NTCC200E4, NTCC300E4 www.vishay.com Vishay BCcomponents Leadless NTC Thermistor Die Suitable for Wire Bonding FEATURES Flat chip contacted top and bottom (gold: NTCC300E4 series or silver: NTCC200E4 series) Green thermistor - does not use RoHS exemptions Wide temperature range from -55 C to +175 C Highly resistant to thermal shocks Ideal for wire bonding (aluminum or gold depending on metalization type) Resistance to leaching Delivered on blister tape QUICK REFERENCE DATA AEC-Q200 qualified PARAMETER VALUE UNIT Material categorization: for definitions of compliance please see www.vishay.com/doc 99912 Resistance value at 25 C 4.7K to 20K Tolerance on R -value 1 2 3 5 % 25 APPLICATIONS B -value 3435 to 3865 K 25/85 High temperature sensing, control and compensation. Tolerance on B -value 1 % E.g. IGBT modules (inverters in EV and HEV vehicles) 25/85 IC and semiconductor protecting Operating temperature range -55 to +175 C DC/AC power inverters and HIC overheat protecting Response time (63.2 %) 3s 25 C to 85 C still air (for info) DESIGN-IN SUPPORT Dissipation factor in still air 3mW For complete curve computation, please visit: (for info, non-mounted die) www.vishay.com/thermistors/ntc-curve-list/ Maximum power dissipation 50 mW Weight 3 mg MARKING The thermistors have no marking and have electrode termination design without orientation. MOUNTING The thermistors are primarily intended for wire bonding. The Wire bonding: parameters of the assembly process should be chosen in The gold electrode has been tested for gold wire bonding accordance with the lead-wire material. with a wire diameter of max. 32 m The mounting process should be in compliance with the The silver electrode has been tested for aluminum wire following guidelines and recommendations: bonding with a wire diameter of max. 300 m Die bonding: Encapsulation: Gold electrode: silver epoxy gluing In order to preserve the characteristics of the bonded die Silver electrode: (vacuum) reflow soldering - silver epoxy at long term an encapsulation is mandatory gluing - nano silver sintering The encapsulation is defined by the user. Silicon and Soldering process under reducing atmosphere (e.g. formin g epoxy encapsulations have been tested. For or formic gases) and ultrasonic cleaning processes can be recommendations on compatible encapsulants contact applied under the condition that NTC die is not damaged. Vishay Consult Vishay for further assistance. ELECTRICAL DATA AND ORDERING INFORMATION R R -TOL. B B -TOL. SAP MATERIAL AND 25 25 25/85 25/85 DESCRIPTION (1) () ( %) (K) ( %) ORDERING NUMBER 4700 1, 2, 3, 5 3435 1 Bare die with top / bottom silver terminations NTCC200E4472*T 12 000 1, 2, 3, 5 3740 1 Bare die with top / bottom silver terminations NTCC200E4123*T 20 000 1, 2, 3, 5 3865 1 Bare die with top / bottom silver terminations NTCC200E4203*T 4700 1, 2, 3, 5 3435 1 Bare die with top / bottom gold terminations NTCC300E4472*T 12 000 1, 2, 3, 5 3740 1 Bare die with top / bottom gold terminations NTCC300E4123*T 20 000 1, 2, 3, 5 3865 1 Bare die with top / bottom gold terminations NTCC300E4203*T Note (1) In order to define R -tolerance, replace * in SAP part number by F ( 1 %), G ( 2 %), H ( 3 %), or J ( 5 %) 25 Revision: 09-Dec-2020 Document Number: 29153 1 For technical questions, contact: nlr vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000 NTCC200E4, NTCC300E4 www.vishay.com Vishay BCcomponents DIMENSIONS in millimeters WT Wire bondable surface PARAMETER VALUE W2 0.1 T 0.7 max. Note Non-dimensioned details do not affect the performance of the thermistors PACKAGING The components are delivered on 8 mm embossed blister tape (0.3 mm conductive PS) conforming to EIA-481 and IEC 60286-3, with 2000 parts per reel. P K 0 0 D 0 P 2 E 1 T F B 0 W T 2 A 0 PARAMETER VALUE A 2.2 0.1 0 B 2.2 0.1 0 K 1.0 0.1 0 W8 0.3 F 3.5 0.05 E 1.75 0.1 1 P 4.0 0.1 0 P 2.0 0.05 2 D 1.5 0.1 0 T 0.35 max. T 0.50 max. 2 Revision: 09-Dec-2020 Document Number: 29153 2 For technical questions, contact: nlr vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000