LRLRCC 1206 0.5 w 1206 0.25 wattatt LRC 2010 0.5 wattLRC 2010 1 watt LRC 2512 1 wLRC 2512 2 wattatt i o J i o c b K = = NOLOPLMQ= = NMWMT= j = = m~= N i o J i o c b K = = NOLOPLMQ= = NMWMT= j = = m~= N i o J i o c b K = = NOLOPLMQ= = NMWMT= j = = m~= N Low Value Flat Low Value Flat Low Value Flat Welwyn Components Chip Resistor Low Value Flat Welwyn Components Chip Resistor Chip Resistor Welwyn Components Chip Resistor LRC/LRF Series LRC/LRF Series Standard 2512, 2010 and 1206 sizes LRC/LRF Series Standard 2512, 2010 and 1206 sizes Resistance values down to 0.003 ohms LRC/LRF Series Standard 2512, 2010 and 1206 sizes Resistance values down to 0.003 ohms Leach resistant solder-plated copper StandardResistance 2512, 2010 values and 1206down sizes to 0.003 ohms Leach resistant solder-plated copper wrap-around termination Resistance Leach values resistant down solde to 0.003r-plated ohms copper wrap-around termination Low inductance - less than 0.2nH wrap-around termination Leach resistant solder-plated copper AEC-Q200 Qualified wrap-aroundLow inductancetermination - less than 0.2nH AEC-Q200 Qualified RoHS compliant and SnPb variants Low inductance - less than 0.2nH AEC-Q200 Qualified AEC-Q200 Qualified Electrical Data Electrical Data LR1206 LR2010 LR2512 LR1206 LR2010 LR2512 Electrical Data Power rating 70C watts 0.5 1 2 LR1206 LR2010 LR2512 Power rating at 70C watts 0.5 1.0 1.5/2.0* 1 Resistance range ohms R003 to 1R0 Power rating at 70C watts 0.5 1.0 1.5/2.0* LR1206 LR2010 LR2512 Resistance range ohms 0R010 to 1R 0R003 to 1R 0R003 to 1R 1 Resistance tolerance % <R01: 5, R01: 1, 2, 5 Power rating Rate s7is0taCnce range watts ohms 0.5 0R010 to 1R 1.00R003 to 1R 1.5/02R.00*03 to 1R Dielectric withstanding voltage volts 200 200 200 R05: 100, R025R047: <+200, R015-R024: <+300, TCRResistance ranDgieelectric withstanding voltage ppm/C ohms vo0ltRs010 to 1R200 0R003 to 1R200 0R003 to 120R0 R01-R014: <+500, <R01: <+900 TCR ppm/C 100 (Contact factory for value below 0.050 ohms) Dielectric withTsCtaRnding voltage volts ppm/C 200 100 (Contact 2fa0c0tory for value below 02.00500 ohms) Dielectric withstand volts 200 Resistance tolerance % R005 5%, >R005 1, 2, 5% TCR ppm/C 100 (Contact factory for value below 0.050 ohms) Resistance tolerance % R005 5%, >R005 1, 2, 5% Ambient temperature range C -55 to +150 Temperature rise at rated power C 40 80 90 2 Resistance tolTeermanpceerature rise at rated power % C 40R005 5%, >R005 1,80 2, 5% 90 Values E24 preferred 2 Pad and trace area for max power rating 70C mm 30 30 100 2 Temperature rise at rated power C 40 80 90 Temperature rise aPadt r andated po tracew aerrea for max power rating C 70C 40 mm 30 80 30 90 100 2 3 2 2 Pad / trPad andace ar traceea area for max power rating 70C mm mm30 2 30 100 30 300 100 *2 Watts with total solder pad and trace size of 300 mm *2 Watts with total solder pad and trace size of 300 mm 2 Note 1: Contact factory for value tolerance combinations outside this range. Note 2: Many values = N x R001 and N x R005 up to N=10 are also *2 Watts with total solder pad and trace size of 300 mm available. Note 3: Recommended minimum pad & adjacent trace area for each termination for rated dissipation on FR4 PCB Physical Data Physical Data Physical Data Dimensions (mm)Dimensions (mm) Dimensions (mm) Size Size L L W W H (max) H (max) D D Size L W H (max) D LR1206 3.200.305 1.630.20 0.8 0.480.25 LR1206 3.200.305 1.630.20 0.8 0.480.25 LR1206 3.200.305 1.630.20 0.8 0.480.25 LR2010 5.230.38 2.640.25 0.84 0.480.25 LR2010 5.230.38 2.640.25 0.84 0.480.25 LR2010 5.230.38 2.640.25 0.84 0.480.25 LR2512 6.500.38 3.250.25 0.84 0.480.25 6.500.38 3.250.25 LR2512 0.84 0.480.25 LR2512 6.500.38 3.250.25 0.84 0.480.25 LR 1206 / 2010 / 2512 LR 1206 / 2010 / 2512 LR 1206 / 2010 / 2512 W i o J i o c b K = = NOLOPLMQ= = NMWMT= j = = m~= O L W L W L H H H D Low Value Flat Solder Plating D D Solder Plating Solder Plating Nickel Barrier Layer Protective Overcoat Chip Resistor Nickel Barrier Layer