X-On Electronics has gained recognition as a prominent supplier of 527-45AB Heat Sinks across the USA, India, Europe, Australia, and various other global locations. 527-45AB Heat Sinks are a product manufactured by Wakefield. We provide cost-effective solutions for Heat Sinks, ensuring timely deliveries around the world.

527-45AB Wakefield

527-45AB electronic component of Wakefield
527-45AB Wakefield
527-45AB Heat Sinks
527-45AB  Thermal Management

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See Product Specifications
Part No. 527-45AB
Manufacturer: Wakefield
Category: Heat Sinks
Description: Heat Sinks Heat Sink for DC/DC Converters, Half Brick, 57.9x61x11.4mm, Horizontal, 11 Fins
Datasheet: 527-45AB Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
19: USD 3.9249 ea
Line Total: USD 74.57 
Availability - 2386
Ship by Fri. 07 Feb to Thu. 13 Feb
MOQ: 19  Multiples: 10
Pack Size: 10
Availability Price Quantity
2386
Ship by Fri. 07 Feb to Thu. 13 Feb
MOQ : 19
Multiples : 10
19 : USD 3.9249
160 : USD 2.8875
320 : USD 2.7694
640 : USD 2.6512
1120 : USD 2.5594
2560 : USD 1.5225
5120 : USD 1.4832
7520 : USD 1.4437

47
Ship by Wed. 05 Feb to Fri. 07 Feb
MOQ : 1
Multiples : 1
1 : USD 3.4125
10 : USD 2.8738
25 : USD 2.5525
100 : USD 2.4024
250 : USD 2.3447
480 : USD 2.2522
1120 : USD 2.1945
5120 : USD 2.1714

302
Ship by Wed. 05 Feb to Fri. 07 Feb
MOQ : 1
Multiples : 1
1 : USD 4.7334
5 : USD 4.263
12 : USD 4.0278
640 : USD 3.8808

2386
Ship by Fri. 07 Feb to Thu. 13 Feb
MOQ : 20
Multiples : 10
20 : USD 4.2878
160 : USD 3.397
320 : USD 3.2581
640 : USD 3.1192
1120 : USD 3.011

302
Ship by Fri. 07 Feb to Thu. 13 Feb
MOQ : 18
Multiples : 1
18 : USD 4.5767
50 : USD 4.4323
100 : USD 4.0765

   
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the 527-45AB from our Heat Sinks category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the 527-45AB and other electronic components in the Heat Sinks category and beyond.

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Image Part-Description
Stock Image 528-24AB-MS4
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WTS001 p26-49 6/14/07 10:56 AM Page 45 Extruded Heat Sinks EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS Low-Profile Heat Sinks for All Metal-Case Power Semiconductors 621/623 SERIES TO-3 Footprint Thermal Performance at Typical Load Standard Dimensions Height Mounting Natural Forced Weight P/N in. (mm) in. (mm) Hole Pattern Convection Convection lbs. (grams) 621A 4.750 (120.6) x 1.500 (38.1) 0.461 (11.7) (1) TO-3 75C 15W 2.0C/W 250 LFM 0.1000 (45.36) 621K 4.750 (120.6) x 1.500 (38.1) 0.461 (11.7) None 75C 15W 2.0C/W 250 LFM 0.1000 (45.36) 623A 4.750 (120.6) x 3.000 (76.2) 0.461 (11.7) (1) TO-3 52C 15W 1.5C/W 250 LFM 0.2100 (95.26) 623K 4.750 (120.6) x 3.000 (76.2) 0.461 (11.7) None 52C 15W 1.5C/W 250 LFM 0.210O (95.26) A general purpose yet efficient heat dissipator for TO-3 and virtually all other styles of metal case width, accommodating many types of packages. Mounting hole pattern is predrilled for the power semiconductor package types, the 621 and 623 Series low-profile flat back heat sinks find a standard TO-3 package. Material: Aluminum Alloy, Black Anodized. wide variety of applications. The central channel between fins measures 1.300 in. (33.0) (min.) in MECHANICAL DIMENSIONS 621 AND 623 SERIES (EXTRUSION PROFILE 1327) NATURAL AND FORCED CONVECTION CHARACTERISTICS SEMICONDUCTOR MOUNTING HOLES A K Dimensions: in. (mm) Compact Heat Sinks for Dual Stud-Mounted Semiconductor Cases STUD-MOUNT 301/302/303 SERIES Outline Mounting Thermal Performance at Typical Load Standard Dimensions Length A Hole (s) Natural Forced Weight P/N in. (mm) in. (mm) Pattern and Number Convection Convection lbs. (grams) 301K 2.000 (50.8) x 2.000 (50.8) 0.750 (19.1) None 70C 15W 2.5C/W 250 LFM 0.0580 (26.31) 301M 2.000 (50.8) x 2.000 (50.8) 0.750 (19.1) (1) 10-32UNF, 0.625 in. thread depth 70C 15W 2.5C/W 250 LFM 0.0580 (26.31) 1 301N 2.000 (50.8) x 2.000 (50.8) 0.750 (19.1) (1) 4 -28UNF, 0.625 in. thread depth 70C 15W 2.5C/W 250 LFM 0.0580 (26.31) 302M 2.000 (50.8) x 2.000 (50.8) 1.500 (38.1) (1) 10-32UNF, 0.625 in. thread depth 50C 15W 1.8C/W 250 LFM 0.1330 (60.33) 302MM 2.000 (50.8) x 2.000 (50.8) 1.500 (38.1) (2) 10-32UNF, 0.625 in. thread depth 50C 15W 1.8C/W 250 LFM 0.1330 (6033) 1 302N 2.000 (50.8) x 2.000 (50.8) 1.500 (38.1) (1) 4 -28UNF, 0.625 in. thread depth 5OC 15W 1.8C/W 250 LFM 0.1330 (60.33) 1 302NN 2.000 (50.8) x 2.000 (50.8) 1.500 (38.1) (2) 4 -28UNF, 0.625 in. thread depth 50C 15W 1.8C/W 250 LFM 0.1330 (60.33) 303M 2.000 (50.8) x 2.000 (50.8) 3.000 (76.2) (1) 10-32UNF, 0.625 in. thread depth 37C 15W 1.3C/W 250 LFM 0.2680 (121.56) 303MM 2.000 (50.8) x 2.000 (50.8) 3.000 (76.2) (2) 10-32UNF, 0.625 in. thread depth 37C 15W 1.3C/W 250 LFM 0.2680 (121.56) 1 303N 2.000 (50.8) x 2.000 (50.8) 3.000 (76.2) (1) 4 -28UNF, 0.625 in. thread depth 37C 15W 1.3C/W 250 LFM 0.2680 (121.56) 1 303NN 2.000 (50.8) x 2.000 (50.8) 3.000 (76.2) (2) 4 -28UNF, 0.625 in. thread depth 37C 15W 1.3C/W 250 LFM 0.2680 (121.56) The large fin area in minimum total volume provided by the radial design of the 301/302/303 302 and 303 Series offer maximum cost savings with dual mounting locations (MM and Series offers maximum heat transfer efficiency in natural convection. All types are available NN mounting hole patterns) for two stud-mount devices. Material: Aluminum Alloy, Black with one tapped mounting hole for rectifiers and other stud-mounting semiconductors the Anodized. MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS SEMICONDUCTOR MOUNTING HOLES K M