MSP08A-05-221/331G Vishay

MSP Vishay Sfernice Precision Surface Mount Resistors Wirewound or Metal Film Technologies FEATURES Approved according CECC 40402-801 (wirewound) Wide range of ohmic values (0.04 to 1 M) Low temperature coefficient ( 25 ppm/C available) Good electrical insulation All welded construction and molded encapsulant High power ratings (up to 2.5 W) Stability class 0.5 Pure matte tin termination Specially designed for surface mounting, the MSP series The MSP design is compatible with surface mounting uses either wirewound or metal film technology. equipment and can withstand wave and reflow soldering The molded package ensures mechanical and climatic techniques. protection as well as high dielectric insulation. DIMENSIONS in millimeters MSP RECOMMENDED SOLDERING AREAS E Z W X X A C DIMENSIONS Average A BCD E F W X Z Mass SERIES (g) B MSP 1 6.9 3.8 3.8 2.5 6.5 1.4 2.7 2.9 6 0.2 MSP 2 11.4 5 7 5 11 2.4 5.2 4.1 9.4 0.8 MSP 3 14.8 6.6 7 5 14.4 2.4 5.2 4.1 12.7 1.5 F F D General tolerance: 0.2 mm TECHNICAL SPECIFICATIONS RESISTIVE TECHNOLOGY Wirewound Metal Film Vishay Sfernice Series MSP 1 B MSP 2 B MSP 3 B MSP 1 C MSP 2 C CECC 40402-801 RW1 RW2 RW3 - - Metric Size 0704M 1107M 1607M 0704M 1107M Rated Dissipation at + 25 C, P 1 W 2 W 2.5 W 0.5 W 1 W 25 0.04 0.04 0.04 5 % E24 series -- 2.2K 4.7K 13K 0.04 0.04 0.05 Ohmic Range In 2 % E48 series - - 2.2K 4.7K 13K Relation to Tolerance 0.04 0.04 0.05 10 10 1 % E96 series (with Prefered 2.2K 4.7K 13K 332K 1M Ohmic 0.4 0.4 0.3 10 10 0.5 % E96 series Value Series) 2.2K 4.7K 13K 332K 1M 10 10 0.1 % E192 series -- - 332K 332K Approved Range 1 % or 0.5 0.5 0.1 -- CECC 40402-801 Class 0.5 1K 2.2K 4.12K Limiting Element Voltage, U AC/DC 50 V 120 V 200 V 300 V 350 V max. www.vishay.com For technical questions, contact: sfer vishay.com Document Number: 50003 1 Revision: 18-Sep-08MSP Precision Surface Mount Resistors Vishay Sfernice Wirewound or Metal Film Technologies TECHNICAL SPECIFICATIONS (continued) RESISTIVE TECHNOLOGY Wirewound Metal Film Series MSP 1 B MSP 2 B MSP 3 B MSP 1 C MSP 1 C Critical Resistance - - - 180K 122.5K - 55 C/+ 155 C CECC 40402-801 10 to 332 k - 55 C/+ 200 C K3: 50 ppm/C Temperature Coefficient, TC < 1 100 ppm/C K4: 25 ppm/C 1 to < 10 50 ppm/C > 332 k 10 25 ppm/C - K3: 50 ppm/C E6 E6 E0 or A Failure Rate with CECC Approval -- -6 -6 -4 10 /h 10 /h 10 /h MECHANICAL SPECIFICATIONS Wirewound Metal Film Encapsulant Thermoset Resistive Element CuNi or NiCr NiCr or NiP Ceramic Substrate Alumina or Steatite Alumina Termination Electrolytic pure matte tin ENVIRONMENTAL SPECIFICATIONS Wirewound Metal Film Temperature Range - 55 C to 275 C - 55 C to 155 C Climatic Category (LCT/UCT/days) 55/200/56 55/125/10 PERFORMANCE CONDITIONS REQUIREMENTS TESTS Wirewound Wirewound Metal Film Metal Film CECC 40402-801 IEC 60115-1 Short Time Overload (0.25 % + 0.05 ) 0.25 % 5 P or U = 2 U /5 s r max. IEC 60115-1 90/30 cycles Load Life 1000 h P + 25 C (0.5 % + 0.05 ) 1 % r 8000 h P (3 % + 0.05 ) - r IEC 60115-1 No flashover or breakdown Dielectric w/s Voltage U = 500 V/60 s Leakage current < 10 A RMS IEC 60115-1 IEC 60068-2-14 Test Na Rapid Change of (0.25 % + 0.05 ) 0.25 % 5 cycles (30 at LCT/30 at UCT) Temperature - 55 C/+ 200 C - 55 C/+ 125 C IEC 60115-1 Climatic Sequence (0.5 % + 0.05 ) 0.5 % - 55 C/+ 200 C - 55 C/+ 125 C IEC 60115-1 IEC 60068-2-3 Test Ca Humidity (0.5 % + 0.05 ) 1 % 95 % HR/40 C (Steady State) 56 days 10 days IEC 60115-1 Substrate Bending Test IEC 60068-2-21 Test U (0.25 % + 0.05 ) 0.25 % e3 2 mm/10 times IEC 60115-1 Shock IEC 60068-2-27 Test Ea (0.25 % + 0.05 ) N/A 50 gs/half sine/ 3 times by direction (i.e. 18 shocks) IEC 60115-1 IEC 60068-2-6 Test Fc Vibration (0.25 % + 0.05 ) 0.25 % 10/2000 Hz 10/500 Hz IEC 60115-1 Resistance to Soldering IEC 60068-2-58 Solder bath (0.5 % + 0.05 ) N/A Heat 260 C/10 s Document Number: 50003 For technical questions, contact: sfer vishay.com www.vishay.com Revision: 18-Sep-08 2