PIN FIN HEAT SINK 903 Series Wakefield-Vette s900 Series Heat Sinks for Chipset can match up to devices from: Intel, Broadcom, Xilinx, TI, Motorola, ATI, AMD, Nvidia, Vishay, Powerex, Infineon, Microsemi, and many more. These heat sinks are designed for air flow applications in the Telecom, Data Center, Networking, Cloud Computing, and many more Industries. Material: AL 6063 Finish: Black Anodize FORCED CONVECTION CHIP (C/W) HEIGHT SIZE PART ( mm) (mm) NATURAL CONVECTION 200 LFM 400 LFM 600 LFM 903-23-2-12-2-B-0 12 23 12.06 C/W 5.72 C/W 3.95 C/W 3.24 C/W 903-23-2-15-2-B-0 15 23 11.41 C/W 5.39 C/W 3.67 C/W 2.99 C/W 903-23-2-18-2-B-0 18 23 10.76 C/W 5.05 C/W 3.35 C/W 2.67 C/W 903-23-2-21-2-B-0 21 23 10.11 C/W 4.74 C/W 3.1 C/W 2.46 C/W 903-23-2-23-2-B-0 23 23 9.99 C/W 4.44 C/W 2.87 C/W 2.31 C/W 903-23-2-28-2-B-0 28 23 9.70 C/W 4.09 C/W 2.62 C/W 2.12 C/W 903-23-2-33-2-B-0 33 23 9.41 C/W 3.83 C/W 2.43 C/W 1.96 C/W THERMAL PERFORMANCE: 6 990033--2233--22--1122--22--BB--00 5 903-23-2-15-2-B-0 903-23-2-18-2-B-0 4 903-23-2-21-2-B-0 3 903-23-2-23-2-B-0 903-23-2-28-2-B-0 2 903-23-2-33-2-B-0 1 200 LFM 400 LFM 600 LFM Forced Convection Series Chip Size Construction Height Chip Height Finish Interface 19- 2- 12- 1- B- 1 19 12 = 11.6 1 = .9-2.1 0 = None 21 15 = 14.6 2 = 2.2-3.4 1 = T725 23 18 = 17.6 27 21 = 20.6 903- 29 23 = 22.6 B = BLK 2= Pin Fin ANO 31 28 = 27.6 33 33 = 32.6 35 37.5 40 T h e r m a l C o o l i n g S o l u t i o n s f r o m S m a r t t o F i n i s h www.wakefield-vette.com C/WattPIN FIN HEAT SINK 903 Series Wakefield-Vette hseat sink assembles onto chip set using the space that is between the PCB and the substrate of the solder balls. The solder balls provide a minimal gap of .5mm to .7mm. Attachment feature is below a .4mm thickness. The clipping system will not interfere or damage chip. Contact area is the edge of chip. ASSEMBLY INSTRUCTION: Step 1: Hook the Step 2: Rotate Step 3: Make sure Step 4: Press firmly clip under one assembly down the sop rods are down to make sure side of the BGA until opposite clearing from edges clips fully engage chip set. side clip engages of BGA chip set. edges of chip set. Heat Sink should not substrate edge of move around easily. BGA chip set. Random Vibration Test SHOCK TEST SPECIFICATION Frequency 5 Hz to 500 Hz Wave Form Half sine wave Acceleration 3.13 grms Acceleration 50 g P.S.D 0.01 g2/HZ ( 5 Hz ) Duration Time 11 ms 0.02 g2/HZ (20 Hz to 500 Hz) No. of Shock Each axis 3 times Test Axis X, Y, Z axis Shock Direction X, Y, Z axis Test Time 10 mins (E ach axis) Reliability & Communication Total Test Time 30 mins Testing Instruments T h e r m a l C o o l i n g S o l u t i o n s f r o m S m a r t t o F i n i s h www.wakefield-vette.com