CRCW080545K3FKEAC Vishay

CRCW...C e3 www.vishay.com Vishay Lead (Pb)-free Thick Film, Rectangular Commodity Chip Resistors FEATURES High volume product suitable for commercial applications Excellent stability ( R/R 1 % for 1000 h at 70 C) Lead (Pb)-free solder contacts on Ni barrier layer Metal glaze on ceramic Protective overglaze Material categorization: For definitions of compliance please see www.vishay.com/doc 99912 STANDARD ELECTRICAL SPECIFICATIONS LIMITING CASE CASE POWER RATING TEMPERATURE RESISTANCE ELEMENT TOLERANCE MODEL SIZE SIZE P COEFFICIENT RANGE E-SERIES 70 C VOLTAGE % INCH METRIC W ppm/K MAX. V 100 1R0 to 10M 1 E24 E96 0.063 50 200 1R0 to 9R76 CRCW0402...C 0402 RR 1005M 200 5 1R0 to 10M E24 Zero-Ohm-Resistor: R = 20 m , I at 70 C = 1.5 A max. max. 100 1R0 to 10M 1 E24 E96 0.10 75 200 1R0 to 9R76 CRCW0603...C 0603 RR 1608M 200 5 1R0 to 10M E24 Zero-Ohm-Resistor: R = 20 m , I at 70 C = 2.0 A max. max. 100 1R0 to 10M 1 E24 E96 0.125 150 200 1R0 to 9R76 CRCW0805...C 0805 RR 2012M 200 5 1R0 to 10M E24 Zero-Ohm-Resistor: R = 20 m , I at 70 C = 2.5 A max. max. 100 1R0 to 10M 1 E24 E96 0.25 200 200 1R0 to 9R76 CRCW1206...C 1206 RR 3216M 200 5 1R0 to 10M E24 Zero-Ohm-Resistor: R = 20 m , I at 70 C = 3.5 A max. max. Notes These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift increasing over operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a functional lifetime. Power rating depends on the max. temperature at the solder point, the component placement density and the substrate material. TECHNICAL SPECIFICATIONS PARAMETER UNIT CRCW0402...C CRCW0603...C CRCW0805...C CRCW1206...C (1) Rated dissipation at 70C W 0.063 0.10 0.125 0.25 Limiting element voltage V 50 75 150 200 U AC/DC max. Insulation voltage U (1 min) V > 75 > 100 > 200 > 300 ins. 9 Insulation resistance > 10 Category temperature range C - 55 to + 155 -1 -9 Failure rate h 0.3 x 10 Weight/1000 pieces g 0.65 2 5.5 10 Note (1) The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow support of the printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature of 155 C is not exceeded. Revision: 05-Jun-13 Document Number: 28773 1 For technical questions, contact: ff3aresistors vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000 CRCW...C e3 www.vishay.com Vishay PART NUMBER AND PRODUCT DESCRIPTION PART NUMBER: CRCW0603562RFKECC C R C W 0 6 0 3 5 6 2 R F K E C C MODEL/SIZE VALUE TOLERANCE TCR PACKAGING SPECIAL CRCW0402 R = Decimal F = 1.0 % K = 100 ppm/K EA, EB Up to 2 digits CRCW0603 K = Thousand J = 5.0 % N = 200 ppm/K EC, ED C = Commodity CRCW0805 M = Million Z = Jumper 0 = Jumper EE, EI CRCW1206 0000 = Jumper PRODUCT DESCRIPTION: D11/CRCW0603-C 100 562R 1 % ET6 E3 D11/CRCW0603-C 100 562R 1 % ET6 e3 RESISTANCE MODEL TCR TOLERANCE PACKAGING LEAD (Pb)-FREE VALUE D10/CRCW0402-C 200 ppm/K 10R = 10 5 % ET1, ET2 e3 = Pure tin D11/CRCW0603-C 100 ppm/K 562R = 562 1 % ET5, ET6 termination D12/CRCW0805-C 10K = 10.0 k ET7, EF4 finish D25/CRCW1206-C 1M = 1 M 0R0 = Jumper PACKAGING REEL PACKAGING CODE MODEL TAPE PIECES/ DIAMETER PITCH PART NUMBER PRODUCT DESC. WIDTH REEL PAPER PAPER 180 mm/7 10 000 ED ET7 CRCW0402C 8 mm 254 mm/10 2 mm 20 000 EI ET2 330 mm/13 50 000 EE EF4 180 mm/7 5000 EA ET1 CRCW0603C 8 mm 254 mm/10 4 mm 10 000 EB ET5 330 mm/13 20 000 EC ET6 180 mm/7 5000 EA ET1 CRCW0805C 8 mm 254 mm/10 4 mm 10 000 EB ET5 330 mm/13 20 000 EC ET6 180 mm/7 5000 EA ET1 CRCW1206C 8 mm 254 mm/10 4 mm 10 000 EB ET5 330 mm/13 20 000 EC ET6 DIMENSIONS (1) SOLDER PAD DIMENSIONS (in millimeters) SIZE DIMENSIONS (in millimeters) REFLOW SOLDERING WAVE SOLDERING INCH METRIC L W H T1 T2 a b l a b l 0402 1005 1.0 0.10 0.5 0.05 0.30 0.05 0.25 0.10 0.2 0.1 0.4 0.6 0.5 0603 1608 1.60 0.10 0.80 0.10 0.45 0.10 0.3 0.2 0.3 0.2 0.5 0.9 1.0 0.9 0.9 1.0 0805 2012 2.0 0.10 1.25 0.15 0.50 0.10 0.35 0.15 0.35 0.2 0.7 1.3 1.2 0.9 1.3 1.3 + 0.10 1206 3216 3.05 0.10 1.55 0.10 0.55 0.35 0.15 0.45 0.2 0.9 1.7 2.0 1.1 1.7 2.3 - 0.05 Note (1) The rated dissipation applies only if the permitted film temperature is not exceeded. Furthermore, a high level of ambient temperature or of power dissipation may raise the temperature of the solder joint, hence special solder alloys or boardmaterials maybe required to maintain the reliability of the assembly. Specified power rating above 125 C requires dedicated heat-sink pads, which depend on boardmaterials. The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards IEC 61188-5-x, or in publication IPC-7351. They do not guarantee any supposed thermal properties, particularly as these are also strongly influenced by many other parameters. Still the given solder pad dimensions will be found adequate for most general applications. Revision: 05-Jun-13 Document Number: 28773 2 For technical questions, contact: ff3aresistors vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000