Board Level
Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
2
Surface Mount Heat Sinks
D PAK, TO-220, SOT-223, SOL-20
217 SERIES
Compatible with surface mount technology (SMT) automated production techniques for ease of assembly and a vari-
ety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increas-
ing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'
component thermal specifications.
FEATURES AND BENEFITS:
No interface material is needed
Copper with matte tin plating for improved solderability and assembly
Both the component and the heat sink are installed on the PC-board utilizing
standard SMT assembly equipment for Tape & Reel and Tube formats
EIA standards and ESD protection are specified
Can be used with water soluble or no clean SMT solder creams or other pastes
Height Above Footprint Thermal Performance at Typical Load
Standard PC Board Dimensions Package Package Natural Forced
P/N in. (mm) in. (mm) Format Quantity Convection Convection)
217-36CTE6 .360 (9.1) .600 (15.2) x .740 (18.8) Bulk 1 55C @ 1W 16.0C/W @ 200 LFM
217-36CTTE6 .360 (9.1) .600 (15.2) x .740 (18.8) Tube 20 55C @ 1W 16.0C/W @ 200 LFM
217-36CTRE6 .360 (9.1) .600 (15.2) x .740 (18.8) Tape & Reel 250 55C @ 1W 16.0C/W @ 200 LFM
Material: Copper, Matte Tin Plated
MECHANICAL DIMENSIONS
217 HEAT SINK WITH
THERMAL PERFORMANCE
DDPAK DEVICE
6 LAYER BOARD, D' PAK
125C LEAD, 40C AMBIENT
217-36CT6
Device Power Dissipation. W
KEY: Device only, NC Device + HS, NC Device + HS, 100 lfm Device + HS, 200 lfm
Device + HS, 300 lfm
SECTION A-A
NOTES
TAPE DETAILS
1. Material to be ESD
2. Approximately 6 Meters per Reel
3. 250 Pieces per Reel.
217-36CTR6
REEL DETAILS
Dimensions: in.
22
Device Tab dT, CBoard Level
Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
2
Surface Mount Heat Sinks
217 SERIES D PAK, TO-220, SOL-20
MECHANICAL DIMENSIONS
BOARD LAYOUT RECOMMENDATIONS
217 SERIES
TUBE DETAILS
TUBE: 16.25 Inches Long,
Min. ESD Material with Nail
Stops
20 Pieces per Tube
217-36CTT6
SOL 20
REF: JEDEC TO-263 (DD PAK)
217-36CT6
REF: JEDEC MO-169 (DD PAK)
Dimensions: in.
Surface Mount Heat Sink
218 SERIES SMT Devices
Height Above Maximum
Standard PC Board Footprint Thermal Performance at Typical Load
P/N in. (mm) in. (mm) Natural Convection Forced Convection
218-40CTE3 .40 (10.2) .90 (22.9) x .315 (8.0) 62C rise @ 2W 21C/W @ 200LFM
218-40CTE5 .40 (10.2) 1.03 (26.2) x .50 (12.7) 62C rise @ 2W 21C/W @ 200LFM
Material: Copper, Matte Tin Plated
MECHANICAL DIMENSIONS
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
0 200 400 600 800 1000
0 200 400 600 800 1000
100 25
100 25
80 20
80 20
60 15
60 15
40 10
40 10
20 5
20 5
0 0
0 0
0 200 400 600 800 1000
0.5 1.0 1.5 2.0 2.5 0 200 400 600 800 1000
0.5 1.0 1.5 2.0 2.5
HEAT DISSIPATED (WATTS) HEAT DISSIPATED (WATTS)
Solid line = 218-40CT5 Dashed Line = 218-40CT3
218-40CT3 218-40CT5
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
0 200 400 600 800 1000
0 200 400 600 800 1000
23
100 10
100 20
18
80 8
80 16
14
60 6
60 12
10
40 8 40 4
6
20 2
20 4
2
0 0 0 0
1 2 3 4 5 1 2 3 4 5
0 200 400 600 800 1000 0 200 400 600 800 1000
HEAT DISSIPATED (WATTS) HEAT DISSIPATED (WATTS)
AIR VELOCITY (LFM) AIR VELOCITY (LFM)
0 200 400 600 800 1000
0 200 400 600 800 1000
100 10
100 10
80 8
80 8
60 6 60 6
40 4 40 4
20 2
20 2
0 0
0 0
0 200 400 600 800 1000 2 4 6 8 10
2 1 4 6 8 0 0 200 400 600 800 1000
HEAT DISSIPATED (WATTS)
HEAT DISSIPATED (WATTS)
HEAT SINK TEMPERATURE RISE HEAT SINK TEMPERATURE RISE
HEAT SINK TEMPERATURE RISE
ABOVE AMBIENT AIR (C) ABOVE AMBIENT AIR (C)
ABOVE AMBIENT AIR (C)
THERMAL RESISTANCE SINK TO
THERMAL RESISTANCE SINK TO
THERMAL RESISTANCE SINK TO
AMBIENT (C)
AMBIENT (C)
AMBIENT (C)
HEAT SINK TEMPERATURE RISE HEAT SINK TEMPERATURE RISE
HEAT SINK TEMPERATURE RISE
ABOVE AMBIENT AIR (C) ABOVE AMBIENT AIR (C)
ABOVE AMBIENT AIR (C)
THERMAL RESISTANCE SINK TO
THERMAL RESISTANCE SINK TO
THERMAL RESISTANCE SINK TO
AMBIENT (C)
AMBIENT (C)
AMBIENT (C)