Spec. No.: RAC-K-HTS-0001 /14 Date: 2017. 1. 10 Specification Title: FIXED CHIP RESISTOR NETWORKS RECTANGULAR TYPE Style: RAC06 2D, RAC06 4D, RAC10 2D, RAC10 4D, RAC16 4D, RAC16 8D RoHS COMPLIANCE ITEM Halogen and Antimony Free Product specification contained in this specification are subject to change at any time without notice If you have any questions or a Purchasing Specification for any quality Agreement is necessary, please contact our sales staff. Hokkaido Research Center Approval by: T. Sannomiya Drawing by: M. Shibuya Note: Stock conditions Temperature: +5C ~ +35C Relative humidity: 25% ~ 75% The period of guarantee: Within 2 year from shipmen t by the company. Solderability shall be satisfied. Drawing No: RAC- K- HTS- 0001 /14 Title: FIXED CHIP RESISTOR NETWORKS RECTANGULAR TYPE RAC06 2D, RAC06 4D, RAC10 2D, RAC10 4D, RAC16 4D, RAC16 8D Page: 1/12 1. Scope 1.1 This specification covers the detail requirements for fixed chip resistors networks rectangular type, style of RAC06 2D, 06 4D, 10 2D, 10 4D, 16 4D, 16 8D. 1.2 Applicable documents JIS C 5201- 1: 2011, JIS C 5201- 9: 2006, JIS C 5201- 9- 1: 2006 IEC60115- 1: 2008, IEC60115- 9: 2003, IEC60115- 9- 1: 2004 EIAJ RC- 2129- 2000. 2. Classification Type designation shall be the following form. (Example) 1. RAC 16 D 103 J TP 4 C 1 2 3 4 5 6 7 8 Style 2. RAC 16 4 D JP C TP 1 2 3 4 5 7 8 Style 1 Fixed chip resistors networks rectangular type 2 Size Style 3 Number of element 4 Circuits 5 Rated resistance 103 E24 Series, 3 digit, Ex. 103--> 10k, 1000 E96 Series, 4 digit, Ex. 1000-->100 1022--> 10.2k JP Chip jumper 6 Tolerance on rated resistance F 1% J 5% 7 Terminal style C With Corner D Convex Type Flat Type E Flat Type Low profile 8 Packaging form B Bulk (loose package) TH Paper taping TP Product specification contained in this specification are subject to change at any time without notice. If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff. Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2017.1.10