VSM Series (0805, 1206, 1506, 2010, 2512) Vishay Foil Resistors High Precision Foil Wraparound Surface Mount Chip Resistor with TCR of 2 ppm/C and Load Life Stability of 0.01 % (100 ppm) FEATURES Temperature coefficient of resistance (TCR): 2.0 ppm/C typical (- 55 C to + 125 C, + 25 C ref.) (see table 1) Tolerance: to 0.01 % Power rating: to 400 mW at + 70 C Load life stability: to 0.01 % at 70 C, 2000 h at rated power Resistance range: 10 to 125 k (for higher and lower Top View values, please contact us) Vishay Foil resistors are not restricted to standard values, we can supply specific as required values at no extra cost INTRODUCTION or delivery (e.g. 1K2345 vs. 1K) Bulk Metal Foil (BMF) technology out-performs all other Fast thermal stabilization < 1 s Electrostatic discharge (ESD) up to 25 000 V resistor technologies available today for applications that Short time overload: 0.01 % require high precision and high stability, and allows Non inductive, non capacitive design production of customer oriented products designed to satisfy Rise time: 1 ns effectively no ringing challenging and specific technical requirements. Current noise: - 42 dB The BMF provides an inherently low and predictable Voltage coefficient < 0.1 ppm/V Temperature Coefficient of Resistance (TCR) and excellent Non inductive: < 0.08 H load life stability for high precision analog applications. Non hot spot design Terminal finishes available: lead (Pb)-free, tin/lead alloy Model VSM offers low TCR, excellent load life stability, tight Compliant to RoHS directive 2002/95/EC tolerance, excellent shelf life stability, low current noise and Matched sets are available per request low voltage coefficient, all in the same resistor. Prototype quantities available in just 5 working days The VSM has a full wraparound termination which ensures or sooner. For more information, please contact foil vishaypg.com safe handling during the manufacturing process, as well as For better performances please review VSMP and providing stability during multiple thermal cyclings. VFCP Series datasheets Our application engineering department is available to APPLICATIONS advise and make recommendations. For non-standard Automatic test equipment (ATE) technical requirements and special applications, please High precision instrumentation contact us using the e-mail address in the footer below. Laboratory, industrial and medical Audio EB applications (electron beam scanning and recording TABLE 1 - TOLERANCE AND TCR VS. (1) equipment, electron microscopes) RESISTANCE VALUE Down hole instrumentation (- 55 C to + 125 C, + 25 C Ref.) Communication RESISTANCE TYPICAL TCR AND TOLERANCE VALUE MAX. SPREAD (%) FIGURE 1 - POWER DERATING CURVE () (ppm/C) 250 to 125K 0.01 2 2 - 55 C + 70 C 100 100 to < 250 0.02 2 3 50 to < 100 0.05 2 3 75 25 to < 50 0.1 2 4 50 10 to < 25 0.25 2 6 25 Note (1) 0 For tighter performances and non-standard values up to 150K, - 75 - 50 - 25 0 + 25 + 50 + 75 + 100 + 125 + 150 + 175 please contact Vishay application engineering using the e-mail Ambient Temperature (C) address in the footer below. * Pb containing terminations are not RoHS compliant, exemptions may apply Document Number: 63070 For any questions, contact: foil vishaypg.com www.foilresistors.com Revision: 25-Mar-10 1 Percent of Rated Power VSM Series (0805, 1206, 1506, 2010, 2512) Vishay Foil Resistors FIGURE 3 - TYPICAL RESISTANCE/ FIGURE 2 - TRIMMING TO VALUES TEMPERATURE CURVE (Conceptual Illustration) (For more Details, see Table 1) + 150 + 100 2 ppm/C + 50 Current Path (+ 25 C reference) Interloop Capacitance R Before Trimming Reduction in Series 0 R (ppm) - 50 Current Path After Trimming Mutual Inductance - 100 Trimming Process Reduction due Removes this Material to Change in - 150 from Shorting Strip Area Current Direction Changing Current Path - 200 and Increasing - 50 - 25 0 + 25 + 50 + 75 + 100 + 125 Resistance - 55 Ambient Temperature (C) and TCR Chord Slopes for Different Temperature Ranges Note: Foil shown in black, etched spaces in white Note The TCR values for < 100 are influenced by the termination composition and result in deviation from this curve. TABLE 2 - DIMENSIONS AND LAND PATTERN in Inches (Millimeters) Top View Recommended Land Pattern L Footprint X G W T Z D L W THICKNESS D (1) (1) (1) CHIP SIZE Z G X 0.005 (0.13) 0.005 (0.13) MAXIMUM 0.005 (0.13) 0805 0.080 (2.03) 0.050 (1.27) 0.025 (0.64) 0.015 (0.38) 0.122 (3.10) 0.028 (0.71) 0.050 (1.27) 1206 0.126 (3.20) 0.062 (1.57) 0.025 (0.64) 0.020 (0.51) 0.175 (4.45) 0.059 (1.50) 0.071 (1.80) 1506 0.150 (3.81) 0.062 (1.57) 0.025 (0.64) 0.020 (0.51) 0.199 (5.05) 0.083 (2.11) 0.071 (1.80) 2010 0.198 (5.03) 0.097 (2.46) 0.025 (0.64) 0.025 (0.64) 0.247 (6.27) 0.115 (2.92) 0.103 (2.62) 2512 0.249 (6.32) 0.127 (3.23) 0.025 (0.64) 0.032 (0.81) 0.291 (7.39) 0.150 (3.81) 0.127 (3.23) Note (1) Land pattern dimensions are per IPC-7351A TABLE 3 - SPECIFICATIONS RATED POWER (mW) MAX. WORKING VOLTAGE RESISTANCE RANGE MAXIMUM WEIGHT CHIP SIZE at + 70 C ( PR ) () (mg) 0805 100 28 V 10 to 8K 6 1206 150 61 V 10 to 25K 11 1506 200 78 V 10 to 30K 12 2010 300 145 V 10 to 70K 27 2512 400 220 V 10 to 125K 40 TABLE 4 - PERFORMANCES MIL-PRF-55342 TYPICAL MAXIMUM TEST OR CONDITIONS (1) CHARACTERISTIC E R LIMITS R LIMITS R LIMITS Thermal Shock, 100 x (- 65 C to + 150 C) 0.1 % 0.005 % (50 ppm) 0.02 % (200 ppm) Low Temperature Operation, - 65 C, 45 min at P 0.1 % 0.01 % (100 ppm) 0.02 % (200 ppm) nom Short Time Overload, 6.25 x Rated Power, 5 s 0.1 % 0.01 % (100 ppm) 0.02 % (200 ppm) High Temperature Exposure, + 150 C, 100 h 0.1 % 0.01 % (100 ppm) 0.03 % (300 ppm) Resistance to Soldering Heat 0.2 % 0.005 % (50 ppm) 0.01 % (100 ppm) Moisture Resistance 0.2 % 0.005 % (50 ppm) 0.03 % (300 ppm) Load Life Stability + 70 C for 2000 h at Rated Power 0.5 % 0.005 % (50 ppm) 0.01 % (100 ppm) Note (1) As shown + 0.01 to allow for measurement errors at low values. www.foilresistors.com For any questions, contact: foil vishaypg.com Document Number: 63070 2 Revision: 25-Mar-10