OPB943W55Z TT Electronics

L Package Choice of aperture size Choice of output configurations Choice of opaque or IR transmissive shell Choice of pins (L) or wires (W) W Package 0.125 (3.18 mm) slot width 0.320 (8.128 mm) lead spacing for PCBoard (side mounting) Data rates to 250 kBaud The OPB930 and OPB940 series of Photologic photo integrated circuit switches provide optimum flexibility for the design engineer. Building from a standard housing with a 0.125 (3.18 mm) wide slot, a user can specify the type and polarity of TTL output, discrete shell material, aperture width and either 0.350 (8.9 mm) long pins (L Series) or 24 (610 mm) AWG, UL listed wire leads (W Series). All housings are made from an opaque grade of injection -molded plastic that minimizes the assemblys sensitivity to both visible and near-infrared ambient radiation. Discrete shells (exposed on the parallel faces inside the device throat) are either IR transmissive plastic (for applications where aperture contamination may occur) or opaque plastic (for maximum protection against ambient light). Electrical output can be specified as either TTL Totem Pole or TTL Open Collector, either of which can be supplied with bueff r or inverter output polarity. All devices have the added stability of a built -in hysteresis amplifier. Custom electrical, wire and cabling and connectors are available. Contact your local representative or OPTEK for more information. Mechanical switch replacement Speed indication (tachometer) Mechanical limit indication Edge sensing Part Number Guide OPB930 and OPB940 Series OPB 9 X X X X X ZFor W series only Optek Assembly Sensor Aperture: 1 0.010 (2.54 mm) 5 0.050 (12.70 mm) Photologic Photo Integrated Emitter Aperture: Circuit Sensor Family 5 0.050 (12.70 mm) Discrete Shell Material: Mounting configurations: 3 Side mount IR transmissive L Solder leads termination Plastic discrete shell W Wire termination 4 Side mount opaque Electrical Specification Variations: Plastic discrete shell 0 = Buffered Totem-Pole Output 1 = Buffered Open-Collector Output CONTAINS POLYSULFONE 2 = Inverted Totem-Pole Output To avoid stress cracking, we suggest using ND 3 = Inverted Open-Collector Output Industries Vibra-Tite for thread-locking. Vibra-Tite evaporates fast without causing structural failure in OPTEKs molded plastics. Ro HS OPB930, OPB940 Buffered Totem-Pole OPB931, OPB941 Buffered Open-Collector OPB933 & OPB943 Inverted Open-Collector OPB932, OPB942 Inverted Totem-Pole Supply Voltage, V (not to exceed 3 seconds) 10 V CC Operating Temperature Range -40C to +70 C Storage Temperature Range -40C to +85 C (1) Lead Soldering Temperature (1/16 inch (1.6mm) from the case for 5 sec. with soldering iron 260 C (2) Input Diode Power Dissipation 100 mW (3) Output Photologic Power Dissipation 200 mW (4) Total Device Power Dissipation 300 mW Voltage at Output Lead (Open Collector Output) 35 V Diode Forward DC Current 40 mA Diode Reverse DC Voltage 2 V Notes: (1) RMA flux is recommended. Duration can be extended to 10 seconds maximum when flow soldering. (2) Derate linearly 2.22 mW/C above 25. (3) Derate linearly 4.44 mW/C above 25. (4) Derate linearly 6.66 mW/C above 25. (5) OPB930L/OPB940L series devices are terminated with 0.020 square leads designed for PCBoard mounting. (6) Methanol and isopropanol are recommended as cleaning agents. Plastic housing is soluble in chlorinated hydrocarbons and keto nes. (7) All parameters tested using pulse technique.