IGBRC5000CJJPCT5 Vishay

333 3 IGBR www.vishay.com Vishay Electro-Films Thin Film, High Power Back-Contact Resistor FEATURES Wire bondable Small size High power rating Single wire bond assembly Moisture resistant Case size: 0202 to 0808 Material categorization: for definitions of compliance please see www.vishay.com/doc 99912 LINKS TO ADDITIONAL RESOURCES APPLICATIONS 3D Models Videos Infographics Did You Capabilities and Gate resistor for IGBT based power converters Know Custom Options Current limiting for LED lighting applications The high power back-contact resistor (IGBR) series thin film High power applications chip resistor utilizes the excellent thermal properties of silicon to allow ultra high power rating with miniature case Alternative energy size for hybrid (chip and wire) assemblies. Hybrid assemblies The IGBR requires only one wire bond thus saving hybrid space. The IGBRs are manufactured using Vishay Electro-Films (EFI) sophisticated thin film equipment and manufacturing technology. The IGBRs are 100 % electrically tested and visually inspected to MIL-STD-883, method 2032 class H, class K, or commercial inspection per internal standards. TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES, AND TOLERANCES PARAMETER VALUE UNIT Total Resistance Range 1.8 to 25 Standard Tolerances 5, 10, 25 % TCR 500 ppm/C TCR (ppm/C) BY CASE SIZE AND VALUE 20 x 20 n/a 500 300 40 x 40 n/a 500 300 250 60 x 60 500 300 250 200 80 x 80 500 350 300 250 200 1.8 3.3 5 8 10 15 20 22 25 Value ( ) Revision: 29-Mar-2021 Document Number: 61107 1 For technical questions, contact: efi vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000 DDD D Case Size (mil) IGBR www.vishay.com Vishay Electro-Films STANDARD ELECTRICAL SPECIFICATIONS PARAMETER VALUE UNIT Operating Film Temperature Range 200 max. C Operating Temperature Range -55 to +125 C Working Voltage 75 max. V Breakdown Voltage 400 max. V (1) Thermal Resistivity Down to 2 K/W (1)(2) DC Power Rating Up to 4 W Load Life Stability, 1000 h, Film Temperature 200 C 1 R/R % Short Time Overload, 5 x Rated Power, 25 C, 5 s 0.25 R/R % Thermal Shock, MIL-STD-202, Method 107 F 1 R/R % (3) Moisture Resistance, MIL-STD-202, Method 106 0.25 R/R % High Temperature Exposure, 100 h, +150 C 0.5 R/R % Low Temperature Operation, -65 C, 45 min 0.5 R/R % Notes (1) See table Power Rating by Case Size (2) Power rating determined by application specific heat sink properties. Film temperature should not exceed 200 C. See table Power Rating by Case Size for more details (3) Aluminum pads and aluminum wire bonds are sensitive to high moisture environments. Adequate application level packaging is required to protect the components and wire bonds from moisture related damage POWER RATING BY CASE SIZE TYPICAL R CHIP SIZE BOND PAD SIZE DIE THICKNESS R MIN. R MAX. (1) CASE SIZE THERMAL (2) (2) mil (mm) mil (mm) mil (mm) K/W 0202 20 x 20 (0.5 x 0.5) 10 x 16 (0.25 x 0.41) 10 (0.25) 10 15 25 0404 40 x 40 (1 x 1) 15 x 36 (0.38 x 0.91) 10 (0.25) 7 3.3 25 0606 60 x 60 (1.5 x 1.5) 20 x 56 (0.51 x 1.42) 10 (0.25) 5 1.8 25 0808 80 x 80 (2 x 2) 27 x 76 (0.69 x 1.93) 10 (0.25) 2 1.8 25 Notes (1) Typical R thermal between film and back contact. Does not include die attach joint (epoxy or solder) (2) Dimension tolerances are 0.05 mm ( 2 mil) SCHEMATIC R PIN 1 PIN 2 Top contact Back contact Test pad not used during normal operation PIN 1 PIN 2 Back contact Revision: 29-Mar-2021 Document Number: 61107 2 For technical questions, contact: efi vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000