MMU 0102, MMA 0204, MMB 0207 - Professional
Vishay Beyschlag
Professional MELF Resistors
FEATURES
Approved to EN 140401-803
AEC-Q200 qualified
Advanced thin film technology
Excellent overall stability: Exceeds class 0.25
Matte Sn termination on Ni barrier layer
Compliant to RoHS Directive 2011/65/EU
APPLICATIONS
Automotive
Telecommunication
Industrial
Medical equipment
MMU 0102, MMA 0204 and MMB 0207 professional thin film
MELF resistors are the perfect choice for most fields of
METRIC SIZE
modern professional electronics where reliability and stability
DIN 0102 0204 0207
is of major concern. The typical applications in the fields of
CECC RC 2211M RC 3715M RC 6123M
automotive, telecommunication and medical equipment
reflect the outstanding level of proven reliability.
TECHNICAL SPECIFICATIONS
DESCRIPTION MMU 0102 MMA 0204 MMB 0207
CECC size RC 2211M RC 3715M RC 6123M
Resistance range 0.22 to 2.21 M ; 0 0.22 to 10 M; 0 0.1 to 15 M ; 0
Resistance tolerance 5 %; 2 %; 1 %; 0.5 % 5 %; 1 %; 0.5 % 5 %; 2 %; 1 %; 0.5 %
100 ppm/K; 50 ppm/K;
Temperature coefficient 50 ppm/K; 25 ppm/K
25 ppm/K
Operation mode Standard Power Standard Power Standard Power
(1) (2)
Rated dissipation, P 0.2 W 0.3 W 0.25 W 0.4 W 0.4 W 1.0 W
70
Operating voltage, U AC/DC 150 V 200 V 300 V
max.
Permissible film temperature, max. 125 C 155 C 125 C 155 C 125 C 155 C
F
- 55 C - 55 C - 55 C - 55 C - 55 C - 55 C
Operating temperature range
to 125 C to 155 C to 125 C to 155 C to 125 C to 155 C
Max. resistance change at P
70
for resistance range, 0.22 to 221 k 0.22 to 332 k 0.22 to 1 M
R/R max., after:
1000 h 0.15 % 0.25 % 0.15 % 0.25 % 0.15 % 0.25 %
8000 h 0.3 % 0.5 % 0.3 % 0.5 % 0.3 % 0.5 %
225 000 h 1 % - 1 % - 1 % -
Permissible voltage
against ambient (insulation):
1 min; U 200 V 300 V 500 V
ins
Continuous 75 V 75 V 75 V
-9
Failure rate: FIT 0.1 x 10 /h
observed
Notes
These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift increasing over
operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a functional lifetime.
(1)
The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heatflow support of the
printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature is not exceeded. Furthermore, a
high level of ambient temperature or of power dissipation may raise the temperature of the solder joint, hence special solder alloys or board
materials may be required to maintain the reliability of the assembly.
(2)
Specified power rating requires dedicated heat-sink pads.
www.vishay.com For technical questions, contact: melf@vishay.com Document Number: 28713
14 Revision: 05-Mar-12
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000MMU 0102, MMA 0204, MMB 0207 - Professional
Professional MELF Resistors
Vishay Beyschlag
DIMENSIONS
L
K L
1
D
D
1
DIMENSIONS AND MASS
L D L D K MASS
1 min. 1
TYPE
(mm) (mm) (mm) (mm) (mm) (mg)
MMU 0102 2.2 + 0/- 0.1 1.1 + 0/- 0.1 1.2 D + 0/- 0.1 0.4 0.05 8
MMA 0204 3.6 + 0/- 0.2 1.4 + 0/- 0.1 1.8 D + 0/- 0.15 0.8 0.1 22
MMB 0207 5.8 + 0/- 0.15 2.2 + 0/- 0.2 3.2 D + 0/- 0.2 1.15 0.1 80
Note
(3)
Color code marking is applied according to IEC 60062 in four bands (E24 series) or 5 bands (E96 or E192 series). Each color band appears
2
as a single solid line, voids are permissible if at least / of the band is visible from each radial angle of view. The last color band for tolerance
3
th th
is approximately 50 % wider than the other bands. An interrupted yellow band between the 4 and 5 full band indicates TC25.
PATTERN STYLES FOR MELF RESISTORS
X
G
Y
Z
RECOMMENDED SOLDER PAD DIMENSIONS
WAVE SOLDERING REFLOW SOLDERING
TYPE
G Y X Z G Y X Z
(mm) (mm) (mm) (mm) (mm) (mm) (mm) (mm)
MMU 0102 0.7 1.2 1.5 3.1 1.1 0.8 1.3 2.7
MMA 0204 1.5 1.5 1.8 4.5 1.7 1.2 1.6 4.1
MMB 0207 2.8 2.1 2.6 7.0 3.2 1.7 2.4 6.6
Note
The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards IEC 61188-5-x, or in
publication IPC-7351. They do not guarantee any supposed thermal properties, however, they will be found adequate for most general
applications.
Document Number: 28713 For technical questions, contact: melf@vishay.com www.vishay.com
Revision: 05-Mar-12 15
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000