BOARD LEVEL
HEAT SINKS
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
2
D PAK, TO-220, SOL-20
216 SERIES Surface Mount Heat Sinks
Standard Height Above Package Package Thermal Performance at Typical Load
P/N PC Board Footprint Dimensions Format Quantity Natural Convection Forced Convection
216-40CT .390 in. (9.9) .600 in. (15.2) x .740 in. (18.8) Bulk 1 55C @ 1W 16.0C/W @ 200 LFM
216-40CTT .390 in. (9.9) .600 in. (15.2) x .740 in. (18.8) Tube 25 55C @ 1W 16.0C/W @ 200 LFM
216-40CTR .390 in. (9.9) .600 in. (15.2) x .740 in. (18.8) Tape & Reel 250 55C @ 1W 16.0C/W @ 200 LFM
2
Increase the power dissipation level of D PAK, TO-220, SOL-20 and other surface mount power components while maintaining the benefits of
high-speed, automated pick and place assembly technology. The patented 216 Series heat sink is mounted astride the component and solder
reflowed to the PCB using standard board assembly equipment (Fuji, Philips, etc.) and processes. This creates a very low thermal resistance path
PATENT 361317
from the component tab to the heat sink and in turn to the ambient air which lowers junction temperatures for reliable operation. Available in bulk,
tube or tape & reel packaging which meet EIA Standards and ESD protection requirements. Material: Copper, tin-lead plated.
MECHANICAL DIMENSIONS 2
216-40CTR RECOMMENDED COPPER FOOTPRINT 6 LAYER BOARD, D PAK
A
USE MAX
125C LEAD, 40C AMBIENT
.660
.640
.740 COPPER
(16.8)
(16.3) AIR VELOCITY (LFM)
TO ALLOW
(18.8)
MAX
0 100 200 300 400 500
.060
CONDUCTION 7
TAPE (1.5)
TO HEAT SINK .660
DETAILS
(16.8)
6
216-40CT
.600
.640
(15.2)
A (16.3) 5
SECTION
A-A COPPER FOOTPRINT
4
FOR HEAT SINK
.626
(15.9)
MIN COPPER
3
FOR HEAT
.020
.600
SINK
(0.5)
.640 (15.2)
1.260 2
.768
(16.3)
(32.0) .390 REF:
(19.5)
2
(9.9) JEDEC TO-263 D PAK
.390 1
JEDEC TO-220AB
.215 (9.9) AIR PERPENDICULAR TO FINS
JEDEC TO-261AA
(5.5) .945
AIR PARALLEL TO FINS
.215 .020 JEDEC MO-184
13.000
.215
(24.0)
JEDEC MS-013
(5.5) (0.5) NO HEAT SINK
.600 (330.2)
(5.5)
JEDEC MS-025
(15.2) .409
REEL
(10.4)
DETAILS
NATURAL CONVECTION
THERMAL PERFORMANCE
2
2
6 LAYER BOARD, D PAK
6 LAYER BOARD, D PAK
DATA
216-40CTT
125C LEAD, 40C AMBIENT
AIR VELOCITY (LFM)
POWER, W
NOTES:
0 100 200 300 400 500
30
1. ESD MATERIAL WITH PLUGS
100
2. LENGTH OF TUBE: 16.25 INCHES
3. QUANTITY PER TUBE: 25 PIECES 25
80
TUBE DETAILS
20
60
.390 .265
1.28
(9.9) .640 (6.7)
15
(16.3) (32.5)
40
10
20
.470
(11.9)
0
0
AIR PERPENDICULAR TO FINS
NOTES:
AIR PARALLEL TO FINS
1. ESD MATERIAL
HS, 2 IN. BOARD NO HS, 2 IN. BOARD
.350
2. EIA STANDARD, EIA-481-3
.840 (8.9) .025 HS, 4 IN. BOARD NO HS, 4 IN. BOARD
3. LENGTH OF REEL: APPROXIMATELY 6 METERS
(21.3) (0.6)
4. QUANTITY PER REEL: 250 PIECES
Dimensions: in. (mm)
TO-220
230 and 234 SERIES Compact, Wavesolderable Low-Profile Self-Locking Heat Sinks
Standard Height Above Mounting Solderable Mounting Thermal Performance at Typical Load
P/N PC Board Footprint Dimensions Configuration Tab Option Style Natural Convection Forced Convection
230-75AB .750 in. (19.1) .570 in. (14.5) x .500 in. (12.7) Vert./Horiz. No Tab Clip/Mtg Hole 57C @ 2W 7.5C/W @ 400 LFM
230-75AB-01 .750 in. (19.1) .570 in. (14.5) x .500 in. (12.7) Vertical 01 Clip/Mtg Hole 57C @ 2W 7.5C/W @ 400 LFM
230-75AB-05 .500 in. (12.7) .750 in. (19.1) x .570 in. (14.5) Horizontal 05 Clip/Mtg Hole 57C @ 2W 7.5C/W @ 400 LFM
230-75AB-10 .875 in. (22.2) .570 in. (14.5) x .500 in. (12.7) Vertical 10 Clip/Mtg Hole 57C @ 2W 7.5C/W @ 400 LFM
234-75AB .790 in. (20.0) .570 in. (14.5) x .500 in. (12.7) Vert./Horiz. No Tab Clip/Mtg Hole 57C @ 2W 7.5C/W @ 400 LFM
