DTO025C1R000JTE3 Vishay

33 3 DTO25 www.vishay.com Vishay Sfernice Surface Mounted Power Resistor Thick Film Technology FEATURES AEC-Q200 qualified 25 W at 25 C case temperature Surface mounted resistor - TO-252 (DPAK) style package Wide resistance range: 0.016 to 700 k Non inductive Resistor isolated from metal tab Solder reflow secure at 270 C / 10 s, MSL = 1 DESIGN SUPPORT TOOLS AVAILABLE Material categorization: for definitions of compliance please see www.vishay.com/doc 99912 3D Models DIMENSIONS in millimeters 8.2 2.8 6.35 Footprint recommendation for solderable contact area: 0.8 0.1 10 7.87 0.6 0.1 2.54 2.54 1.4 +0.2 /-0 5.08 1.2 1.6 0.1 1.65 1.65 0.8 0.1 Tolerance unspecified: 0.3 Notes For the assembly, we recommend the lead (Pb)-free thermal profile as per J-STD-020C Power dissipation is 3.2 W at an ambient temperature of 25 C when mounted on a double sided copper board using FR4 HTG, 70 m of copper, 39 mm x 30 mm x 1.6 mm, with thermal vias For other information about dissipation, see the Application Note 52027: Thermal Management on SMD Thick Film Resistors (D2TO20, D2TO35, DTO25) STANDARD ELECTRICAL SPECIFICATIONS RESISTANCE RATED POWER LIMITING ELEMENT TEMPERATURE CRITICAL TOLERANCE MODEL SIZE RANGE P VOLTAGE U COEFFICIENT RESISTANCE 25 C L % W V ppm/C DTO25 TO-252 (DPAK) 0.016 to 700K 25 500 1, 2, 5, 10 150 10K MECHANICAL SPECIFICATIONS ELECTRICAL SPECIFICATIONS Mechanical Protection Molded From 0.016 to 0.047 : 5 % and 10 % Resistive Element Thick film Tolerances > 0.047 to 0.1 : Substrate Alumina 2 % to 10 % 0.11 : 1 % to 10 % Connections Tinned copper, Ni under layer Power Rating and Thermal 25 W at +25 C case Weight 2 g max. Resistance temperature R : 5 C/W TH (j - c) See Special Feature table ENVIRONMENTAL SPECIFICATIONS Temperature Coefficient 150 ppm/C Temperature Range -55 C to +150 C 1500 V - 1 min - 15 mA max. RMS Climatic Category 55 / 150 / 56 Dielectric Strength (between terminals and board) IEC 60695-11-5 4 Insulation Resistance 10 M Flammability 2 applications 30 s Inductance 0.1 H separated by 60 s Revision: 20-Mar-2019 Document Number: 51054 1 For technical questions, contact: sferfixedresistors vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000 DD D 1 7.3 1.8 6.82 4.1 12.4 1.78 3.81 8.51 DTO25 www.vishay.com Vishay Sfernice DIMENSIONS Standard Package TO-252 style (DPAK) SPECIAL FEATURES Resistance Values 0.016 0.1 0.5 Requirement Temperature Coefficient (TCR) 900 ppm/C 350 ppm/C 150 ppm/C (-55 C +150 C) IEC 60115-1 PERFORMANCE TESTS CONDITIONS REQUIREMENTS IEC 60115-1 4.13 Momentary Overload 1.6 Pr 5 s (0.25 % + 0.005 ) US < 1.5 UL IEC 60115-1 Load Life (1 % + 0.005 ) 1000 h, 90/30 Pr at +25 C AEC-Q200 REV D conditions: High Temperature Exposure MIL-STD-202 method 108 (1 % + 0.005 ) 1000 h, +175 C, unpowered AEC-Q200 REV D conditions: pre-conditioning 3 reflows according JESTD020D Temperature Cycling (0.5 % + 0.005 ) JESD22 method JA-104 1000 cycles, (-55 C to +125 C) dwell time 15 min AEC-Q200 REV D conditions: Biased Humidity MIL-STD-202 method 103 (0.5 % + 0.005 ) 1000 h, 85C, 85 % RH AEC-Q200 REV D conditions: pre-conditioning 3 reflows according Operational Life JESTD020D (1 % + 0.005 ) MIL-STD-202 method 108 1000 h, 90/30, powered, +125 C AEC-Q200 REV D conditions: ESD Human Body Model AEC-Q200-002 (0.5 % + 0.005 ) 25 kV AD AEC-Q200 REV D conditions: MIL-STD-202 method 204 Vibration (0.5 % + 0.005 ) 20 gs for 20 min, 12 cycles test from 10 Hz to 2000 Hz AEC-Q200 REV D conditions: MIL-STD-202 method 213 Mechanical Shock (0.5 % + 0.005 ) 100 gs, 6 ms, 3.75 m/s 3 shocks/direction AEC-Q200 REV D conditions: Board Flex AEC-Q200-005 (0.25 % + 0.01 ) bending 2 mm, 60 s AEC-Q200 REV D conditions: Terminal Strength AEC-Q200-006 (0.25 % + 0.01 ) 1.8 kgf, 60 s ASSEMBLY SPECIFICATIONS For the assembly on board, we recommend the lead (Pb)-free thermal profile as per J-STD-020C TESTS CONDITIONS REQUIREMENTS AEC-Q200 REV D Resistance to Soldering Heat MIL-STD-202 method 210 (0.5 % + 0.005 ) Solder Bath method: 270 C / 10 s Level: 1 IPC / JEDEC J-STD-020C Moisture Sensitivity Level (MSL) + pass requirements of TCR 85 C / 85 % RH / 168 h Overload and Dielectic Strength after MSL Revision: 20-Mar-2019 Document Number: 51054 2 For technical questions, contact: sferfixedresistors vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000