333 3 BCR www.vishay.com Vishay Electro-Films Thin Film, Back-Contact Resistor FEATURES Wire bondable Only one wire bond required Small size: 0.020 inches square Resistance range: 10 to 1 M Oxidized silicon substrate for good power dissipation Moisture resistant Product may not be to scale Case size: 0202 LINKS TO ADDITIONAL RESOURCES Resistor material: tantalum nitride, self-passivating Material categorization: for definitions of compliance please see www.vishay.com/doc 99912 3D Models APPLICATIONS The Back Contact Resistor (BCR) series single-valu e Vishay EFI BCR resistor chips are widely used in hybrid back-contact resistor chip is one of the smallest chips packages where space is limited. The bottom connection is available. made by attaching the back of the chip to the substrate The BCR requires only one wire bond thus saving hybrid either eutectic or with conductive epoxy. The single wir e space. bond is made to the notched pad on the top of the chip. (The The BCRs are manufactured using Vishay Electro-Films other rectangular pad on the top of the chip is a via hole, a (EFI) sophisticated thin film equipment and manufacturing low-ohmic contact connecting the resistor to the bottom of technology. The BCRs are 100 % electrically tested and the chip.) visually inspected to MIL-STD-883, method 2032 class H or K. TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES, AND TOLERANCES PARAMETER VALUE UNIT Total resistance range 10 to 1M Standard tolerances 0.1, 0.2, 0.5, 1, 2, 5 % TCR 25, 50, 100, 250 ppm/C Tightest Standard Tolerance Available 5 % 2 % 1 % 0.5 % 0.2 % 0.1 % 25 ppm/C 50 ppm/C 100 ppm/C 250 ppm/C 360 k 1 M 200 k 10 20 50 100 200 1 k 620 k STANDARD ELECTRICAL SPECIFICATIONS PARAMETER VALUE UNIT Noise, MIL-STD-202, method 308 100 to 250 k -35 typ. dB < 100 or > 251 k -20 typ. Moisture resistance, MIL-STD-202, method 106 0.5 max. R/R % Stability, 1000 h, +125 C, 125 mW 1.0 max. R/R % Operating temperature range -55 to +125 C Thermal shock, MIL-STD-202, method 107, test condition F 0.25 max. R/R % High temperature exposure, +150 C, 100 h 0.5 max. R/R % Dielectric voltage breakdown 200 V 12 Insulation resistance 10 min. Operating voltage 75 max. V DC power rating at +70 C (derated to zero at +175 C) 0.250 W 5 x rated power short-time overload, +25 C, 5 s 0.25 max. R/R % Revision: 26-Oct-2020 Document Number: 61023 1 For technical questions, contact: efi vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000 DDD D BCR www.vishay.com Vishay Electro-Films DIMENSIONS in inches 0.020 0.020 0.016 TYPICAL RANGE TYPICAL RANGE TYPICAL RANGE TYPICAL RANGE 10 to 29 30 to 81 82 to 819 820 to 1 M Note Notched shaded area represents top bonding pad. The backside of the chip constitutes the second resistor connection SCHEMATIC Bond Pad Back of Chip MECHANICAL SPECIFICATIONS PARAMETER VALUE Chip size 0.020 x 0.020 0.002 (0.50 mm x 0.50 mm 0.05 mm) Chip thickness 0.010 0.002 (0.254 mm 0.05 mm) Chip substrate material Oxidized silicon, 10 k minimum SiO 2 Resistor material Tantalum nitride, self-passivating Bonding pad size 0.004 x 0.004 (0.100 mm x 0.100 mm) Number of pads 1 Pad material 10 k minimum aluminum (15 k minimum gold optional) Backing 3 k minimum gold Recommended attachment method Eutectic or conductive epoxy GLOBAL PART NUMBER INFORMATION Global Part Number: BCR50000FKAHWS Global Part Number Description: BCR 5K 1 %, 100 ppm/C, Al term., Class H, WS BC R 50 00 0 F K A H W S RESISTANCE VISUAL CLASS TOLERANCE TCR MODEL RESISTANCE MULTIPLIER TERMINATION (per MIL-STD-883, PACKAGING CODE (ppm/C) CODE method 2032) BCR First 4 digits B = 0.01 B = 0.1 % E = 25 G = gold H = class H WS = waffle pack 20 x 20 size are significant A = 0.1 C = 0.25 % C = 50 A = aluminum K = class K 100 min./mult. back contact figures of 0 = 1 D = 0.5 % K = 100 resistor resistance 1 = 10 F = 1.0 % M = 250 2 = 100 G = 2.0 % R = 0 / - 250 3 = 1000 J = 5.0 % K = 10 % Revision: 26-Oct-2020 Document Number: 61023 2 For technical questions, contact: efi vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000