234-75AB-01 .790 in. (20.0) .570 in. (14.5) x .500 in. (12.7) Vertical 01 Clip/Mtg Hole 57C @ 2W 7.5C/W @ 400 LFM
PATENT PENDING
234-75AB-05 .500 in. (12.7) .790 in. (20.0) x .570 in. (14.5) Horizontal 05 Clip/Mtg Hole 57C @ 2W 7.5C/W @ 400 LFM
Compact, slim, labor-saving heat sinks with integral self locking features for TO-220 semiconductors. Their unique design (patent pending) ensures
uniform force applied to the component for effective and maximum thermal contact in horizontal or vertical mounting positions while eliminating
the need for fastening hardware. A mounting hole is available for hardware mounting when desired. The 230 and 234 Series can be used
interchangeably. The 234 Series has standoffs on the base of the heat sink. Specify solderable tab options by the addition of suffix 01, 05, or 10
to the standard part number (i.e. 230-75AB-01). Material: Aluminum, black anodized.
230-75AB-05
230 AND 234 SERIES
MECHANICAL DIMENSIONS
230 SERIES
230-75AB-01 230-75AB-10
.750
.570 MAX SUGGESTED TAB HOLE=
.500 .570 MAX
(19.1)
(14.5) .075 (1.9) (PLATED)
(12.7) (14.5)
WITH .100 (2.5) PAD
.125
230
(3.2)
and
234
.750
SERIES
NATURAL AND FORCED
.500
(19.1)
.250
(12.7) .375
.020 TAB 10 CONVECTION CHARACTERISTICS
(6.4)
(9.5) (0.5) .050 .032
.050 AIR VELOCITY (LFM)
(1.3)
(0.8)
(1.3) .063 .032 TAB 01 .165
0 200 400 600 800 1000
230-75AB (1.6) (0.8) .500 MIN
(4.2) 100 10
(12.7)
230/234
.500 .570 MAX .500 234 SERIES
80 8
.090
(12.7) (14.5) (12.7) 234-75AB-01
234-75AB
SUGGESTED TAB HOLE=
(2.3)
234-75AB-05
.075 (1.9) (PLATED) 60 6
2x.100 WITH .100 (2.5) PAD
.210 (2.5)
.720 .790 .720 .790
40 4
.430
(18.3) (20.1) (18.3) (20.1) (5.3) 230/234
.540
.370
(10.9)
(13.7) (9.4)
20 2
.032
(0.8) 0 0
.500
.032
.050 0 123 45
2x.125 (12.7)
.165
(0.8)
(1.3)
(3.2)
Dimensions: in. (mm) POWER DISSIPATION (WATTS)
(4.2)
Wakefield Engineering, Inc. Refer to Full Line Catalog for additional
60 Audubon Road, Wakefield, MA 01880 USA Board-Level Heat Sinks and
2
Tel: (617) 245-5900 Fax: (617) 246-0874 Thermal Accessory Products
TEMPERATURE RISE, C
HEAT SINK TEMPERATURE
RISE ABOVE AMBIENT AIR ( C)
POWER DISSIPATION, W
THERMAL RESISTANCE, C/W
THERMAL RESISTANCE
SINK TO AMBIENT ( C/WATT)
BOARD LEVEL
HEAT SINKS
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
TO-220
233 and 236 SERIES Self-Locking Wavesolderable Heat Sinks
Standard Height Above Mounting Solderable Mounting Thermal Performance at Typical Load
P/N PC Board Footprint Dimensions Configuration Tab Option Style Natural Convection Forced Convection
233-60AB .600 in. (15.2) .570 in. (14.5) x .500 in. (12.7) Vert./Horiz. No Tab Clip/Mtg Hole 58C @ 2W 11C/W @ 400 LFM
233-60AB-01 .600 in. (15.2) .570 in. (14.5) x .500 in. (12.7) Vertical 01 Clip/Mtg Hole 58C @ 2W 11C/W @ 400 LFM
233-60AB-05 .500 in. (12.7) .600 in. (15.2) x .570 in. (14.5) Horizontal 05 Clip/Mtg Hole 58C @ 2W 11C/W @ 400 LFM
233-60AB-10 .725 in. (18.4) .570 in. (14.5) x .500 in. (12.7) Vertical 10 Clip/Mtg Hole 58C @ 2W 11C/W @ 400 LFM
236-150AB 1.500 in. (38.1) .570 in. (14.5) x .500 in. (12.7) Vert./Horiz. No Tab Clip/Mtg Hole 40C @ 2W 4.8C/W @ 400 LFM
236-150AB-01 1.500 in. (38.1) .570 in. (14.5) x .500 in. (12.7) Vertical 01 Clip/Mtg Hole 40C @ 2W 4.8C/W @ 400 LFM
PATENT PENDING
236-150AB-05 .500 in. (12.7) 1.500 in. (38.1) x .570 in. (14.5) Horizontal 05 Clip/Mtg Hole 40C @ 2W 4.8C/W @ 400 LFM
236-150AB-10 1.625 in. (41.3) .570 in. (14.5) x .500 in. (12.7) Vertical 10 Clip/Mtg Hole 40C @ 2W 4.8C/W @ 400 LFM
Compact labor-saving heat sinks with integral self-locking features ensure uniform force applied to the component for maximum thermal contact.
