RV www.vishay.com Vishay Sfernice CECC ( ) 40401-010 Qualified Thin Film Chip Resistors FEATURES Nickel barrier for high temperature operating conditions Available Tight TCR < 10 ppm/C, and in lot tracking < 5 ppm/C in (-55 C, +155 C temperature range) Available Very low noise < 35 dB and voltage coefficient click logo to get started DESIGN SUPPORT TOOLS 0.1 ppm/V Non-inductive Models Laser trimmed down to 0.1 % Available Wraparound resistance less than 0.01 Utilizing proven expertise in Thin Film resistors, VISHAY Antistatic waffle-pack or tape and reel packaging provides a CECC qualified chip with the same reliability available and stability found in QPL resistors. These chips are High stability (0.05 % - 1000 h at Pn at +70 C) available in a wide range of sizes, values and performance Withstand moisture resistance test of AEC-Q200 characteristics. Conform to EN 140401 804 CONSTRUCTION Material categorization: for definitions of compliance Passivated NiCr please see www.vishay.com/doc 99912 Passivation resistance film Note Solder * This datasheet provides information about parts that are coating RoHS-compliant and / or parts that are non RoHS-compliant. For example, parts with lead (Pb) terminations are not RoHS-compliant. Nickel barrier Please see the information / tables in this datasheet for details High purity alumina substrate Adhesion layer STANDARD ELECTRICAL SPECIFICATIONS RESISTANCE RATED POWER LIMITING ELEMENT TEMPERATURE TOLERANCE (1) (2) MODEL SIZE RANGE Pn VOLTAGE (UL) COEFFICIENT % W V ppm/C RV 0505 100 to 260K 0.125 50 0.1, 0.5, 1, 2, 5 10, 25 RV 0603 100 to 260K 0.125 50 0.1, 0.5, 1, 2, 5 10, 25 RV 0805 100 to 300K 0.200 50 0.1, 0.5, 1, 2, 5 10, 25 RV 1206 100 to 1M 0.330 75 0.1, 0.5, 1, 2, 5 10, 25 Notes (1) Extended resistance range on request (2) For ohmic range versus tolerance and TCR, see detailed table CLIMATIC SPECIFICATIONS OHMIC RANGE VS. TOLERANCE AND TCR Operating temperature range -55 C to +155 C OHMIC RANGE TOLERANCE TCR CASE SIZE % ppm/C Storage temperature range -55 C to +155 C 0505 100 < 500 0.5 1 2 5 10, 25 0505 500 to 260K 0.1 0.5 1 2 5 10, 25 MECHANICAL SPECIFICATIONS 0603 100 < 500 0.5 1 2 5 10, 25 Resistive material Nichrome 0603 500 to 260K 0.1 0.5 1 2 5 10, 25 Substrate material Alumina 0805 100 < 500 0.5 1 2 5 10, 25 Tin lead over nickel or tin silver 0805 500 to 300K 0.1 0.5 1 2 5 10, 25 Plating over nickel or gold over nickel 1206 100 < 500 0.5 1 2 5 10, 25 Marking resistance to solvents Per CECC Specs 1206 500 to 1M 0.1 0.5 1 2 5 10, 25 TECHNICAL SPECIFICATIONS TEST SPECIFICATIONS CONDITIONS Absolute TCR E: 25 ppm/C / Y: 10 ppm/C -55 C to +155 C 0.1 %, 0.5 %, 1 %, 2 %, 5 % (R 500 ) Absolute tolerance 0.5 %, 1 %, 2 %, 5 % (R 100 ) Voltage coefficient 0.1 ppm/V Noise -35 dB typical Thermal EMF < 0.1 V/C (3) Load life stability (0.1 % Rn 0.05 ) 1000 h Pn at +70 C Note (3) Rn: Nominal resistance Revision: 23-Feb-18 Document Number: 60022 1 For technical questions, contact: sferthinfilm vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000 RV www.vishay.com Vishay Sfernice DIMENSIONS in millimeters (inches) A D D B C E E AB D/E C SERIES/ CASE SIZES Min. Max. Min. Max. Min. Max. Min. Max. 1.198 1.502 1.143 1.397 0.250 0.510 0.373 0.627 RV 0505 (0.047) (0.059) (0.045) (0.055) (0.010) (0.020) (0.015) (0.025) 1.368 1.672 0.623 0.877 0.250 0.510 0.373 0.627 RV 0603 (0.054) (0.066) (0.025) (0.035) (0.010) (0.020) (0.015) (0.025) 1.758 2.062 1.143 1.397 0.250 0.510 0.373 0.627 RV 0805 (0.069) (0.081) (0.045) (0.055) (0.010) (0.020) (0.015) (0.025) 2.908 3.212 1.473 1.727 0.250 0.510 0.373 0.627 RV 1206 (0.114) (0.126) (0.058) (0.068) (0.010) (0.020) (0.015) (0.025) POPULAR OPTION AEC-Q200 moisture resistance Option to order: 0058: Specific production process to withstand 85 C/85 % RH at Pn/10 ENVIRONMENTAL TEST VALUES AND DRIFTS ( R/R %) TEST CONDITIONS CECC REQUIREMENTS TYPICAL PERFORMANCE (2) (2) Overload 6.25 x rated power / 2 s (or 2 UL) 0.05 % Rn + 0.05 0.01 % Rn -55 C / +155 C (1) (2) (2) Climatic sequences 0.1 % Rn + 0.05 0.02 % Rn 5 moisture cycles -55 C / +155 C (1) (2) (2) Thermal shock 0.05 % Rn + 0.05 0.02 % Rn 5 cycles 30 min +70 C/Pn (1) (2) (2) Load life 0.1 % Rn + 0.05 0.05 % Rn 1000 h (2) (2) Resistance to solder heat +260 C/ 10 s 0.05 % Rn + 0.05 0.02 % Rn +40 C / 93 % HR (2) (2) 0.1 % Rn + 0.05 0.01 % Rn Pn / 10 (1) Moisture resistance (3) AEC-Q200 85 C / 85 % RH / Pn / 10 0.5 % + 0.05 Max. < 0.3 % + 0.05 1000 h (2) (2) High temperature storage 1000 h at + 155 C 0.1 % Rn + 0.05 0.05 % Rn (1) (2) (2) Bending 10 bends / 2 mm / 5 s 0.05 % Rn + 0.05 0.02 % Rn SPECIFIC CONDITIONS DUE TO TERMINATION TYPE CONDITIONS VALUES AND DRIFTS TEST B G N VISHAY REQUIREMENTS TYPICAL PERFORMANCE +235 C/2 s +245 C/3 s Solderability VISUAL INSPECTION Sn60Pb40 alloy Sn97Ag3 alloy +255 C/40 s (2) (2) High T reflow profile N/A 0.02 % Rn + 0.05 0.01 % Rn + 0.05 (on parts) Notes (1) Test requiring parts to be mounted on PCB will be performed with the requirement that termination alloy will be the same as solder paste alloy. Gold termination will be tested as B termination (2) Rn: Nominal Resistance Pn: Nominal Power (3) Option to order: 0058 Revision: 23-Feb-18 Document Number: 60022 2 For technical questions, contact: sferthinfilm vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000