Flameproof Power Welwyn Components Metal Film Resistors Flameproof Power Resistors Welwyn Components Metal Film Resistors MFP Series Flameproof Power Smallest size for power rating Metal Film Resistors MFP Series Resistance range 0.1 ohms to 1M ohms Smallest size for power rating MFP Series Flameproof protection Resistance range 0.1 ohms to 1M ohms Small est size for power rating Flameproof protection Resistance range 0.1 ohms to 1M ohms Flameproof protection Surface mount ZI-form option All parts are Pb-free and comply with EU Directive 2011/65/EU (RoHS2) Electrical Data Electrical Data MFP1 MFP2 Power rating at 70C watts <1 : 0.7 >=1 : 1.0 2 Resistance range ohms 0R1 1M 1R0 1M MFP1 MFP2 Limiting element voltage volts 350 Power rating at 70C watts <1 : 0.7 >=1 : 1.0 2 TCR ppm/C < 1 : 300 1 - 9.1 : 200 10 : 50 100 Resistance range ohms 0R1 1M 1R0 1M Resistance tolerance % 1, 2, 5 Standard values E24 preferred Limiting element voltage volts 350 Thermal impedance C/watt 120 82 TCR ppm/C < 1 : 300 1 - 9.1 : 200 10 : 50 100 Ambient temperature range C -55 to 155 Resistance tolerance % 1, 2, 5 Standard values E24 preferred Physical Data Thermal impedance C/watt 120 82 Ambient temperaturDimensions e range (mm) & Weight (g) C -55 to 155 PCB Min. mounting bend Type L Max D Max f min d nom centres radius Wt.nom d D MFP1 6.2 2.5 21.0 0.6 10.2 0.6 0.3 L f Physical Data MFP2 10.0 4.0 27.0 0.8 18.4 1.2 0.55 Construction Marking Dimensions (mm) & Weight (g) The resistance element is a precisely controlled thin film of Resistors are colour coded with 4 or 5 bands depending on PCB Min. metal alloy on a high purity ceramic core, protected by a value and tolerance. IEC 62 colours are used. cement coating applied so that terminations rmountingemain bend completely clear. This permits a well defined body length Solvent Resistance Type L Max D Max f min d nom centres radius Wt.nom d (clean lead to clean lead dimension L). The body protection and marking are resistant to all normal D MFP1 6.2 2.5 21.0 0.6 10.2 0.6 0.3 L industrial cleaning solvents suitable for printed circuits. f Terminations MFP2 10.0 4.0 27.0 0.8 18.4 1.2 0.55 Material Solder-coated copper wire. Flammability The resistor coating will not burn or emit incandescent Strength The terminations meet the requirements of particles under any condition of applied temperature or Construction Marking IEC 68.2.21 power overload. The resistance element is a precisely controlled thin film of Resistors are colour coded with 4 or 5 bands depending on Solderability The terminations meet the requirements of IEC 115-1, Clause 4.17.3.2 metal alloy on a high purity ceramic core, protected by a value and tolerance. IEC 62 colours are used. cement coating applied so that terminations remain General Note completely clear. This permits a well defined body length Solvent Resistance General Note Welwyn Components reserves the right to make changes in product specification without notice or liability. BI Technologies IRC Welwyn All information is subject to Welwyns own data and is considered accurate at time of going to print. A subsidiary of TT Electronics reserves the right to make changes in product specification without notice or liability. (clean lead to clean lead dimension L). The body protection and marking are resistant to all normal TT electronics plc All information is subject to TT Electronics own data and is considered accurate at time of going to print. Welwyn Components Limited Bedlington, Northumberland NE22 7AA, UK Flameproof Power Flameproof Power Metal Film Resistors Metal Film Resistors MFP Series Welwyn Components MFP Series Performance Data Maximum Load at rated power : 1000 hours at 70C R % 5 Shelf life : 12 months at room temperature R % 2 Derating from rated power at 70C R % zero at 155C Climatic R % 3 Climatic category 50/155/56 Temperature rapid change R % 0.5 Resistance to solder heat R % 0.5 Voltage proof volts 500 min Packaging Application Notes MFP resistors are normally supplied tape packed ready for 1. If the resistors are to dissipate full rated power, it is loading onto automatic sequencing and insertion machines. recommended that the terminations should not be soldered closer than 4mm from the body. The standard taping method and critical dimensions are shown in Figure 1. 2. Due to operating temperature limitations imposed by some pcb materials, derating may be necessary. An estimate of Component wires will not protrude beyond the outside edge the temperature rise to be expected can be calculated of the tapes. using the thermal impedance figures given under Electrical Data. Alternative packaging available by request. 3. These products are also available in a range of lead forming options. In particular, MFP2 is available in ZI-form SMD format packed in blister tape - see: