Product Information

634-15ABP

634-15ABP electronic component of Wakefield

Datasheet
Heat Sink Passive TO-218/TO-220 Thru-Hole Aluminum Black Anodized

Manufacturer: Wakefield
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

10: USD 11.2429 ea
Line Total: USD 112.43

0 - Global Stock
MOQ: 10  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - WHS 1


Ships to you between Mon. 27 May to Fri. 31 May

MOQ : 10
Multiples : 1

Stock Image

634-15ABP
Wakefield

10 : USD 11.2429
50 : USD 4.1668
100 : USD 2.0491
250 : USD 1.994
500 : USD 1.9252
1000 : USD 1.8565
5000 : USD 1.7878

0 - WHS 2


Ships to you between Mon. 27 May to Fri. 31 May

MOQ : 4
Multiples : 1

Stock Image

634-15ABP
Wakefield

4 : USD 27.1939

0 - WHS 3


Ships to you between Mon. 27 May to Fri. 31 May

MOQ : 4
Multiples : 1

Stock Image

634-15ABP
Wakefield

4 : USD 24.7586

     
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Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES 2 Surface Mount Heat Sinks D PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology (SMT) automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers' component thermal specifications. FEATURES AND BENEFITS: No interface material is needed Copper with tin-lead plating for improved solderability and assembly Both the component and the heat sink are installed on the PC-board utilizing standard SMT assembly equipment for Tape & Reel and Tube formats EIA standards and ESD protection are specified Can be used with water soluble or no clean SMT solder creams or other pastes Height Above Footprint Thermal Performance at Typical Load Standard PC Board Dimensions Package Package Natural Forced P/N in. (mm) in. (mm) Format Quantity Convection Convection) 217-36CT6 G .390 (9.9) .600 (15.2) x .740 (18.8) Bulk 1 55C @ 1W 16.0C/W @ 200 LFM 217-36CTT6 .390 (9.9) .600 (15.2) x .740 (18.8) Tube 20 55C @ 1W 16.0C/W @ 200 LFM 217-36CTR6G .390 (9.9) .600 (15.2) x .740 (18.8) Tape & Reel 250 55C @ 1W 16.0C/W @ 200 LFM Material: Copper, Tin, Lead Plated MECHANICAL DIMENSIONS 217 HEAT SINK WITH THERMAL PERFORMANCE DDPAK DEVICE 6 LAYER BOARD, D' PAK 125C LEAD, 40C AMBIENT 217-36CT6 Device Power Dissipation. W KEY: L Device only, NC R Device + HS, NC G Device + HS, 100 lfm l Device + HS, 200 lfm r Device + HS, 300 lfm SECTION A-A NOTES TAPE DETAILS 1. Material to be ESD 2. Approximately 6 Meters per Reel 3. 250 Pieces per Reel. 217-36CTR6 REEL DETAILS Dimensions: in. All other products, please contact factory for price, delivery, and minimums. G Normally stocked 30Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 2 217 SERIES Surface Mount Heat Sinks D PAK, TO-220, SOL-20 MECHANICAL DIMENSIONS BOARD LAYOUT RECOMMENDATIONS 217 SERIES TUBE DETAILS TUBE: 16.25 Inches Long, Min. ESDMaterial with Nail Stops 20 Pieces per Tube 217-36CTT6 SOL 20 REF: JEDEC TO-263 (DD PAK) 217-36CT6 REF: JEDEC MO-169 (DD PAK) Dimensions: in. 230 AND 234 SERIES Compact, Wavesolderable Low-Profile Self-Locking Heat Sinks TO-220 Height Above Footprint Solderable Thermal Performance at Typical Load Standard PC Board Dimensions Mounting Tab Mounting Natural Forced P/N in. (mm) in. (mm) Configuation Option Style Convection Convection) 230-75AB G .750 (19.1) .570 (14.5) x .500 (12.7) Vert./Horiz. No Tab Clip/Mtg Hole 57C @ 2W 7.5C/W @ 400 LFM 230-75AB-01 .750 (19.1) .570 (14.5) x .500 (12.7) Vertical 01 Clip/Mtg Hole 57C @ 2W 7.5C/W @ 400 LFM 230-75AB-05 .500 (12.7) .750 (19.1) x .570 (14.5) Horizontal 05 Clip/Mtg Hole 57C @ 2W 7.5C/W @ 400 LFM PATENT PENDING 230-75AB-10 .875 (22.2) .570 (14.5) x .500 (12.7) Vertical 10 Clip/Mtg Hole 57C @ 2W 7.5C/W @ 400 LFM 234-75AB .790 (20.0) .570 (14.5) x .500 (12.7) Vert./Horiz No Tab Clip/Mtg Hole 57C @ 2W 7.5C/W @ 400 LFM 234-75AB-01 .790 (20.0) .570 (14.5) x .500 (12.7) Vertical 01 Clip/Mtg Hole 57C @ 2W 7.5C/W @ 400 LFM 234-75AB-05 .500 (12.7) .790 (20.0) x .570 (14.5) Horizontal 05 Clip/Mtg Hole 57C @ 2W 7.5C/W @ 400 LFM Material: Aluminum, Black Anodized 230-75AB-05 230-75AB-01 230-75AB-10 230 AND 234 SERIES 230 SERIES MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS 234 SERIES 234 SERIES 234-75AB 234-75AB-01 234-75AB-05 Dimensions: in. (mm) All other products, please contact factory for price, delivery, and minimums. G Normally stocked 31

Tariff Desc

7612.90.00 -Other Aluminium structures (excluding prefabricated buildings of heading no. 94.06) and parts of structures (for example, bridges and bridge-sections, towers, lattice masts, roofs, roofing frameworks, doors and windows and their frames and thresholds for doors, balustrades, pillars and columns); aluminium plates, rods, profiles, tubes and the like, prepared for use in structures:
WAK
Wakefield Engineering
WAKEFIELD SOLUTIONS
WAKEFIELD THERMAL
Wakefield Thermal Solutions
Wakefield Thermal Solutions, Inc.
Wakefield-Vette
Wakefield-Vette, Inc

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