No installation tools required. Specify solderable tab options by the addition of suffix 01, 05, or 10 to the standard part number (i.e. 233-60AB-01).
Material: Aluminum, black anodized.
MECHANICAL DIMENSIONS
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
233 AND 236 SERIES .570 MAX A
(14.5) AIR VELOCITY (LFM)
.570 MAX
.500
0 200 400 600 800 1000
.500 .160
(14.5) 100 15
(12.7)
.500
(12.7) (4.1)
2x.150
(12.7)
233
(3.8) 80 12
.500 TYP
(12.7)
60 236 9
.032 TAB 01 .020 TAB 10
(0.8) (0.5) .032
.050
(0.8) 40 6
(1.3) 233
233-60AB-01 233-60AB-10
1.500
236-150AB-01 236-150AB-10 .165 236
(38.1) 20 3
(4.2)
.570 MAX
.125
(14.5) 0 0
.500 MIN
.250 233-60AB-05
(3.2)
(12.7) 0 1 2 3 4 5
(6.4) 236-150AB-05
.500 TYP
POWER DISSIPATION (WATTS)
(12.7)
SERIES NUMBER LENGTH A
.600
(15.2) 233-60AB .600 (15.2)
.375
SUGGESTED TAB HOLE =
(9.5) 236-150AB 1.500 (38.1)
236-150AB
.075 (1.9) (PLATED)
WITH .100 (2.5) PAD
,050 .063
(1.5) Dimensions: in. (mm)
233-60AB (1.3)
TO-220
275 and 231 SERIES Compact, Stress-Free Labor-Saving Locking-Tab Heat Sinks
Standard Height Above Mounting Solderable Mounting Thermal Performance at Typical Load
1 2 1
P/N Ref PC Board Footprint Dimensions Configuration Tab Option Style Natural Convection Forced Convection
275-75AB .750 in. (19.1) .835 in. (21.2) x .400 in. (10.2) Vert./Horiz. No Tab Clip/Mtg Hole 44C @ 2W 7.9C/W @ 400 LFM
275-75AB-01 .750 in. (19.1) .835 in. (21.2) x .400 in. (10.2) Vertical 01 Clip/Mtg Hole 44C @ 2W 7.9C/W @ 400 LFM
275-75AB-10 .875 in. (22.2) .835 in. (21.2) x .400 in. (10.2) Vertical 10 Clip/Mtg Hole 44C @ 2W 7.9C/W @ 400 LFM
231-69PAB .690 in. (17.5) .835 in. (21.2) x .400 in. (10.2) Vert./Horiz. No Tab Clip/Mtg Hole 45C @ 2W 8C/W @ 400 LFM
231-69PAB-13H .400 in. (10.2) .690 in. (17.5) x .835 in. (21.2) Horizontal 13H Clip/Mtg Hole 45C @ 2W 8C/W @ 400 LFM
231-69PAB-XXX .690 in. (17.5) .835 in. (21.2) x .400 in. (10.2) Vertical 13V,14V,15V Clip/Mtg Hole 45C @ 2W 8C/W @ 400 LFM
PATENT 5381041
231-75PAB .750 in. (19.1) .835 in. (21.2) x .400 in. (10.2) Vert./Horiz. No Tab Clip/Mtg Hole 43C @ 2W 7.9C/W @ 400 LFM
231-75PAB-13H .400 in. (10.2) .750 in. (19.1) x .835 in. (21.2) Horizontal 13H Clip/Mtg Hole 43C @ 2W 7.9C/W @ 400 LFM
231-75PAB-XXX .750 in. (19.1) .835 in. (21.2) x .400 in. (10.2) Vertical 13V,14V,15V Clip/Mtg Hole 43C @ 2W 7.9C/W @ 400 LFM
231-137PAB 1.375 in. (34.9) .835 in. (21.2) x .400 in. (10.2) Vert./Horiz. No Tab Clip/Mtg Hole 32C @ 2W 5.9C/W @ 400 LFM
231-137PAB-13H .400 in. (10.2) 1.375 in. (34.9) x .835 in. (21.2) Horizontal 13H Clip/Mtg Hole 32C @ 2W 5.9C/W @ 400 LFM
231-137PAB-XXX 1.375 in. (34.9) .835 in. (21.2) x .400 in. (10.2) Vertical 13V,14V,15V Clip/Mtg Hole 32C @ 2W 5.9C/W @ 400 LFM
Unique stress-free labor-saving locking-tab design ensures reliable device-to-heat-sink surface contact while providing rapid component
1
installation and removal without tools (See also 235 Series). Note : Specify solderable tab options by the addition of suffix 01, 10, 13H, 13V, 14V
2
or 15V to the standard part number (i.e. 231-75PAB-14V). Note : Add .125 in. (3.2) for TAB 15V. Material: Aluminum, pre-anodized black.
