RC
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Vishay Techno
Thick Film Chip Resistors, Alternate Terminations
FEATURES
Suitable for solderable, epoxy bondable, or
wire bondable applications
Available
Termination material: gold, platinum silver,
platinum palladium gold or solder coated
Available
non-magnetic terminations available
Multiple styles, termination materials and
configurations, allow wide design flexibility
Epoxy bondable or wire bondable
non-magnetic terminations available
Flow solderable
Custom sizes available
Burn-in data available
Automatic placement capability
Termination style: 3-sided wraparound termination or
single termination flip chip standard; 5-sided wraparound
termination available
Tape and reel packaging available
Internationally standardized sizes
Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
Note
* This datasheet provides information about parts that are RoHS-compliant and/or parts that are non-RoHS-compliant. For example, parts
with lead (Pb) terminations are not RoHS-compliant. Please see the information/tables in this datasheet for details.
STANDARD ELECTRICAL SPECIFICATIONS
MAXIMUM TEMPERATURE
POWER RATING RESISTANCE
(3)
GLOBAL WORKING TOLERANCE COEFFICIENT
(2)
CASE SIZE P RANGE
70 C (1)
MODEL VOLTAGE % (-55 C to +155 C)
W
V ppm/C
RC0540 0504 0.100 40 10 to 500K 1, 2, 5, 10, 20 100
RC0550 0505 0.100 50 10 to 500K 1, 2, 5, 10, 20 100
(4)
RC0575 0705 0.200 70 10 to 1M 1, 2, 5, 10, 20 100
RC5100 1005 0.250 100 10 to 1M 1, 2, 5, 10, 20 100
RC1100 1010 0.450 100 10 to 1M 1, 2, 5, 10, 20 100
RC1206 1206 0.300 100 10 to 1M 1, 2, 5, 10, 20 100
RC5150 1505 0.325 125 10 to 1M 1, 2, 5, 10, 20 100
RC7225 2208 0.525 200 10 to 1M 1, 2, 5, 10, 20 100
RC2010 2010 0.575 200 10 to 1M 1, 2, 5, 10, 20 100
Notes
(1)
Continuous working voltage shall be P x R or maximum working voltage, whichever is less.
(2)
Higher values available. Please consult factory.
(3)
100 ppm/C standard thru 1 M , 200 ppm/C offered from 1.1 M to 10 M .
(4)
MIL case size 0705 and EIA case size 0805 are dimensionally the same.
GLOBAL PART NUMBER INFORMATION
New Global Part Numbering: RC0540AA1K00FKSB (preferred part number format)
R C0 540 A A 1 K 0 0F K S B
GLOBAL TERM RESISTANCE SOLDER
SIZE TERM MATERIAL TOLERANCE TCR PACKAGING
MODEL STYLE VALUE TERMINATION
RC 0540 A = 3-sided G = Non-magnetic R = F = 1 % K = 100 ppm E = Sn100 B = Bulk
0550 B = Top only K = k G = 2 % L = 150 ppm F = T/R
A = Palladium silver F = Sn95/Ag5,
0575 C = 5-sided M = M J = 5 % N = 200 ppm (full reel)
B = Platinum gold HSD
5100 100R = 100 K = 10 % W = 350 ppm 1 = T/R
C = Gold S =
1100 1K00 = 1 k M = 20 % (1000 pcs)
1206 1M00 = 1 M 5 = T/R
D = Platinum silver Sn62/Pb36/Ag2,
5150 (500 pcs)
E = Platinum HSD
7225 T = T/R
palladium gold T = Sn90/Pb10
2010 (250 pcs
N = No solder min.)
W = Waffle
tray
Historical Part Numbering: CR1AA1001F100S2 (will continue to be accepted)
CR 1 A A 1001 F 100 S2
HISTORICAL TERM TERM RESISTANCE SOLDER
SIZE TOLERANCE TCR
MODEL STYLE MATERIAL VALUE TERMINATION
Note
For additional information on packaging, refer to the Surface Mount Resistor Packaging document (www.vishay.com/doc?31543).
