LRZ2512-R000 TT Electronics

Resistors Resistors High Current Jumper Chip High Current Jumper Chip Welwyn Components High Current Jumper Chip LRZ Series LRZ Series LRZ Series High current zero-Ohm link High current zero-Ohm link High current zero-Ohm link Thick copper technology Thick film copper technolog y Thick film copper technology Current to 35A Current rating to 35A Typical resistance 1.5m Current rating to 35A Typical resistance 1.5m Inductance below 0.2nH Induc tance below 0.2nH Typical resistance 1.5m AEC-Q200 AEC-Q200 Qualified Inductance below 0.2nH RoHS compliant and SnPb variants RoHS compliant and SnPb variants AEC-Q200 Qualified All Pb-free parts comply with EU 2011/65/EU (RoHS2) AllAll Pb-Pb-frfreeee partsparts ccomplyomply withwith EUEU DirDirectivectivee 2011/65/EU2011/65/EU amended amended b yb y(EU) (EU) 2015/863 2015/863 (R (RoHS3)oHS3) Electrical Data Size 0603 0805 1206 2010 2512 Notes Current rating 70 C amps 6 15 20 30 35 DC or AC rms 2 second overload current 25C amps 12 30 40 60 70 Residual resistance o hms 0.003 max. 0.0015 typ. Ambient temperature range C -55 to +150 Dielectric withstand voltage volts 200 Temperature rise at rated current C 15 30 40 80 90 2 40 40 50 100 300 Pad & trace area for rated current mm See Application Notes Physical Data Dimensions (mm) & Weight (g) L W T A C Wt C C 0603 1.6 0.3 0.8 0.2 0.5 0.1 0.3 0.15 0.25 0.15 0.003 T A 0805 2.0 0.3 1.25 0.2 0.61 0.1 0.3 0.15 0.3 0.1 0.009 L W A 1206 3.20 0.31 1.63 0.2 0.61 0.1 0.48 0.25 0.48 0.25 0.020 Wrap-around terminations (3 faces) 2010 5.23 0.38 2.64 0.25 0.74 0.1 0.48 0.25 0.48 0.25 0.036 2512 6.5 0.38 3.25 0.25 0.74 0.1 0.48 0.25 0.48 0.25 0.055 Construction A thick film copper conductive element and organic withstand immersion in solder at 260C for 30 seconds and protection are screen printed on a 96% alumina substrate. are suitable for reflow or wave soldering processes. Parts supplied under USA part numbering have the conductive element on the underside whilst those supplied under Marking European numbering have it on the upper side. These two The body protection is resistant to all normal cleaning solvents formats are functionally identical and interchangeable, and suitable for printed circuits 1206 and larger size chips are marked marking is always on the upper surface. R000. 0603 and 0805 sizes are not marked. Terminations The wrap-around copper terminations have an electroplated nickel barrier and solderable coating, which ensures excellent leach resistance properties and solderability. Chips can General Note General Note General Note BI Technologies IRC Welwyn BI Technologies IRC Welwyn Welwyn Components reserves the right to make changes in product specification without notice or liability. TT Electronics reserves the right to make changes in product specification without notice or liability. All information is subject to Welwyns own data and is considered accurate at time of going to print. A subsidiary of All information is subject to TT Electronics own data and is considered accurate at time of going to print. All information is subject to TT Electronics own data and is considered accurate at time of going to print. www.ttelectronics.com/resistors TT electronics plc www.ttelectronics.com/resistors Welwyn Components Limited Bedlington, Northumberland NE22 7AA, UK TT Electronics plc TT Electronics plc Telephone: +44 (0) 1670 822181 Facsimile: +44 (0) 1670 829465 Email: info welwyn-tt.com Website: www.welwyn-tt.com 04.10 11.17 04.20 29i o w K = = OLNSLMR= =PWQV=mj = = m~= O High Current High Current Jumper Chip High Current Jumper Chip Jumper Chip LRZ Series LRZ Series LRZ Series Welwyn Components AEC-Q200 Table 7 Method Result ref Test 3 High Temp. Exposure MIL-STD-202 Method 108 Pass (see note 1) 4 Temperature Cycling JESD22 Method JA-104 Pass (see note 1) 6 Moisture Resistance MIL-STD-202 Method 106 Pass (see note 1) 7 Biased Humidity MIL-STD-202 Method 103 Pass (see note 1) 8 Operational Life (Cyclic Load) MIL-STD-202 Method 108 Pass (see note 1) 14 Vibration MIL-STD-202 Method 204 Pass (see note 1) 15 Resistance to Soldering Heat MIL-STD-202 Method 210 Pass (see note 1) 16 Thermal Shock MIL-STD-202 Method 107 Pass (see note 1) 18 Solderability J-STD-002 >95% coverage 21 Board Flex AEC-Q200-005 Pass (see note 1) 22 Terminal Strength AEC-Q200-006 Pass (see note 1) Leach Resistance Solder dip at 250C 90s minimum Notes: 1. AEC quali cation based on testing of structurally similar LRF Series low value chip resistors, of which LRZ is the zero-ohm version. R measurements are not applicable to the zero-ohm version. 2. Although 2010 and 2512 sizes have passed temperature cycling and thermal shock, it is in general not recommended that ceramic chips this large be used on FR4 in a severe temperature cycle environment due to the possibility of solder joint fatigue. 3. Full AEC-Q200 quali cation applies to sizes 0603, 1206, 2010 and 2512 Temperature Derating Derating Characteristic 120% 100% 80% 60% 40% 20% 0% 0 50 100 150 Ambient Temperature (C) Pulse Performance Continuous Pulse Performance 1000 LRZ1206 100 LRZ2010 LRZ2512 10 0.1 1 10 100 1000 Pulse Duration (ms) Welwyn Components Limited Bedlington, Northumberland NE22 7AA, UK GenerTelephone:al Not +44e (0) 1670 822181 Facsimile: +44 (0) 1670 829465 Email: info welwyn-tt.com Website: www.welwyn-tt.com 04.10 BI Technologies IRC Welwyn General Note TT Electronics reserves the right to make changes in product specification without notice or liability. BI Technologies IRC Welwyn TT Electronics reserves the right to make changes in product specification without notice or liability. All information is subject to TT Electronics own data and is considered accurate at time of going to print. www.ttelectronics.com/resistors All information is subject to TT Electronics own data and is considered accurate at time of going to print. www.ttelectronics.com/resistors TT Electronics plc TT Electronics plc 11.17 04.20 Peak Current (A) Proportion of Rated Current