Dimple on 231-69, 275-75 Series only MECHANICAL DIMENSIONS 275 AND 231 SERIES
Dimple not
NATURAL AND FORCED
available on
CONVECTION CHARACTERISTICS
275-75 Series
AIR VELOCITY (LFM)
.855
Lance not
available (21.7)
.020 (0.5)
0 200 400 600 800 1000
100 20
on 231-69
275
and 275-
SERIES
275-75AB
75 Series
.025 (0.6) 80 16
A
231 TABS 13V, 14V, 15V
.835
SERIES SUGGESTED TAB HOLES
60 12
(21.2)
FOR ALL PART NUMBERS 231-75PAB
.020 (VERTICAL AND HORIZONTAL MOUNTING)=
TAB 13H
40 8
(0.5)
.075 (1.9) (PLATED) WITH .100 (2.5) PAD
.150 275-75AB
.855
.020 (0.5)
(3.8) 231-75PAB
.835 REF (21.7)
20 4
(TABS 13V, 14V, 15V)
(21.2)
HORIZONTAL MOUNT
VERTICAL MOUNT
All Versions No Tab 0 0
0 1 2 3 4 5
.400 REF POWER DISSIPATION (WATTS)
.400 REF
(10.2)
(10.2)
NATURAL AND FORCED
TAB
TAB
.125
CONVECTION CHARACTERISTICS
14V 13V
.125 REF (3.2)
,125
.375 (3.2) AIR VELOCITY (LFM)
(9.5) (3.2)
0 200 400 600 800 1000
100 20
.250
.375
(6.4)
.375 .032 (TAB01)
(9.5) 231-69PAB
(9.5) (0.8) 80 16
.050
.062 REF
.062 REF (1.3) .063
(1.6) TAB 01
(1.5)
(1.6) .020 (TAB10) 60 12
TAB 10
.125 (3.2) (0.5)
.185
(4.7) .185 (4.7)
40 8
231-69PAB
TAB 15V
TABS 01 AND 10
SERIES NO. DIM A DIM B
SUGGESTED TAB HOLE=
20 4
231-137PAB
231-137PAB
231-69PAB .690 (17.5) .345 (8.8) .075 (1.9) (PLATED)
.125
WITH .100 (2.5) (PAD)
(3.2)
231-75PAB .750 (19.1) .375 (9.5) 0 0
.400 REF
0 1 2 3 4 5
(10.2)
TAB 13H
275-75AB .750 (19.1)
POWER DISSIPATION (WATTS)
.062 REF 231-137PAB 1.375 (34.9) .688 (17.5)
Dimensions: in. (mm)
(1.6)
B
Refer to Full Line Catalog for additional Wakefield Engineering, Inc.
Board-Level Heat Sinks and 60 Audubon Road, Wakefield, MA 01880 USA
3
Thermal Accessory Products Tel: (617) 245-5900 Fax: (617) 246-0874
HEAT SINK TEMPERATURE
HEAT SINK TEMPERATURE
HEAT SINK TEMPERATURE
RISE ABOVE AMBIENT AIR ( C)
RISE ABOVE AMBIENT AIR ( C)
RISE ABOVE AMBIENT AIR ( C)
THERMAL RESISTANCE
THERMAL RESISTANCE
THERMAL RESISTANCE
SINK TO AMBIENT ( C/WATT)
SINK TO AMBIENT ( C/WATT)
SINK TO AMBIENT ( C/WATT)