N 302 AND 303 SERIES SERIES 301 302 301 SERIES 303 Dimensions: in. (mm) 45WTS001 p26-49 6/14/07 10:56 AM Page 46 Extruded Heat Sinks EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS Double-Surface Heat Sinks for TO-3 Case Styles 401 & 403 SERIES TO-3 Stud-Mount Standard Width Overall Dimensions Height Semiconductor Thermal Performance at Typical Load Weight P/N in. (mm) in. (mm) in. (mm) Mounting Hole Pattem Natural Convection Forced Convection lbs. (grams) 401A 4.750 (120.7) 1.500 (38.1) 1.250 (31.8) (1) TO-3 80C 30W 1.5C/W 250 LFM 0.1500 (68.04) 401F 4.750 (120.7) 1.500 (38.1) 1.250 (31.8) 0.270 in. (6.9)-Dia Hole 80C 30W 1.5C/W 250 LFM 0.1500 (68.04) 401K 4.750 (120.7) 1.500 (38.1) 1.250 (31.8) None 80C 30W 1.5C/W 250 LFM 0.1500 (68.04) 403A 4.750 (120.7) 3.000 (76.2) 1.250 (31.8) (1) TO-3 55C 30W 0.9C/W 250 LFM 0.3500 (158.76) 403F 4.750 (120.7) 3.000 (76.2) 1.250 (31.8) 0.270 in. (6.9)-Dia Hole 55C 30W 0.9C/W 250 LFM 0.3500 (158.76 403K 4.750 (120.7) 3.000 (76.2) 1.250 (31.8) None 55C 30W 0.9C/W 250 LFM 0.3500 (158.76) With fins oriented vertically in cabinet sidewall applications, 401 and 403 Series heat sinks are in. (6.9)-diameter mounting hole (with a 0.750 in. (19.1)-diameter area free of anodize) for recommended for critical space applications where maximum heat dissipation is required for mounting stud-type diodes and rectifiers. Hole pattem available upon request. Material: high-power TO-3 case styles. Forced convection performance is also exemplary with these Aluminum Alloy, Black Anodized. double surface fin types. Semiconductor mounting hole style F offers a single centered 0.270 MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS 401 SERIES 403 SERIES Dimensions: in. (mm) SEMICONDUCTOR MOUNTING HOLES A F K V 401 AND 403 SERIES (EXTRUSION PROFILE 1024) TO-3 DO-5 Stud-Mount Low-Height Double-Surface Heat Sinks for TO-3 Case Styles and Diodes 413/421/423 SERIES Nominal Dimensions Standard Width Length Height A Semiconductor Thermal Performance at Typical Load Weight P/N in. (mm) in. (mm) in. (mm) Mounting Hole Pattern Natural Convection Forced Convection lbs. (grams) 413A 4.750 (120.7) 3.000 (76.2) 1.875 (47.6) (1) TO-3 72C 50W 0.85C/W 250 LFM 0.6300 (285.77) 413F 4.750 (120.7) 3.000 (76.2) 1.875 (47.6) 0.270 in. (6.9)-Dia Hole 72C 50W 0.85C/W 250 LFM 0.6300 (285.77) 413K 4.750 (120.7) 3.000 (76.2) 1.875 (47.6) None 72C 50W 0.85C/W 250 LFM 0.6300 (285.77) 421A 4.750 (120.7) 3.000 (76.2) 2.625 (66.7) (1) TO-3 58C 50W 0.7C/W 250 LFM 0.6300 (285.77) 421F 4.750 (120.7) 3.000 (76.2) 2.625 (66.7) 0.270 in. (6.9)-Dia Hole 58C 50W 0.7C/W 250 LFM 0.6300 (285.77) 421K 4.750 (120.7) 3.000 (76.2) 2.625 (66.7) None 58C 50W 0.7C/W 250 LFM 0.6300 (285.77) 423A 4.750 (120.7) 5.500 (140.2) 2.625 (66.7) (1) TO-3 47C 50W 0.5C/W 250 LFM 1.1700 (530.71) 423K 4.750 (120.7) 5.500 (140.2) 2.625 (66.7) None 47C 50W 0.5C/W 250 LFM 1.1700 (530.71) Space-saving double surface 413, 421, and 423 Series utilize finned surface field Type 126 silicone-free thermal compound or Wakefield DeltaPad inter- area on both sides of the power semiconductor mounting surface to provide face materials for maximum performance. Material: Aluminum Alloy, Black An- maximum heat dissipation in a compact profile. Ready to install on popular odized. power components in natural and forced convection applications. Apply Wake- MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS 423 SERIES 413 SERIES (EXTRUSION PROFILE 1025) (EXTRUSION PROFILE 2276) 421 SERIES SEMICONDUCTOR MOUNTING HOLES (EXTRUSION A FK PROFILE 1025) V SERIES 413 421 Dimensions: in. (mm) 46

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