CRCW040231K6FKEDC Vishay

CRCW...C e3 www.vishay.com Vishay Lead (Pb)-free Thick Film, Rectangular Commodity Chip Resistors FEATURES High volume product suitable for commercial applications Stability (R/R 1 % for 1000 h at 70 C) Lead (Pb)-free solder contacts on Ni barrier layer Metal glaze on ceramic Material categorization: for definitions of compliance please see www.vishay.com/doc 99912 STANDARD ELECTRICAL SPECIFICATIONS LIMITING CASE CASE POWER RATING TEMPERATURE RESISTANCE ELEMENT TOLERANCE MODEL SIZE SIZE P COEFFICIENT RANGE E-SERIES 70 C VOLTAGE % INCH METRIC W ppm/K MAX. V 100 1 1R0 to 10M E24 E96 0.063 50 CRCW0402...C 0402 RR 1005M 200 5 1R0 to 10M E24 Zero-Ohm-Resistor: R = 20 m , I at 70 C = 1.5 A max. max. 100 1 1R0 to 10M E24 E96 0.10 75 CRCW0603...C 0603 RR 1608M 200 5 1R0 to 10M E24 Zero-Ohm-Resistor: R = 20 m , I at 70 C = 2.0 A max. max. 100 1 1R0 to 10M E24 E96 0.125 150 CRCW0805...C 0805 RR 2012M 200 5 1R0 to 10M E24 Zero-Ohm-Resistor: R = 20 m , I at 70 C = 2.5 A max. max. 100 1 1R0 to 10M E24 E96 0.25 200 CRCW1206...C 1206 RR 3216M 200 5 1R0 to 10M E24 Zero-Ohm-Resistor: R = 20 m , I at 70 C = 3.5 A max. max. Notes These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift increasing over operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a functional lifetime Power rating depends on the max. temperature at the solder point, the component placement density and the substrate material TECHNICAL SPECIFICATIONS PARAMETER UNIT CRCW0402...C CRCW0603...C CRCW0805...C CRCW1206...C (1) Rated dissipation at 70C W 0.063 0.10 0.125 0.25 Limiting element voltage V 50 75 150 200 U AC/DC max. Insulation voltage U (1 min) V > 75 > 100 > 200 > 300 ins. 9 Insulation resistance > 10 Category temperature range C - 55 to + 155 -1 -9 Failure rate h 0.1 x 10 Weight/1000 pieces g 0.65 2 5.5 10 Note (1) The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow support of the printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature of 155 C is not exceeded Revision: 02-Nov-17 Document Number: 28773 1 For technical questions, contact: ff3aresistors vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000 CRCW...C e3 www.vishay.com Vishay PART NUMBER AND PRODUCT DESCRIPTION PART NUMBER: CRCW0603562RFKECC C R C W 0 6 0 3 5 6 2 R F K E C C MODEL/SIZE VALUE TOLERANCE TCR PACKAGING SPECIAL CRCW0402 R = decimal F = 1.0 % K = 100 ppm/K EA, EB, Up to 2 digits CRCW0603 K = thousand J = 5.0 % N = 200 ppm/K EC, ED, C = commodity CRCW0805 M = million Z = jumper 0 = jumper EE CRCW1206 0000 = jumper PRODUCT DESCRIPTION: CRCW0603-C 100 562R 1 % ET6 E3 CRCW0603-C 100 562R 1 % ET6 e3 RESISTANCE MODEL TCR TOLERANCE PACKAGING LEAD (Pb)-FREE VALUE CRCW0402-C 200 ppm/K 10R = 10 5 % ET1, ET5, e3 = pure tin CRCW0603-C 100 ppm/K 562R = 562 1 % ET6, ET7, termination CRCW0805-C 10K = 10.0 k EF4 finish CRCW1206-C 1M = 1 M 0R0 = jumper PACKAGING PACKAGING TYPE / SIZE CODE QUANTITY PACKAGING STYLE WIDTH PITCH DIMENSIONS ED = ET7 10 000 180 mm/7 CRCW0402C 2 mm EE = EF4 50 000 330 mm/13 EA = ET1 5000 180 mm/7 CRCW0603C EB = ET5 10 000 4 mm 254 mm/10 EC = ET6 20 000 330 mm/13 Paper tape acc. to EA = ET1 5000 8 mm 180 mm/7 IEC 60286-3, Type 1a CRCW0805C EB = ET5 10 000 4 mm 254 mm/10 EC = ET6 20 000 330 mm/13 EA = ET1 5000 180 mm/7 CRCW1206C EB = ET5 10 000 4 mm 254 mm/10 EC = ET6 20 000 330 mm/13 DIMENSIONS (1) SOLDER PAD DIMENSIONS (in millimeters) SIZE DIMENSIONS (in millimeters) REFLOW SOLDERING WAVE SOLDERING INCH METRIC L W H T1 T2 a b l a b l 0402 1005 1.0 0.10 0.5 0.05 0.30 0.05 0.25 0.10 0.2 0.1 0.4 0.6 0.5 0603 1608 1.60 0.10 0.80 0.10 0.45 0.10 0.3 0.2 0.3 0.2 0.5 0.9 1.0 0.9 0.9 1.0 0805 2012 2.0 0.10 1.25 0.15 0.50 0.10 0.35 0.15 0.35 0.2 0.7 1.3 1.2 0.9 1.3 1.3 + 0.10 1206 3216 3.05 0.10 1.55 0.10 0.55 0.35 0.15 0.45 0.2 0.9 1.7 2.0 1.1 1.7 2.3 - 0.05 Note (1) The rated dissipation applies only if the permitted film temperature is not exceeded. Furthermore, a high level of ambient temperature or of power dissipation may raise the temperature of the solder joint, hence special solder alloys or board materials maybe required to maintain the reliability of the assembly. Specified power rating above 125 C requires dedicated heat-sink pads, which depend on board materials. The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards IEC 61188-5-x, or in publication IPC-7351. They do not guarantee any supposed thermal properties, particularly as these are also strongly influenced by many other parameters. Still the given solder pad dimensions will be found adequate for most general applications Revision: 02-Nov-17 Document Number: 28773 2 For technical questions, contact: ff3aresistors vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000