Prototyping Boards VECTORBORD (Plugbords) 44 Contacts 3662 4.5 x 6.5 Circuit Pattern: Contacts Only Contacts: 22/44 .156 Ctrs, Ni/Gold Width/Thick: 6.50 /.062 Height: 4.50 Unrestricted component place 16-Pin DIP Capacity: 50 ment over entire board surface Material: CEM-1. Layout paper and instructions Wire-Wrap Terminals: T44, T46, T49, T68 included Wire-Wrap Socket Pins: R32 Row and column legend Solder Connector: R644 provided Extender: 3690 Rec. Card Cage: Series 13 Wire-Wrap Connector: R644-3 Hole Diameter: .042 3662A6 4.5 x 6.5 0.085 diameter clearance area Circuit Pattern: Ground Plane around holes Contacts: 22/44 .156 Ctrs, Ground plane on component Ni/Gold side wiring side has contacts Width/Thick: 6.50 /.062 only Height: 4.50 To commit wire-wrap pins to 16-Pin DIP Capacity: 90 ground planes, use Vector T124 solder washers, available Material: CEM-1 . separately Wire-Wrap Terminals: T44, T46, T49, T68 Plane surface is solder-coated Wire-Wrap Socket Pins R32 for user convenience Solder Connector: R644 Layout paper and instructions Extender: 3690 included Rec. Card Cage: Series 13 Row and column legend Wire-Wrap Connector: R644-3 provided Hole Diameter: .042 3662-9 4.5 x 6.5 Circuit Pattern: Pad-Per-Hole Contacts: 22/44 .156 Ctrs, 0.080 diameter, isolated solder Ni/Gold pad around holes, both sides Width/Thick: 6.50 /.062 Pad and bus surfaces solder- Height: 4.50 coated for quick, convenient 16-Pin DIP Capacity: 48 soldering Row and column legends Material: FR4 Epoxy Glass provided Wire-Wrap Terminals: T44, T46, T49, T68 Layout paper and instructions Wire-Wrap Socket Pins R32 included Solder Connector: R644 Extender: 3690 Rec. Card Cage: Series 13 Wire-Wrap Connector: R644-3 Hole Diameter: .042 3682-2 4.5 x 6.5 Circuit Pattern: Interleaved Buses Bus pattern on wiring side, Contacts: 22/44 .156 Ctrs, solder-coated for user Ni/Gold convenience Width/Thick: 6.50 /.062 Bus outline traced on Height: 4.50 component side to facilitate 16-Pin DIP Capacity: 24 component placement Material: CEM-1 Mounts DIPs with 0.3 , 0.4 and 0.9 lead spacing Wire-Wrap Terminals: T44, T46, T49, T68 Unclad test point area at top of Wire-Wrap Socket Pins: R32 board Solder Connector: R644 Layout paper and instructions Extender: 3690 included Rec. Card Cage: Series 13 Row and column legends Wire-Wrap Connector: R644-3 provided Note: Same as 3682-4 but without Ground Plane Hole Diameter: .042 Specifications subject to change without notice. ELECTRONIC COMPANY General Proto ProductsProducts VECTORBORD 44 Contacts 3682-4 4.5 x 6.5 Circuit Pattern: Interleaved Bus/ Power bus in rows across com- Ground Plane ponent side overall ground plane on wiring side Contacts: 22/44 .156 Ctrs, 0.085 etched clearance area Ni/Gold around each hole on ground Width/Thick: 6.50 /.062 plane side Height: 4.50 Bus and plane surfaces solder 16-Pin DIP Capacity: 24 coated for user convenience Material: CEM-1 To commit wire-wrap pins to Wire-Wrap Terminals: T44, T46, T49, T68 ground planes, use Vector T124 solder washers, available Wire-Wrap Socket Pins: R32 separately Solder Connector: R644 Layout paper and instructions Extender: 3690 included Rec. Card Cage: Series 13 Row and column legends Wire-Wrap Connector: R644-3 provided Hole Diameter: .042 3677-2 4.5 x 6.5 Circuit Pattern: 3-Hole Solder Pad 3-hole solder pads (0.28 x Contacts: 22/44 .156 Ctrs. 0.080 ) for interconnecting multiple component leads Ni/Gold Voltage/ground buses inter- Width/Thick: 6.50 /.062 leaved between pad areas on Height: 4.50 wiring side 16-Pin DIP Capacity: 12 Row and column legends Material: CEM-1 provided Wire-Wrap Terminals: T44, T46, T49, T68 Test point area, with solder pads Wire-Wrap Socket Pins: R32 around holes, provided along back edge of board Solder Connector: R644 Layout paper and instructions Extender: 3690 included Rec. Card Cage: Series 13 Wire-Wrap Connector: R644-3 Hole Diameter: .042 4112-4 4.5 x 6.5 Circuit Pattern: 3-Hole Solder Pad Contacts: 22/44 .156 Ctrs, Continuous ground plane on Ni/Gold component side with 0.085 clearance pad around each hole Width/Thick: 6.50 /.062 3-hole solder pads (0.28 x 0.080 ) Height: 4.50 for interconnecting multiple com- 16-Pin DIP Capacity: 25 ponent leads Material: CEM-1 Row and column legends Wire-Wrap Terminals: T44, T46, T49, T68 provided Wire-Wrap Socket Pins: R32 Layout paper and instructions Solder Connector: R644 included Extender: 3690 Rec. Card Cage: Series 13 Wire-Wrap Connector: R644-3 Hole Diameter: .042 3662-2 4.5 x 9.6 Circuit Pattern: Contacts Only Contacts: 22/44 .156 Ctrs, Ni/Gold Unrestricted component place- ment over entire board surface Width/Thick: 9.60 /.062 Row and column legends Height: 4.50 provided 16-Pin DIP Capacity: 90 Layout paper and instructions Material: CEM-1 included Wire-Wrap Terminals: T44, T46, T49, T68 Wire-Wrap Socket Pins: R32 Solder Connector: R644 Extender: 3690-6 Rec. Card Cage: Series 14 Wire-Wrap Connector: R644-3 Hole Diameter: .042 11115 Vanowen St., North Hollywood, CA 91605 Phone(818)985-8208 Fax(818)985-7708 Toll-Free (800) 423-5659 Web site: