X-On Electronics has gained recognition as a prominent supplier of SIHP18N50C-E3 MOSFETs across the USA, India, Europe, Australia, and various other global locations. SIHP18N50C-E3 MOSFETs are a product manufactured by Vishay. We provide cost-effective solutions for MOSFETs, ensuring timely deliveries around the world.

SIHP18N50C-E3 Vishay

Hot SIHP18N50C-E3 electronic component of Vishay
SIHP18N50C-E3 Vishay
SIHP18N50C-E3 MOSFETs
SIHP18N50C-E3  Semiconductors

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Part No. SIHP18N50C-E3
Manufacturer: Vishay
Category: MOSFETs
Description: N-Channel 500 V 18A (Tc) 223W (Tc) Through Hole TO-220AB
Datasheet: SIHP18N50C-E3 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 2.6665 ea
Line Total: USD 2.67 
Availability - 355
Ship by Fri. 14 Feb to Wed. 19 Feb
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
355
Ship by Fri. 14 Feb to Wed. 19 Feb
MOQ : 1
Multiples : 1
1 : USD 2.6665
10 : USD 1.9433
50 : USD 1.5449
100 : USD 1.347
500 : USD 1.2571
1000 : USD 1.2184

6252
Ship by Wed. 05 Feb to Fri. 07 Feb
MOQ : 1
Multiples : 1
1 : USD 3.0625
10 : USD 1.908
100 : USD 1.617
500 : USD 1.529
1000 : USD 1.32

   
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Id - Continuous Drain Current
Vds - Drain-Source Breakdown Voltage
Rds On - Drain-Source Resistance
Transistor Polarity
Vgs th - Gate-Source Threshold Voltage
Minimum Operating Temperature
Maximum Operating Temperature
Pd - Power Dissipation
Mounting Style
Package / Case
Packaging
Technology
Number of Channels
Vgs - Gate-Source Voltage
Qg - Gate Charge
Channel Mode
Brand
Continuous Drain Current
Drain-Source Breakdown Voltage
Forward Transconductance - Min
Gate-Source Breakdown Voltage
Power Dissipation
Rds On
Fall Time
Gate Charge Qg
Rise Time
Factory Pack Quantity :
Typical Turn-Off Delay Time
Configuration
Cnhts
Hts Code
Mxhts
Product Type
Subcategory
Taric
Typical Turn-On Delay Time
Category
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We are delighted to provide the SIHP18N50C-E3 from our MOSFETs category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the SIHP18N50C-E3 and other electronic components in the MOSFETs category and beyond.

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SiHP18N50C www.vishay.com Vishay Siliconix Power MOSFET FEATURES D Low figure-of-merit R x Q on g TO-220AB Available 100 % avalanche tested High peak current capability Available G dv/dt ruggedness Improved t /Q rr rr S Improved gate charge D S G High power dissipations capability N-Channel MOSFET Material categorization: for definitions of compliance please see www.vishay.com/doc 99912 Note PRODUCT SUMMARY * This datasheet provides information about parts that are V (V) at T max. 560 DS J RoHS-compliant and / or parts that are non RoHS-compliant. For example, parts with lead (Pb) terminations are not RoHS-compliant. R ( )V = 10 V 0.225 DS(on) GS Please see the information / tables in this datasheet for details Q max. (nC) 76 g Q (nC) 21 gs Q (nC) 29 gd Configuration Single ORDERING INFORMATION Package TO-220AB Lead (Pb)-free and halogen-free SiHP18N50C-E3 ABSOLUTE MAXIMUM RATINGS (T = 25 C, unless otherwise noted) C PARAMETER SYMBOL LIMIT UNIT Drain-source voltage V 500 DS V Gate-source voltage V 30 GS T = 25 C 18 C a Continuous drain current (T = 150 C) V at 10 V I J GS D T = 100 C 11 A C b Pulsed drain current I 72 DM Linear derating factor 1.8 W/C c Single pulse avalanche energy E 361 mJ AS Maximum power dissipation P 223 W D d Reverse diode dv/dt dv/dt 5 V/ns Operating junction and storage temperature range T , T -55 to +150 J stg C d Soldering recommendations (peak temperature) For 10 s 300 Notes a. Drain current limited by maximum junction temperature b. Repetitive rating pulse width limited by maximum junction temperature c. V = 50 V, starting T = 25 C, L = 2.5 mH, R = 25 , I = 17 A DD J g AS d. I 18 A, di/dt 380 A/s, V V , T 150 C SD DD DS J e. 1.6 mm from case THERMAL RESISTANCE RATINGS PARAMETER SYMBOL TYP. MAX. UNIT Maximum junction-to-ambient R -62 thJA C/W Maximum junction-to-case (drain) R -0.56 thJC S17-1726-Rev. E, 20-Nov-17 Document Number: 91374 1 For technical questions, contact: hvm vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000SiHP18N50C www.vishay.com Vishay Siliconix SPECIFICATIONS (T = 25 C, unless otherwise noted) J PARAMETER SYMBOLTEST CONDITIONS MIN.TYP.MAX.UNIT Static Drain-source breakdown voltage V V = 0 V, I = 250 A 500 - - V DS GS D V temperature coefficient V /T Reference to 25 C, I = 1 mA - 0.6 - V/C DS DS J D Gate-source threshold voltage (N) V V = V , I = 250 A 3.0 - 5.0 V GS(th) DS GS D Gate-source leakage I V = 30 V - - 100 nA GSS GS V = 500 V, V = 0 V - - 25 DS GS Zero gate voltage drain current I A DSS V = 400 V, V = 0 V, T = 125 C - - 250 DS GS J Drain-source on-state resistance R V = 10 V I = 10 A - 0.225 0.270 DS(on) GS D a Forward transconductance g V = 50 V, I = 10 A - 6.4 - S fs DS D Dynamic Input capacitance C - 2451 2942 iss V = 0 V, GS Output capacitance C V = 25 V, - 300 360 pF oss DS f = 1 MHz Reverse transfer capacitance C -26 32 rss Total gate charge Q -65 76 g Gate-source charge Q -2V = 10 V I = 18 A, V = 400 V1- nC gs GS D DS Gate-drain charge Q -29- gd Turn-on delay time t -80 - d(on) Rise time t -27 - r V = 250 V, I = 18 A, DD D ns V = 10 V, R = 7.5 Turn-off delay time t GS g -32 - d(off) Fall time t -44 - f Gate input resistance R f = 1 MHz, open drain - 1.1 - g Drain-Source Body Diode Characteristics MOSFET symbol D Continuous source-drain diode current I -- 18 S showing the A integral reverse G p - n junction diode Pulsed diode forward current I -- 72 S SM T = 25 C, I = 18 A, V = 0 V - - 1.5 V Diode forward voltage V SD J S GS Reverse recovery time t -503 - ns rr T = 25 C, I = I , J F S Reverse recovery charge Q -6.7 - C rr , V di/dt = 100 A/s = 35 V R Reverse recovery current I -30 - A RRM Notes a. Repetitive rating pulse width limited by maximum junction temperature The information shown here is a preliminary product proposal, not a commercial product datasheet. Vishay Siliconix is not committed to produce this or any similar product. This information should not be used for design purposes, nor construed as an offer to furnish or sell such products. S17-1726-Rev. E, 20-Nov-17 Document Number: 91374 2 For technical questions, contact: hvm vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000

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8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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