ulTIMiFlux Dielectric Phase Change Thermal Material CD-02-05 o o 60 C/140 F PHASE-CHANGE TEMPERATURE FEATURES AND BENIFITS Low Thermal Impedance Excellent Replacement for Thermal Greases Thixotropic / Prevents Compound Run-Out Excellent Mechanical & Dielectric Properties Cost Effective Drop in Place Solution RoHS and Halogen Free Compliant Wakefield-Vette s ulTIMiFlux line of thermal interface materials offer high performance, low cost, configurability and custom sizes for your thermal system needs. Thermal Interface Materials (TIM) are a secondary material installed between the heat sink and the device which are designed to improve the thermal transfer to the heat sink. Regardless of how flat or smooth the device and heat sink are, there will always be small air voids between the two surfaces. Since air is a not a great conductor of heat, a TIM replaces the air and fills the voids. There are many types of TIMs and each has its best case usages. Wakefield-Vettss line of dielectric phase change thermal materials are intended to fill voids between a device and the heat sink and utilizes a polyimide film to act as a thermally conductive carrier in order to deliver a uniform thickness coating of phase-change thermal compound on both sides. Through the development of this unique formulation, Wakefield-Vettes phase change solution offers Standard Phase Change Pad Construction efficient thermal transfer by phase-changing during Phase Change Compound normal device operating temperatures while maintaining a uniform bond line thus driving out the Polyimide Substrate Carrier air and adjusting for any surface imperfections or Phase Change Compound flatness conditions that may exist across the interface. This construction is useful in a wide range of electronic cooling applications from transistors, diodes or any type of heat generating non-isolated A primary advantage of utilizing a phase- power device. change system is the ability to drive out air from within the interface during initial device cycling causing phase change and surface wetting of the thermal compound coating. The phase-change compound is available in specific die cut patterns for common TO packages and can be placed instantly and immediately ready for component mounting. Due to its thixotropic formulation design, compound is held within the interface with no worries of run-out into unwanted areas during normal device/component operation. www.wakefield-vette.comulTIMiFlux Dielectric PhaseChange Thermal Material CD-02-05 Wakefield-Vette s phase-change product is a solvent free high performance dielectric thermal interface material that is designed to provide efficient thermal transfer by providing precision phase-change and a uniform bond line thickness across a device/component mounting interface. The pads are designed as a pre-formed thermally conductive drop in place solution that offers excellent thermal transfer characteristics. From an installation perspective, thermal greases are difficult to dispense as well as provide inadequate coverage and a uniform thickness across the interface most often leaving trapped air leading to poor thermal transfer. Not to mention the thermal grease clean up required in unwanted areas afterwards. Wakefield-Vette offers the following pad sizes and die-cut TO package sizes for ease of installation: WV Part Number Description Size For use with CD-02-05-220 Phase Change TO-220 Pad with mounting hole 0.70 x 0.50, single mounting hole T0-220, with mounting holes CD-02-05-247 Phase Change TO-247 Pad with mounting hole 0.95 x 0.75, single