WTS001 p50-68 6/14/07 10:46 AM Page 64 Accessory Products THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with 120 SERIES a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal resistance of only 0.05C/W for a 0.001 in. film with an area of one square inch. There is no measurable increase in case tem- perature of a mounted semiconductor on a heat sink after the 6-month stabilization period (Time versus Thermal Resistivity graph below). TYPICAL VALUES FOR THERMAL RESISTANCE, 120 SERIES - THERMAL JOINT COMPOUND CASE TO SINK ( ) WHEN THERMAL JOINT cs Characteristic Description COMPOUNDS ARE USED 14 Typical Volume Resistivity 5 X 10 ohm-cm Mounting Torque Thermal Dielectric Strength 225 volts/mil in inch pounds Resistance Case Style Characteristics (NM) (C/W) Specific Gravity 2.1 min. T0-3 8 (0.9) 0.09 Thermal Conductivity 36C 0.735 W/(m)(K) 2 TO-66 9 (0.9) 0.14 5.1(Btu) (in.)/(hr)(ft )(F) TO-220 8 (0.9) 0.50 Thermal Resistivity (P) 56 (C)(in.)/watt 0.19 (4.8) stud x 0.44 (11.2) hex 15 (1.7) 0.16 Bleed, % after 24 hrs 200C 0.5 0.25 (6.4) stud x 0.69 (17.5) hex 30 (3.39) 0.10 Evaporation, % after 24 hrs 200C 0.5 0.38 (9.7) stud x 1.06 (26.9) hex 75 (8.47) 0.07 Color opaque white 0.50 (12.7) stud x 1.06 (26.9) hex 125 (14.12) 0.07 Shelf life 5 years 0.75 (19.1) stud x 1.25 (31.8) hex 600 (67.79) 0.052 Operating Temperature Range (C) -40/+200 120 SERIES - ORDER GUIDE Series - Container Size P/N 120-SA 4 gram plastic pak 120-2 2 oz (0.06 kg) jar 120-5 5 oz (0.14 kg) tube 120-8 8 oz (0.23 kg) jar 120-80 5 lb (2.27 kg) can 120-320 20 lb (9.08 kg) can HIGH PERFORMANCE THERMAL COMPOUND 122 Series Thermal Joint Compound is a stable, silicone based, thixotropic paste developed to provide premium 122 SERIES performance at an affordable price. It is formulated to significantly reduce contact thermal resistance where power densities are concentrated in devices such as flip chip, reduced die size, and overclock microprocessors. When applied as a thin film between a Wakefield heat sink and device it possesses superior thermal conductivity compared to traditional grease. It is compatible with automated or manual dispensing methods and is fully RoHS compliant. 122 SERIES - ORDER GUIDE 122 SERIES THERMAL JOINT COMPOUND Series - Container Size Typical Characteristics Description P/N Appearance Smooth Gray paste 122-10CC 10cc syringe Thermal Conductivity 2.5 W / m K, 122-2 2 oz (0.06 kg) jar 2 0 17.3 (Btu) (in.)/(hr) (ft ) ( F) 122-30CC 30cc syringe Thermal Resistance 0.02 C in 2 / W Bleed 0.015 wt%, 24 hrs at 200C Evaporation 0.150 wt%, 24 hrs at 200C 10 Volume Resistivity 1.4 x 10 ohm-cm Dielectric Strength 225 volts/mil Specific Gravity 2.23 (gm/cc) at 25C Operating Range -40C to 205C Shelf Life 5 years 64WTS001 p50-68 6/14/07 10:46 AM Page 65 Accessory Products THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS The 126 Series is a nontoxic, synthetic, ester-based (nonsilicone) Thermal Joint Compound with metal oxide 126 SERIES fillers designed to enhance thermal performance characteristics of plastic and metal package devices exceeding that of silicone-based compounds. Solved are problems associated with contamination of wave solder baths and migration of silicone-based products. Shelf life: 5 years. 126 SERIES THERMAL JOINT COMPOUND 126 SERIES - ORDER GUIDE Characteristics Description Series - Container Size P/N Appearance Smooth, white homogeneous paste 126-2 2 oz (0.6 kg) jar Solids Content, wt % 65% min 0 2 126-4 4 oz (0.11 kg) tube Thermal Conductivity at 36C .69 W / m K, 4.8 (Btu)(in.)