Revision: 01-Oct-14 Document Number: 68013
1
For technical questions, contact: te1resistors@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000RC
www.vishay.com
Vishay Techno
MECHANICAL SPECIFICATIONS ENVIRONMENTAL SPECIFICATIONS
Resistive element Ruthenium oxide Operating
-55 C to +155 C
temperature
Encapsulation Glass
Less than 0.5 % change when tested
Substrate 96 % alumina
Moisture resistance
per method 106 of MIL-STD-202
Gold, palladium silver, platinum gold,
Less than 1 % change when tested
platinum silver, platinum palladium gold or
Termination
Life per method 108D (+85 C)
solder coated non-magnetic terminations
of MIL-STD-202
available.
Short time overload Less than 0.5 % R
Base metallization without a solder finish
Solder finish standard. Hot solder dipped tin/silver or
tin/lead/silver solder alloys available.
DIMENSIONS in inches (millimeters)
(1) (1) (1)
Termination Style A
Termination Style B Termination Style C
LENGTH (L) WIDTH (W) THICKNESS (T)
MODEL
(3-sided wraparound)
(Top conductor only) (5-sided wraparound) 0.006 (0.152) 0.006 (0.152) 0.005 (0.127)
RC0540 0.050 (1.27) 0.040 (1.02) 0.020 (0.508)
RC0550 0.050 (1.27) 0.050 (1.27) 0.020 (0.508)
W
W W
L RC0575 0.075 (1.90) 0.050 (1.27) 0.020 (0.508)
L L
RC5100 0.100 (2.54) 0.050 (1.27) 0.020 (0.508)
T T
T
0.025 [0.635] RC1100 0.100 (2.54) 0.100 (2.54) 0.020 (0.508)
0.025 [0.635] 0.025 [0.635]
Max.
Max. Max.
RC1206 0.125 (3.18) 0.062 (1.57) 0.025 (0.635)
RC5150 0.150 (3.81) 0.050 (1.27) 0.020 (0.508)
RC7225 0.225 (5.72) 0.075 (1.90) 0.020 (0.508)
RC2010 0.200 (5.08) 0.100 (2.54) 0.025 (0.635)
Note
(1)
All dimensions are before solder coating.
TERMINATION TERMINATION TERMINATION STYLE/ SOLDER TERMINATION
TYPE
MATERIAL STYLE MATERIAL CODE CODE
3-sided (wraparound) AG
E or T (standard);
Solderable Non-magnetic
(2)
F or S (optional)
Top only (flip chip) BG
3-sided (wraparound) AE
Epoxy bondable/ N (standard);
Platinum palladium gold Top only (flip chip) BE
(3)
solderable F or S (optional)
5-sided (wraparound) CE
3-sided (wraparound) AC
Wire bondable/
Gold Top only (flip chip) BC N
Epoxy bondable
5-sided (wraparound) CC
3-sided (wraparound) AA
(4)
Palladium silver Top only (flip chip) BA
5-sided (wraparound) CA
3-sided (wraparound) AB
Epoxy bondable Platinum gold Top only (flip chip) BB N
5-sided (wraparound) CB
3-sided (wraparound) AD
Platinum silver Top only (flip chip) BD
5-sided (wraparound) CD
Notes
(2)
Standard solder plating for the non-magnetic parts are solder terminations E or T. Hot solder dipped terminations F or S are also available.
(3)
Use solder termination N for applications requiring epoxy bondable mounting, and solder terminations F or S for applications requiring
solderable mounting.
(4)
While not recommended, palladium silver terminations could be used for solderable applications when using a solder alloy containing silver.
If the solder paste being used to solder the palladium silver terminated parts to the boards does not have a silver-based composition, then
the silver in the terminations could begin to leach when it is exposed to liquidus non-silver-based solders, causing the potential for
solderability and/or solder joint issues.
Revision: 01-Oct-14 Document Number: 68013
2
For technical questions, contact: te1resistors@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000