mounting hole TO-247, with mounting holes CD-02-05-264 Phase Change TO-264 Pad with mounting hole 1.05 x 0.85, single mounting hole TO-264, with mounting holes CD-02-05-025 Phase Change 1 x 1 Square Pad 1 x 1, no holes General Use CD-02-05-127 Phase Change 5 x 5 Square Pad 5 x 5, no holes General Use CD-02-05-190 Phase Change 7.75 x 10.00 Rectangular Pad 7.75 x 10.00, no holes General Use CD-02-05-LED-1 Phase Change LED 1 Inch OD Circle Pad 1.00 Diameter Circle, No ID LED CD-02-05-LED-2 Phase Change LED 2 Inch OD Circle Pad 2.00 Diameter Circle, No ID LED CD-02-05-220-N Phase Change TO-220 Pad, NO HOLE 0.70 x 0.50 NO HOLE TO-220 with no mounting hole CD-02-05-247-N Phase Change TO-247 Pad, NO HOLE 0.95 x 0.75 NO HOLE TO-247 with no mounting hole CD-02-05-220-2 Phase Change Dual Mount TO-220 Pad, 2 holes 1.00 x 0.50 2 holes Dual Mount TO-220 CD-02-05-220-3 Phase Change Triple Mount TO-220 Pad, 3 holes 1.50 x 0.50 , 3 holes Triple Mount TO-220 CD-02-05-247-2 Phase Change Dual Mount TO-247 Pad, 2 holes 1.50 x 0.95 , 2 holes Dual Mount TO-247 CD-02-05-247-3 Phase Change Triple Mount TO-247 Pad, 3 holes 2.25 x 0.95 , 3 holes Triple Mount TO-247 CD-02-05-218 Phase Change TO-218 Pad with hole 0.80 x 0.60 with hole TO-218 with mounting hole CD-02-05-126 Phase Change TO-126 Pad with hole 0.50 x 0.35 with hole TO-126 with mounting hole CD-02-05-66 Phase Change TO-66 Pad, 2 pin 1.25 x 0.70 , 2 pin TO-66 (std 2 pin) CD-02-05-3-2 Phase Change TO-3 Pad, 2 pin 1.55 x 1.05 , 2 pin TO-3 (2 pin configuration) CD-02-05-3-4 Phase Change TO-3 Pad, 4 pin 1.55 x 1.05 , 4 Pin TO-3 (4 pin configuration) CD-02-05-3-8 Phase Change TO-3 Pad, 8 pin 1.55 x 1.05 , 8 Pin TO-3 (8 pin configuration) CD-02-05-DO4 Phase Change DO-4 Pad, 0.625 OD / 0.203 ID 0.625 OD / 0.203 ID DO-4 CD-02-05-DO4-5 Phase Change DO4/5 Pad 0.800 OD / 0.260 ID 0.800 OD / 0.260 ID DO-4 / DO-5 CD-02-05-DO5 Phase Change DO-5 Pad 1.00 OD / 0.250 ID 1.00 OD / 0.250 ID DO-5 CD-02-05-REC-125 Phase Change Rectifier Pad 1.25 x 1.25 with hole 1.25 x 1.25 with hole Rectifier CD-02-05-REC-125-N Phase Change Rectifier Pad 1.25 X 1.25 , NO HOLE 1.25 X 1.25 , NO HOLE Rectifier CD-02-05-REC-112 Phase Change Rectifier Pad 1.12 x 1.12 with hole 1.12 x 1.12 with hole Rectifier CD-02-05-BRI-225 Phase Change Bridge Rectifier Pad 2.25 x 1.75 , 2 End Slots 2.25 x 1.75 , 2 End Slots Bridge Rectifier CD-02-05-C-18 Phase Change Chipset Pad 0.689 x 0.689 , No Hole 0.689 x 0.689 , No Hole 17.5mm x 17.5mm, chipset CD-02-05-C-20 Phase Change Chipset Pad 0.768 x 0.768 , No Hole 0.768 x 0.768 , No Hole 19.5mm x 19.5mm, chipset CD-02-05-C-22 Phase Change Chipset Pad 0.846 x 0.846 , No Hole 0.846 x 0.846 , No Hole 21.5mm x 21.5mm, chipset CD-02-05-C-26 Phase Change Chipset Pad 1.003 x 1.003 , No Hole 1.003 x 1.003 , No Hole 25.5mm x 25.5mm, chipset CD-02-05-C-34 Phase Change Chipset Pad 1.319 x 1.319 , No Hole 1.319 x 1.319 , No Hole 33.5mm x 33.5mm, chipset CD-02-05-C-39 Phase Change Chipset Pad 1.516 x 1.516 , No Hole 1.516 x 1.516 , No Hole 38.5mm X 38.5mm, chipset CD-02-05-C-46 Phase Change Chipset Pad 1.811 x 1.811 , No Hole 1.811 x 1.811 , No Hole 46mm X 46mm, chipset CD-02-05-C-49 Phase Change Chipset Pad 1.909 x 1.909 , No Hole 1.909 x 1.909 , No Hole 48.5mm X 48.5mm, chipset CD-02-05-C-54 Phase Change Chipset Pad 2.106 x 2.106 , No Hole 2.106 x 2.106 , No Hole 53.5mm x 53.5mm, chipset Specific tests should be performed by the end user to determine the product suitability for the particular application. Contact Wakefield-Vette sales and engineering support with any inquiries. www.wakefield-vette.com