/(hr) (ft ) (F) 126-4S 4 oz (0.11 kg) syringe Interface Thermal Resistance 0.043C/W TO-3 at 0.0008 thick film 126-5LB 5 lb (2.27 kg) can Bleed, 24 hrs at 200C, wt% 0.09% max Evaporation, 24 hrs at 200C, wt% 0.6 max 12 Volume Resistivity 2.3 x 10 ohms-cm Dielectric Strength 200 volts/mil Specific Gravity 60F 2.93 (gm/cc) Penetration 280 to 320 Operating Range -40C to 200C DeltaBond 152 adhesive is ideal for general cementing thermally bonding semiconductors and components to DeltaBond 152 chassis or heat sinks, while electrically isolating one from the other fabricating heat sinks or thermal links and for all permanent bonding of assemblies which require high thermally conductive interfaces. It produces a rigid, high strength bond to most materials when cured. DeltaBond 152 is available in bi-packs, kits, and quarts. Order one bottle of hardener A-4 or B-4 per one quart of DeltaBond 152 separately. Shelf life: 152KA 1 year, all others 2 years. DELTABOND152 DELTABOND152 Characteristics Hardener Type Mixing Proportions and Working Properties Typical Properties Fully Cured A4 B4 Characteristics A4 B4 Thermal conductivity - Parts of hardener per 100 parts of resin by weight 7.5 3.5 W/(m) (K) 0.836 0.908 2 (Btu) (in.)/(hr) (ft ) (F) 5.8 6.3 *Working Time - at 77F 45 min 30 min Thermal resistivity - (C) (in.)watt 47 42 Initial cure time 77F 8 hrs 6 hrs Bond shear strength 77F 2,900 2,300 150F 45 min 30 min 1 in. overlap - psi 125F 2,200 2,000 etched aluminum to 250F 20 min 15 minn etched aluminum 212F 400 800 Post-cure time at a temp in F 4 hrs 200F 4 hrs 200F Heat distortion point - F 130 225 Alternate room temp. aging 4 days 4 days Minimum dielectric strength, time at 77F v/mil, 0.125 in. sample 400 400 Working consistency (77F) viscous liquid paste Max operation Continuous 65 150 temp - C Intermittent 100 190 Working viscosity (77F) cps 25,000 DELTABOND152 Ordering Guide - Resin and Hardener Model Resin Hardener Number Part No. Container Part Number 152-1A Bi-Pack (1 oz) Included in PIN 152-1 A (A-4) Type All hardener DeltaBond 152 152-1B Bi-Pack (1 oz) Included in P/N 152-1 B (B-4) Type part numbers 152-KA Kit (7 oz Resin, 0.5 oz Hardener) lncluded in P/N 152-KA A-4, B-4 152-Q 1 quart (4 lbs) A-4 (0.316 lb), B-4 (0.14 lb), (order 1 only) NOTES: * Since the hardener/resin reaction is exothermic, it is important that batch size be matched to hardener speed. Working times given are for approximate batch sizes: A200 gms, B200 gms. Larger batch sizes will greatly reduce working time. ** For optimum electrical properties, dry parts for 15 minutes at 150F (65C) or 30 minutes at 75F (24C) to slowly evaporate the thinner and then final cure for 4 hours at 275F (135C). After initial cure, material may be handled, removed from fixture, etc., but has not yet achieved full properties and should be room temperature aged or post-cured as shown to achieve full physical and electrical properties. After initial cure, material may be brought to full physical and electrical properties during post-cure or may be room temperature aged for charted length of time to achieve same full properties. The information contained herein is based on data believed to be reliable but we do not assume responsibility for accuracy. All such information is used at the customer s own risk, conditions of use being beyond our control. 65