PTCTZ3NR949ETT Vishay

PTCTZ www.vishay.com Vishay BCcomponents SMD PTC Thermistors For Overload Protection FEATURES Compact resettable overload protection Low mounting height Suitable for reflow soldering Small ceramic diameter for faster response Low heat transfer to substrate Flat terminations for stable positioning and good solderability Material categorization: for definitions of compliance please see www.vishay.com/doc 99912 APPLICATIONS QUICK REFERENCE DATA Over-temperature/over-load protection: VALUE PARAMETER UNIT Telecom STANDARD TELECOM (1) (1) TYPES TYPES -Central Office Switching (C.O.) Resistance value at 25 C 2 to 500 10 to 70 -Subscriber Terminal Equipment (T.E.) Tolerance on R value 10 15 20 % -Set-top Box 25 Maximum overload current -Modems 2 to 10 A I (V dependent) ol max. General industry and automotive Maximum holding current 50 to500 50 to100 -Low power overload protection (I ) (at 25 C) (at 70 C) nt -Inrush current limitation Maximum voltage 16 to400 220 to 600 V RMS (RMS or DC) DESCRIPTION Maximum trip time at 1 A 0.8 to 6 s The component consists of a high performance PTC Switching temperature ceramic mounted in a lead frame with lead (Pb)-free tin 105 to 140 (T ) sw plated contacts. The terminations are joined to the Ag plated Operating temperature C ceramic by a high melting solder. The ceramic is covered -40 to 85 range at max. voltage with a protective high temperature silicone layer. Storage temperature -40 to 155 MARKING Maximum continuous 2W power at 25 C All SMD PTCs are marked with a 3-digit type number (XXX) and a date code (YYWW) Note (1) Customized products are available on request in the indicated nominal R range. Larger 8 mm ceramics for lower resistance 25 values or higher voltages are in use in the PTCCZ08 series. ELECTRICAL DATA AND ORDERING INFORMATION RESISTANCE I at I at OPERATING CATALOG NUMBER nt t MAX. MAX. TEMP. STORAGE MATCHING V I at max. 25 70 25 ol R TOL. TRIP-TIME T RANGE TEMP. SAP ORDERING TYPE NR sw 25 () (V) V C C C max. () (%) at 1 A (s) AT MAX. RANGE CODE MARKING (A) (mA) (mA) (mA) VOLTAGE TELECOM AND INDUSTRIAL TYPES (2) 10 20 - 245 165 100 270 3.0 2.0 105 0 to 70 -25 to 125 PTCTZ3NR100GTT 012 (2) 10 20 0.5 245 165 100 270 3.0 2.0 105 0 to 70 -25 to 125 PTCTZ3MR100GTT 016 40 25 no 265 80 50 130 0.8 2.0 105 0 to 70 -25 to 125 PTCTZ3NR400HTT 002 (2) 25 20 1 265 120 70 220 1.3 2.0 110 0 to 70 -25 to 125 PTCTZ3MR250HTT 005 (2) 15to20 - - 300 150 100 250 1.5 1.5 115 0 to 70 -25 to 125 PTCTZ3NR150KTT 004 (2) 15to20 - 0.5 300 150 100 250 1.5 2.0 115 0 to 70 -25 to 125 PTCTZ3MR150KTT 003 (2) 20 20 0.5 300 120 70 250 1.4 1.5 105 0 to 70 -25 to 125 PTCTZ3MR200KTT 018 (2) 35 +15 / -20 1 425 110 70 175 1.0 0.7 125 -25 to 85 -40 to 155 PTCTZ3MR350MTT 009 50 20 1 425 90 60 150 0.8 0.7 125 -40 to 70 -40 to 125 PTCTZ3MR500MTT 019 GENERAL INDUSTRIAL TYPES 3.3 25 - 24 400 - 650 6.0 8.0 140 -40 to 85 -40 to 155 PTCTZ3NR339CTT 013 9.4 25 - 60 150 100 300 1.8 3.0 115 -40 to 85 -40 to 155 PTCTZ3NR949ETT 011 Note (2) These types pass ITU-K20-21-45 telecommunication protection recommendation Revision: 27-Nov-15 Document Number: 29068 1 For technical questions, contact: nlr vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000 PTCTZ www.vishay.com Vishay BCcomponents PTC OUTLINES DIMENSIONS in millimeters PTC SMD ceramic size: 6.5 mm 2 3 0 7.3 8.0 - 0.2 1 2 3.45 0.15 0.2 1 2 3 1.2 + 0.6 0.6 3.6 0.1 0 10 7.6 0.25 max. 10 0.25 DIMENSIONS OF SOLDER LANDS in millimeters 2 2.8 4 0.2 5 11 4 0.1 PACKAGING TYPE QUANTITY CARRIER TAPE WIDTH PITCH REEL DIAMETER PTCTZ 1500 PS conductive blister tape acc. IEC60286-3 16 mm 12 mm 330 mm MATERIAL INFORMATION REF. DESCRIPTION MATERIAL AND REMARKS 1 Ceramic BaTiO doped 3 2 Metalization NiCr Ag layer (vacuum deposition) 3 Lead frame Ni plated phosphor bronze material covered by matte tin layer SOLDERING CONDITIONS This SMD thermistor is only suitable for reflow soldering, in accordance with JEDEC J-STD-020D. Soldering processes which can be used are reflow (infrared and convection heating) and vapor phase. The maximum temperature of 260 C during 10 s should not be exceeded and no liquid flux should be allowed to reach the ceramic body. Typical examples of a soldering processes that will provide reliable joints without damage, are shown below. Reflow soldering Vapor phase soldering 10 s 300 T 300 T 260 C (C) 245 C (C) 250 20 s to 40 s 250 10 s 215 C 215 C 200 40 s 180 C 200 180 C 150 130 C 150 Forced 130 C cooling 100 C 100 100 External Internal preheating, preheating 2 K/s e.g. by infrared, 50 50 max. 2 K/s 0 0 0 50 100 150 200 250 0 50 100 150 200 250 t (s) t (s) Typical values (solid line) Typical values (solid line) Process limits (dotted lines) Process limits (dotted lines) MOUNTING CONDITIONS 2 A flat pick-up area of minimum 10 mm and low weight allows for fast placement. Because of the nature of PTC ceramic material the component should not be touched with bare hands, as the residue of perspiration can influence component behavior at high temperatures. Handling forces applied to the component should be limited to 5 N in any condition. Revision: 27-Nov-15 Document Number: 29068 2 For technical questions, contact: nlr vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000