Flameproof Power
Welwyn Components
Metal Film Resistors
Flameproof Power
Resistors
Welwyn Components
Metal Film Resistors
MFP Series
Flameproof Power
Smallest size for power rating
Metal Film Resistors
MFP Series
Resistance range 0.1 ohms to 1M ohms
Smallest size for power rating
MFP Series
Flameproof protection
Resistance range 0.1 ohms to 1M ohms
Small est size for power rating
Flameproof protection
Resistance range 0.1 ohms to 1M ohms
Flameproof protection
Surface mount ZI-form option
All parts are Pb-free and comply with EU Directive 2011/65/EU (RoHS2)
Electrical Data
Electrical Data
MFP1 MFP2
Power rating at 70C watts <1 : 0.7 >=1 : 1.0 2
Resistance range ohms 0R1 1M 1R0 1M
MFP1 MFP2
Limiting element voltage volts 350
Power rating at 70C watts <1 : 0.7 >=1 : 1.0 2
TCR ppm/C < 1 : 300 1 - 9.1 : 200 10 : 50 100
Resistance range ohms 0R1 1M 1R0 1M
Resistance tolerance % 1, 2, 5
Standard values E24 preferred
Limiting element voltage volts 350
Thermal impedance C/watt 120 82
TCR ppm/C < 1 : 300 1 - 9.1 : 200 10 : 50 100
Ambient temperature range C -55 to 155
Resistance tolerance % 1, 2, 5
Standard values E24 preferred
Physical Data
Thermal impedance C/watt 120 82
Ambient temperaturDimensions e range (mm) & Weight (g) C -55 to 155
PCB Min.
mounting bend
Type L Max D Max f min d nom centres radius Wt.nom
d
D
MFP1 6.2 2.5 21.0 0.6 10.2 0.6 0.3 L
f
Physical Data
MFP2 10.0 4.0 27.0 0.8 18.4 1.2 0.55
Construction Marking
Dimensions (mm) & Weight (g)
The resistance element is a precisely controlled thin film of Resistors are colour coded with 4 or 5 bands depending on
PCB Min.
metal alloy on a high purity ceramic core, protected by a value and tolerance. IEC 62 colours are used.
cement coating applied so that terminations rmountingemain bend
completely clear. This permits a well defined body length Solvent Resistance
Type L Max D Max f min d nom centres radius Wt.nom
d
(clean lead to clean lead dimension L). The body protection and marking are resistant to all normal
D
MFP1 6.2 2.5 21.0 0.6 10.2 0.6 0.3 L
industrial cleaning solvents suitable for printed circuits. f
Terminations
MFP2 10.0 4.0 27.0 0.8 18.4 1.2 0.55
Material Solder-coated copper wire. Flammability
The resistor coating will not burn or emit incandescent
Strength The terminations meet the requirements of
particles under any condition of applied temperature or
Construction Marking
IEC 68.2.21
power overload.
The resistance element is a precisely controlled thin film of Resistors are colour coded with 4 or 5 bands depending on
Solderability The terminations meet the requirements of
IEC 115-1, Clause 4.17.3.2
metal alloy on a high purity ceramic core, protected by a value and tolerance. IEC 62 colours are used.
cement coating applied so that terminations remain
General Note
completely clear. This permits a well defined body length Solvent Resistance
General Note
Welwyn Components reserves the right to make changes in product specification without notice or liability.
BI Technologies IRC Welwyn
All information is subject to Welwyns own data and is considered accurate at time of going to print. A subsidiary of
TT Electronics reserves the right to make changes in product specification without notice or liability.
(clean lead to clean lead dimension L). The body protection and marking are resistant to all normal
TT electronics plc
All information is subject to TT Electronics own data and is considered accurate at time of going to print.
Welwyn Components Limited Bedlington, Northumberland NE22 7AA, UK Flameproof Power
Flameproof Power
Metal Film Resistors
Metal Film Resistors
MFP Series
Welwyn Components
MFP Series
Performance Data
Maximum
Load at rated power : 1000 hours at 70C R % 5
Shelf life : 12 months at room temperature R % 2
Derating from rated power at 70C R % zero at 155C
Climatic R % 3
Climatic category 50/155/56
Temperature rapid change R % 0.5
Resistance to solder heat R % 0.5
Voltage proof volts 500 min
Packaging
Application Notes
MFP resistors are normally supplied tape packed ready for
1. If the resistors are to dissipate full rated power, it is
loading onto automatic sequencing and insertion machines.
recommended that the terminations should not be
soldered closer than 4mm from the body.
The standard taping method and critical dimensions are
shown in Figure 1.
2. Due to operating temperature limitations imposed by some
pcb materials, derating may be necessary. An estimate of
Component wires will not protrude beyond the outside edge
the temperature rise to be expected can be calculated
of the tapes.
using the thermal impedance figures given under Electrical
Data.
Alternative packaging available by request.
3. These products are also available in a range of lead forming
options. In particular, MFP2 is available in ZI-form SMD
format packed in blister tape - see: