Product Information

175-6-410P

175-6-410P electronic component of Wakefield

Datasheet
Thermal Interface Products Greaseless Conductive Kapton Reinforced Insulators for DO-4/DO-5, 0.006", Grey

Manufacturer: Wakefield
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 2.0044 ea
Line Total: USD 2

1620 - Global Stock
Ships to you between
Fri. 31 May to Tue. 04 Jun
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
2723 - WHS 1


Ships to you between Mon. 27 May to Fri. 31 May

MOQ : 25
Multiples : 25

Stock Image

175-6-410P
Wakefield

25 : USD 2.3494
100 : USD 1.6144
250 : USD 1.6013
500 : USD 1.5225
1000 : USD 1.5094
3000 : USD 1.5094
5000 : USD 1.4962
8000 : USD 1.4831

1620 - WHS 2


Ships to you between Fri. 31 May to Tue. 04 Jun

MOQ : 1
Multiples : 1

Stock Image

175-6-410P
Wakefield

1 : USD 2.0044
10 : USD 1.8958
100 : USD 1.618
1000 : USD 1.4611
2000 : USD 1.4611
25000 : USD 1.4128

2716 - WHS 3


Ships to you between Mon. 27 May to Fri. 31 May

MOQ : 50
Multiples : 25

Stock Image

175-6-410P
Wakefield

50 : USD 3.2363
100 : USD 2.1833
250 : USD 2.1268
500 : USD 1.9868
1000 : USD 1.9356

2716 - WHS 4


Ships to you between Mon. 27 May to Fri. 31 May

MOQ : 50
Multiples : 25

Stock Image

175-6-410P
Wakefield

50 : USD 3.2363
100 : USD 2.1833
250 : USD 2.1268
500 : USD 1.9868
1000 : USD 1.9356

     
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THERMAL INTERFACE PRODUCTS THERMAL INTERFACE PRODUCTS Thermal Compounds, Adhesives & Interface Materials ...... 140145 High Performance Thermal Compound ........................... 140 General & Thermal High Performance Epoxy .................... 146155 Cost-effective accessory products that facilitate installation and improve the thermal performance of both standard and custom heat dissipation components. Included are thermal joint compounds filled epoxy systems adhesives thermally conductive insulating wafers, washers, pads and mounting hardware.THERMAL THERMAL INTERFACE PRODUCTS INTERFACE PRODUCTS THERMAL COMPOUNDS, ADHESIVES & INTERFACE MATERIALS THERMAL COMPOUNDS, ADHESIVES & INTERFACE MATERIALS 120 SERIES 126 SERIES The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating The 126 Series is a nontoxic, synthetic, ester-based (nonsilicone) Thermal Joint Compound with metal surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent oxide fillers designed to enhance thermal performance characteristics of plastic and metal package thermal resistance of only 0.05C/W for a 0.001 in. film with an area of one square inch. There is no devices exceeding that of silicone-based compounds. Solved are problems associated with contamination measurable increase in case temperature of a mounted semiconductor on a heat sink after the 6-month of wave solder baths and migration of silicone-based products. Shelf life: 5 years. stabilization period (Time versus Thermal Resistivity graph below). 126 SERIES THERMAL JOINT COMPOUND 120 SERIES - THERMAL JOINT COMPOUND TYPICAL VALUES FOR THERMAL RESISTANCE, Characteristics Description CASE TO SINK (cs) WHEN THERMAL JOINT Characteristic Description Appearance Smooth, white homogeneous paste 126 SERIES - ORDER GUIDE COMPOUNDS ARE USED 14 Volume Resistivity 5 X 10 Solids Content, wt % 65% min ohm-cm Series - P/N Container Size Typical 0 2 Dielectric Strength 225 volts/mil Thermal Conductivity at 36C .69 W / m K, 4.8 (Btu)(in.)/(hr) (ft ) (F) Mounting Torque Thermal 126-2 2 oz (0.6 kg) jar Specific Gravity 2.1 min. Interface Thermal Resistance 0.043C/W TO-3 at 0.0008 thick film in inch pounds Resistance 126-4 4 oz (0.11 kg) tube Thermal Conductivity 36C 0.735 W/(m)(K) Bleed, 24 hrs at 200C, wt% 0.09% max Case Style Characteristics (NM) (C/W) 2 5.1(Btu) (in.)/(hr)(ft Evaporation, 24 hrs at 200C, wt% 0.6 max 126-4S 4 oz (0.11 kg) syringe )(F) 12 Thermal Resistivity (P) 56 (C)(in.)/watt Volume Resistivity 2.3 x 10 ohms-cm 126-5LB 5 lb (2.27 kg) can TO-3 8 (0.9) 0.09 Bleed, % after 24 hrs 200C 0.5 Dielectric Strength 200 volts/mil TO-66 9 (0.9) 0.14 Evaporation, % after 24 hrs 200C 0.5 Specific Gravity 60F 2.93 (gm/cc) TO-220 8 (0.9) 0.50 Color opaque white Penetration 280 to 320 0.19 (4.8) stud x 0.44 (11.2) hex 15 (1.7) 0.16 Shelf life 5 years Operating Range -40C to 200C 0.25 (6.4) stud x 0.69 (17.5) hex 30 (3.39) 0.10 Operating Temperature Range (C) -40/+200 0.38 (9.7) stud x 1.06 (26.9) hex 75 (8.47) 0.07 0.50 (12.7) stud x 1.06 (26.9) hex 125 (14.12) 0.07 0.75 (19.1) stud x 1.25 (31.8) hex 600 (67.79) 0.052 DELTABOND 152 120 SERIES - ORDER GUIDE DeltaBond 152 adhesive is ideal for general cementing thermally bonding semiconductors and Series - P/N Container Size components to chassis or heat sinks, while electrically isolating one from the other fabricating heat sinks 120-SA 4 gram plastic pak or thermal links and for all permanent bonding of assemblies which require high thermally conductive 120-2 2 oz (0.06 kg) jar interfaces. It produces a rigid, high strength bond to most materials when cured. DeltaBond 152 120-5 5 oz (0.14 kg) tube is available in bi-packs, kits, and quarts. Order one bottle of hardener A-4 or B-4 per one quart of 120-8 8 oz (0.23 kg) jar DeltaBond 152 separately. Shelf life: 152KA 1 year, all others 2 years. 120-80 5 lb (2.27 kg) can 120-320 20 lb (9.08 kg) can DELTABOND152 DELTABOND 152 Mixing Proportions and Working Properties Characteristics Hardener Type Characteristics A4 B4 Typical Properties Fully Cured A4 B4 Parts of hardener per 100 parts Thermal conductivity - of resin by weight 7.5 3.5 W/(m) (K) 0.836 0.908 2 *Working Time - at 77F 45 min 30 min (Btu) (in.)/(hr) (ft ) (F) 5.8 6.3 Initial cure time 77F 8 hrs 6 hrs Thermal resistivity - (C) (in.) watt 47 42 HIGH PERFORMANCE THERMAL 150F 45 min 30 min Bond shear strength 77F 2,900 2,300 250F 20 min 15 min 1 in. overlap - psi 125F 2,200 2,000 COMPOUND Post-cure time at a temp in F 4 hrs 200F 4 hrs 200F etched aluminum to 122 SERIES Alternate room temp. aging 4 days 4 days etched aluminum 212F 400 800 time at 77F Heat distortion point - F 130 225 Working consistency (77F) viscous liquid paste Minimum dielectric strength, 122 Series Thermal Joint Compound is a stable, silicone based, thixotropic paste developed to Working viscosity (77F) cps 25,000 v/mil, 0.125 in. sample 400 400 provide premium performance at an affordable price. It is formulated to significantly reduce contact Max operation Continuous 65 150 temp - C Intermittent 100 190 thermal resistance where power densities are concentrated in devices such as flip chip, reduced die size, and overclock microprocessors. When applied as a thin film between a Wakefield-Vette heat sink and device it possesses superior thermal conductivity compared to traditional grease. It is compatible DELTABOND152 NOTES: with automated or manual dispensing methods and is fully RoHS compliant. Ordering Guide - Resin and Hardener * Since the hardener/resin reaction is Resin Hardener Model 122 SERIES THERMAL JOINT COMPOUND exothermic, it is important that batch 122 SERIES - ORDER GUIDE Number Part No. Container Part Number size be matched to hardener speed. Typical Characteristics Description Series - P/N Container Size Working times given are for approximate 152-1A Bi-Pack (1 oz) Included in PIN 152-1 A (A-4) Type Appearance Smooth Gray paste batch sizes: A200 gms, B200 gms. 122-10CC 10cc syringe DeltaBond 152 152-1B Bi-Pack (1 oz) Included in P/N 152-1 B (B-4) Type Thermal Conductivity 2.5 W / m K, Larger batch sizes will greatly reduce 122-2 2 oz (0.06 kg) jar 152-KA Kit (7 oz Resin, 0.5 oz Hardener) lncluded in P/N 152-KA 2 17.3 (Btu) (in.)/(hr) (ft working time. ) (F) 122-30CC 30cc syringe 152-Q 1 quart (4 lbs) A-4 (0.316 lb), B-4 (0.14 lb), (order 1 only) Thermal Resistance 0.02 C in 2 / W ** For optimum electrical properties, dry All hardener part numbers: A-4, B-4 Bleed 0.015 wt%, 24 hrs at 200C parts for 15 minutes at 150F (65C) Evaporation 0.150 wt%, 24 hrs at 200C or 30 minutes at 75F (24C) to slowly Volume Resistivity 1.4 x 1010 ohm-cm evaporate the thinner and then final cure for 4 hours at 275F (135C). Dielectric Strength 225 volts/mil After initial cure, material may be handled, removed from fixture, etc., but has not yet achieved full properties Specific Gravity 2.23 (gm/cc) at 25C and should be room temperature aged or post-cured as shown to achieve full physical and electrical properties. Operating Range -40C to 205C After initial cure, material may be brought to full physical and electrical properties during post-cure or may be Shelf Life 5 years room temperature aged for charted length of time to achieve same full properties. The information contained herein is based on data believed to be reliable but we do not assume responsibility for accuracy. All such information is used at the customers own risk, conditions of use being beyond our control. 140 141

Tariff Desc

8547.9 TC 8535449 SHEETING OR SHAPES, electrically insulating, thermally conductive,
being combinations of two OR more of the following:
(a) silicone rubber;
(b) glass fibre;
(c) boron nitride;
(d) polyimide;
(e) copper
WAK
Wakefield Engineering
WAKEFIELD SOLUTIONS
WAKEFIELD THERMAL
Wakefield Thermal Solutions
Wakefield Thermal Solutions, Inc.
Wakefield-Vette
Wakefield-Vette, Inc

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