333 3 THJP www.vishay.com Vishay Dale Thin Film TM ThermaWick Thermal Jumper Surface Mount Chip FEATURES Electrically isolated thermal conductor High thermal conductivity AlN substrate Available (170 W/mK) Available Electrically isolated terminations (> 999 M ) Low capacitance Available with SnPb or lead (Pb)-free wrap terminations Available Material categorization: for definitions of compliance please see www.vishay.com/doc 99912 LINKS TO ADDITIONAL RESOURCES APPLICATIONS Power supplies and converters 3D Models RF amplifiers THJP surface mount chips are designed to provide an Synthesizers electrically isolated thermal conductive pathway to a ground Switch mode power supplies plane or heat sink while maintaining the electrical isolation of the device. The devices are constructed with aluminum Pin and laser diodes nitride substrates in both SnPb and Pb-free wraparound Filters termination styles. The low capacitance of the device make s them an excellent choice for high frequency and thermal ladder applications. Custom sizes available. CONSTRUCTION Solder coating Nickel termination Aluminum nitride substrate HEAT TRANSFER DEMONSTRATION Chip surface temperature was measured using a FLIR SC645 thermal imaging system under ambient conditions. The devices were mounted to an FR4 test card designed with a 25 mm x 19 mm copper heat sink. Power was supplied to device to cause the surface temperature to stabilize at 150 C. The device was then retested at the same power level with the thermal jumper connecting the device to the heat sink. Example THJP 1206 Thermal Jumper Showing 36 % Surface Temperature Reduction Thermal jumper location Ceramic Resistor Chip Without Thermal Jumper (149.8 C) Ceramic Chip Resistor With Thermal Jumper (95.5 C) Revision: 08-Apr-2020 Document Number: 60157 1 For technical questions, contact: thinfilm vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000 DDD D THJP www.vishay.com Vishay Dale Thin Film DIMENSIONS in inches W L T D D CASE SIZE L W T D 0603 0.061 0.005 0.033 0.005 0.030 0.005 0.015 0.005 0612 0.063 0.005 0.126 0.005 0.030 0.005 0.015 0.005 0805 0.079 0.005 0.047 0.005 0.030 0.005 0.020 0.005 1206 0.126 0.005 0.063 0.005 0.030 0.005 0.020 0.005 1225 0.126 0.005 0.252 0.005 0.030 0.005 0.020 0.005 2512 0.252 0.005 0.126 0.005 0.030 0.005 0.020 0.005 TYPICAL CHARACTERISTICS CASE SIZE 0603 0612 0805 1206 1225 2512 Thermal resistance (C/W) 14 4 13 15 4 15 Thermal conductance (mW/C) 70 259 77 65 259 65 Capacitance (pF) 0.07 0.26 0.15 0.07 0.26 0.07 Dielectric withstanding voltage kVAC, > 1.5> 1.5> 1.5> 1.5> 1.5> 1.5 RMS (60 Hz) STANDARD MATERIAL SPECIFICATIONS Substrate material Aluminum nitride (170 W/mK) Termination (tin / lead) Electroplate tin / lead over electroplate nickel Termination (lead (Pb)-free) Electroplate tin (e3) over electroplate nickel GLOBAL PART NUMBER INFORMATION New Global Part Numbering: THJP1206AST1 TH J P 1 2 06 A S T 1 GLOBAL MODEL CASE SIZE THICKNESS TERMINATION PACKAGING THJP 0603 A = 0.030 B = wraparound Sn/Pb solder BS = BULK 100 min., 1 mult. 0805 with nickel termination 0612 S = wraparound Sn (e3) solder TAPE AND REEL 1206 with nickel termination T0 = 100 min., 100 mult. 1225 RoHS compliant T1 = 1000 min., 1000 mult. 2512 T3 = 300 min., 300 mult. T5 = 500 min., 500 mult. TF = full reel TS = 100 min., 1 mult. TI = 100 min., 1 mult. (item single lot date code) TP = 100 min., 1 mult. (package unit single lot date code) Revision: 08-Apr-2020 Document Number: 60157 2 For technical questions, contact: thinfilm vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000