Board Level
Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
217 SERIES 2
Surface Mount Heat Sinks
D PAK, TO-220, SOT-223, SOL-20
Compatible with surface mount technology (SMT) automated production techniques for ease of assembly and a
variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,
increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'
component thermal specifications.
FEATURES AND BENEFITS:
No interface material is needed
Copper with tin-lead plating for improved solderability and assembly
Both the component and the heat sink are installed on the PC-board utilizing
standard SMT assembly equipment for Tape & Reel and Tube formats
EIA standards and ESD protection are specified
Can be used with water soluble or no clean SMT solder creams or other pastes
Height Above Footprint Thermal Performance at Typical Load
Standard PC Board Dimensions Package Package Natural Forced
P/N in. (mm) in. (mm) Format Quantity Convection Convection)
217-36CT6 G .390 (9.9) .600 (15.2) x .740 (18.8) Bulk 1 55C @ 1W 16.0C/W @ 200 LFM
217-36CTT6 .390 (9.9) .600 (15.2) x .740 (18.8) Tube 20 55C @ 1W 16.0C/W @ 200 LFM
217-36CTR6G .390 (9.9) .600 (15.2) x .740 (18.8) Tape & Reel 250 55C @ 1W 16.0C/W @ 200 LFM
Material: Copper, Tin, Lead Plated
MECHANICAL DIMENSIONS
217 HEAT SINK WITH
THERMAL PERFORMANCE
DDPAK DEVICE
6 LAYER BOARD, D' PAK
125C LEAD, 40C AMBIENT
217-36CT6
Device Power Dissipation. W
KEY: L Device only, NC R Device + HS, NC G Device + HS, 100 lfm l Device + HS, 200 lfm r Device + HS, 300 lfm
SECTION A-A
NOTES
TAPE DETAILS
1. Material to be ESD
2. Approximately 6 Meters per Reel
3. 250 Pieces per Reel.
217-36CTR6
REEL DETAILS
Dimensions: in.
All other products, please contact factory for price, delivery, and minimums.
G Normally stocked
30Board Level
Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
2
217 SERIES
Surface Mount Heat Sinks
D PAK, TO-220, SOL-20
MECHANICAL DIMENSIONS
BOARD LAYOUT RECOMMENDATIONS
217 SERIES
TUBE DETAILS
TUBE: 16.25 Inches Long,
Min. ESDMaterial with Nail
Stops
20 Pieces per Tube
217-36CTT6
SOL 20
REF: JEDEC TO-263 (DD PAK)
217-36CT6
REF: JEDEC MO-169 (DD PAK)
Dimensions: in.
230 AND 234 SERIES
Compact, Wavesolderable Low-Profile Self-Locking Heat Sinks
TO-220
Height Above Footprint Solderable Thermal Performance at Typical Load
Standard PC Board Dimensions Mounting Tab Mounting Natural Forced
P/N in. (mm) in. (mm) Configuation Option Style Convection Convection)
230-75AB G .750 (19.1) .570 (14.5) x .500 (12.7) Vert./Horiz. No Tab Clip/Mtg Hole 57C @ 2W 7.5C/W @ 400 LFM
230-75AB-01 .750 (19.1) .570 (14.5) x .500 (12.7) Vertical 01 Clip/Mtg Hole 57C @ 2W 7.5C/W @ 400 LFM
230-75AB-05 .500 (12.7) .750 (19.1) x .570 (14.5) Horizontal 05 Clip/Mtg Hole 57C @ 2W 7.5C/W @ 400 LFM
PATENT PENDING
230-75AB-10 .875 (22.2) .570 (14.5) x .500 (12.7) Vertical 10 Clip/Mtg Hole 57C @ 2W 7.5C/W @ 400 LFM
234-75AB .790 (20.0) .570 (14.5) x .500 (12.7) Vert./Horiz No Tab Clip/Mtg Hole 57C @ 2W 7.5C/W @ 400 LFM
234-75AB-01 .790 (20.0) .570 (14.5) x .500 (12.7) Vertical 01 Clip/Mtg Hole 57C @ 2W 7.5C/W @ 400 LFM
234-75AB-05 .500 (12.7) .790 (20.0) x .570 (14.5) Horizontal 05 Clip/Mtg Hole 57C @ 2W 7.5C/W @ 400 LFM
Material: Aluminum, Black Anodized
230-75AB-05
230-75AB-01
230-75AB-10 230 AND 234 SERIES 230 SERIES
MECHANICAL DIMENSIONS
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
234 SERIES
234 SERIES
234-75AB 234-75AB-01
234-75AB-05
Dimensions: in. (mm)
All other products, please contact factory for price, delivery, and minimums.
G Normally stocked
31