Nickel Barrier Layer Protective Overcoat Copper Wraparound Protective OvercoatResistive Element Copper Wraparound Termination Resistive Element Copper Wraparound Welwyn Components Copper Termination Resistive Element LRC/LRF Series Termination Alumina Substrate Copper Termination Termination Copper Termination Alumina Substrate Alumina Substrate Recommended Solder Pad Dimensions (mm) A A B C LR1206 2.0 4.0 1.25 B LR2010 3.05 6.5 1.5 C General Note General Note LR2512 3.7 7.75 1.5 Welwyn Components reserves the right to make changes in product specification without notice or liability. Welwyn Components reserves the right to make changes in product specification without notice or liability. All information is subject to Welwyns own data and is considered accurate at time of going to print. A subsidiary of General Note All information is subject to Welwyns own data and is considered accurate at time of going to print. A subsidiary of TT electronics plc Welwyn Components reserves the right to make changes in product specification without notice or liability. TT electronics plc Welwyn Components Limited Bedlington, Northumberland NE22 7AA, UK All information is subject to Welwyns own data and is considered accurate at time of going to print. A subsidiary of Welwyn Components Limited Bedlington, Northumberland NE22 7AA, UK (%) Telephone: +44 (0) 1670 822181 Facsimile: +44 (0) 1670 829465 Email: info welwyn-tt.com Website: www.welwyn-tt.com 04.10 Telephone: +44 (0) 1670 822181 Facsimile: +44 (0) 1670 829465 Email: info welwyn-tt.com Website: www.welwyn-tt.com TT electronics04.10 plc AEC-Q200 Table 7 General Note Max. Typ. 100 Welwyn Components Limited Bedlington,Method Northumberland NE22 7AA, UK (add R05) ( 1R0) TT electronics reserves the right to make changes in product specification without notice or liability. 23 ref Test Telephone: +44 (0) 1670 822181 Facsimile: +44 (0) 1670 829465 Email: info welwyn-tt.com Website: www.welwyn-tt.com 04.10 23 80 All information is subject to TT electr3 High Temp. Exposuonics own data and is considerre MIL-STD-202 Method 108ed accurate at time of going to print.R% 0.5 0.2 www.bitechnologies.com www.irctt.com www.welwyn-tt.com 23 4 Temperature Cycling JESD22 Method JA-104 R% 0.25 0.1 60 TT electronics plc 6 Moisture Resistance MIL-STD-202 Method 106 R% 0.5 0.2 2.14 40 7 Biased Humidity MIL-STD-202 Method 103 R% 0.5 0.2 8 Operational Life (Cyclic Load) MIL-STD-202 Method 108 R% 1 0.5 20 14 Vibration MIL-STD-202 Method 204 R% 0.5 0.05 0 70 150 (C) 25 15 Resistance to Soldering Heat MIL-STD-202 Method 210 R% 0.25 0.05 Ambient temperature 16 Thermal Shock MIL-STD-202 Method 107 R% 0.25 0.1 18 Solderability J-STD-002 >95% coverage 21 Board Flex AEC-Q200-005 R% 0.5 0.2 22 Terminal Strength AEC-Q200-006 R% 0.25 0.1 Short Term Overload 6.25 x Pr for 2s R% 0.5 Low Temperature Storage -65C for 100 hours 0.5 R% Leach Resistance Solder dip at 250C 90s minimum Note: 1. Although 2010 and 2512 sizes have passed temperature cycling and thermal shock, it is in general not recommended that ceramic chips this large be used on FR4 in a severe temperature cycle environment due to the possibility of solder joint fatigue. 2. Full AEC-Q200 qualification applies to ohmic values R01. Ordering Procedure Example: LRF2512 at 10 milliohms (hence flip-chip mounted) and 2% tolerance on a reel of 1800 pieces L R F 2 5 1 2 R 0 1 G W Type Mounting Conventional (element up) Values > R025 F Flip-chip (element down) Values < R025 Size Value (use IEC62 code) Tolerance (use IEC62 code) F 1% G 2% J 5% Packing 1206 or 2010 3000/reel W Standard Tape 2512 1800/reel T1 All sizes 1000/reel Welwyn Components Limited Bedlington, Northumberland NE22 7AA, UK Telephone: +44 (0) 1670 822181 Facsimile: +44 (0) 1670 829465 Email: info welwyn-tt.com Website: www.welwyn-tt.com 04.10 Power RatingLRLRCC 1206 0.5 w 1206 0.25 wattatt LRC 2010 1 wLRC 2010 0.5 wattatt LRC 2512 1 wLRC 2512 2 wattatt i o J i o c b K = = NOLOPLMQ= = NMWMT= j = = m~= O Low Value Flat Chip Resistor Welwyn Components LRC/LRF Series Recommended Solder Pad Dimensions (mm) A A B C LR1206 2.0 4.0 1.25 Low Value Flat B LR2010 3.05 6.5 1.5 Chip Resistor C LRC/LRF Series LR2512 3.7 7.75 1.5 (%) AEC-Q200 Table 7 Max. Typ. 100 Method (add R05) ( 1R0) ref Test 80 3 High Temp. Exposure MIL-STD-202 Method 108 R% 0.5 0.2 4 Temperature Cycling JESD22 Method JA-104 R% 0.25 0.1 60 6 Moisture Resistance MIL-STD-202 Method 106 R% 0.5 0.2 40 7 Biased Humidity MIL-STD-202 Method 103 R% 0.5 0.2 8 Operational Life (Cyclic Load) MIL-STD-202 Method 108 R% 1 0.5 20 14 Vibration MIL-STD-202 Method 204 R% 0.5 0.05 0 70 150 (C) 25 15 Resistance to Soldering Heat MIL-STD-202 Method 210 R% 0.25 0.05 Ambient temperature 16 Thermal Shock MIL-STD-202 Method 107 R% 0.25 0.1 18 Solderability J-STD-002 >95% coverage 21 Board Flex AEC-Q200-005 R% 0.5 0.2 22 Terminal Strength AEC-Q200-006 R% 0.25 0.1 Short Term Overload 6.25 x Pr for 2s R% 0.5 Low Temperature Storage -65C for 100 hours R% 0.5 Leach Resistance Solder dip at 250C 90s minimum Note: 1. Although 2010 and 2512 sizes have passed temperature cycling and thermal shock, it is in general not recommended that ceramic chips this large be used on FR4 in a severe temperature cycle environment due to the possibility of solder joint fatigue. 2. Full AEC-Q200 qualification applies to ohmic values R01. Ordering Procedure Ordering Procedure Example: LRF2512 at 10 milliohms (hence flip-chip mounted) and 2% tolerance on a reel of 1800 pieces This product has two valid part numbers: L R F 2 5 1 2 R 0 1 G W ETuyrpope ean (Welwyn) Part Number: LRF1206-R02FW (1206, 20 milliohms 1%, Pb-free) Mounting L R F 1 2 0 6 - R 0 2 F W Conventional (element up) Values > R025 1 2 3 4 5 F Flip-chip (element down) Values < R025 Size 1 2 3 4 5 Value (use IEC62 code) Type Size Value Tolerance Termination & Packing Tolerance (use IEC62 code) F 1%L R = Conventional orientation 1206 F = 1% W Pb-free, standard packing E24 = 3/4 G 2% (values >R025) 2010 characters G = 2% T1 Pb-free, 1000/reel (non-standard) J 5% R = ohms 2512 J = 5% PB SnPb finish, standard packing LRF = Flip-chip orientation (values R025) Standard packing is tape & reel Packing 1206 & 2010 3000/reel 1206 or 2010 3000/reel W Standard 2512 1800/reel Tape 2512 1800/reel T1 All sizes 1000/reel USA (IRC) Part Number: LRC-LRF1206LF-01-R020-F (1206, 20 milliohms 1%, Pb-free) L R C - L R F 1 2 0 6 L F - 0 1 - R 0 2 0 - F Welwyn Components Limited Bedlington, Northumberland NE22 7AA, UK Telephone: +44 (0) 1670 822181 Facsimile: +44 (0) 1670 829465 Email: info welwyn-tt.com Website: www.welwyn-tt.com 04.10 1 2 3 4 5 6 7 1 2 3 4 5 6 7 Family Model Size Termination TCR Value Tolerance Packing LRC 1206 Omit for SnPb F = 1% LR = Conventional orientation 01 = standard 4 characters Standard packing is (values >R025) R = ohms tape & reel 2010 LF = Pb-free (100ppm/C G = 2% values R05) LRF = Flip-chip orientation 2512 J = 5% 1206 & 2010 3000/reel (values R025) 2512 1800/reel General Note TT electronics reserves the right to make changes in product specification without notice or liability. All information is subject to TT electronics own data and is considered accurate at time of going to print. www.bitechnologies.com www.irctt.com www.welwyn-tt.com Electrical Data TT electronics plc 2.14 LR1206 LR2010 LR2512 Power rati ng 70C watt s 0.5 1 2 1 Resistance range ohms R003 to 1R0 1 Resistance tolerance % <R01: 5, R01: 1, 2, 5 R05: 100, R025R047: <+200, R015-R024: <+300, TCR ppm/C R01-R014: <+500, <R01: <+900 Dielectric withstand volts 200 Ambient temperature range C -55 to +150 2 Values E24 preferred Temperature rise at rated power C 40 80 90 3 2 Pad / trace area mm 30 100 300 Note 1: Contact factory for value tolerance combinati ons outside this range. Note 2: Many values = N x R001 and N x R005 up to N=10 are also available. Note 3: Recommended minimum pad & adjacent trace area for each termination for rated dissipati on on FR4 PCB Power Rating