze (Stability Enhancer) C Sn Plating A Ni Barrier Layer W High Reliability Resistance Element T B Alumina Substrate Conductor Part Type L (mm) W (mm) T max (mm) A (mm) B min (mm) C (mm) Weight (grams) 1206 3.20.4 1.60.2 0.7 0.40.15 0.40.2 1.7 0.020 2010 5.10.3 2.50.2 0.8 0.60.25 0.60.3 3.0 0.036 2512 6.50.3 3.20.2 0.8 0.60.25 0.60.3 4.4 0.055 Construction: Thick film resistor material, overglaze and organic protection are screen printed on a 96% alumina substrate. Wrap-around terminations have an electroplated Ni barrier and pure Sn matte finish, ensuring excellent leach resistance properties and solderability. Marking: Components are not marked. Reels are marked with type, value, tolerance, date code and quantity. Solvent resistance: The body protection is resistant to all normal industrial cleaning solvents suitable for printed circuits. Power Derating Data Ordering Data Prefix TKC - HTC - 2512LF - 100R - F 100 Chip Type HTC (High Temperature Chip) Chip Size and Termination 1206LF = 100% Tin (pb-free) termination 2010LF = 100% Tin (pb-free) termination 50 2512LF = 100% Tin (pb-free) termination Resistance Value (4 Digit Code) Ex. 1R00 = 1W 100R = 100W 10K0 =10KW 1M50 = 1.5MW 10 Tolerance Code J = 5% F = 1% D = 0.5% 150 200 For additional information or to discuss your specific requirements, Temperature in C please contact our Applications Team using the contact details below. Advanced Film Division 4222 South Staples Street Corpus Christi Texas 78411 USA Telephone: 361 992 7900 Facsimile: 361 992 3377 Website: www.irctt.com HTC Series Issue July 2009 % Of Rated Power