Wi2Wi, Inc. Rev.1.23 Data Sheet, WLAN SiP W2CBW0015W May 17th, 2013 Preliminary Product Datasheet Revision 1.23 May 17, 2013 The content of this document is to be treated as strictly confidential and is not to be disclosed, reproduced or used, except as authorized in writing by Wi2Wi, Inc. Copyright 2013 Wi2Wi, Inc. Page 1 of 24 Wi2Wi, Inc. Rev.1.23 Data Sheet, WLAN SiP W2CBW0015W May 17th, 2013 Table of Contents 1 General Description ........................................................................................................... 4 2 Features .............................................................................................................................. 4 3 System Description ............................................................................................................ 4 3.1 Block Diagram .......................................................................................................................... 5 3.2 Pad Description ........................................................................................................................ 5 4 Electrical Characteristics .................................................................................................. 7 5 WLAN External Host Interfaces .................................................................................... 10 5.1 SDIO Interface........................................................................................................................ 10 5.2 SDIO Protocol Timing Diagrams ............................................................................................ 11 6 Antenna and Clock .......................................................................................................... 12 6.1 Wireless LAN.......................................................................................................................... 12 7 WLAN Software Architecture ........................................................................................ 13 7.1 Host Processor ....................................................................................................................... 13 8 Reference Schematics ...................................................................................................... 14 9 Manufacturing Notes ....................................................................................................... 15 9.1 Physical SiP Dimensions and Pad Locations ........................................................................ 15 9.2 Physical Shield Dimensions ................................................................................................... 16 9.3 Shield Landing Pattern ......................................................................................................... 17 9.4 Tray Orientation ...................................................................................................................... 17 9.5 Tape and Reel Orientation ..................................................................................................... 19 9.6 Storage and Baking Instructions ............................................................................................ 20 9.7 Recommended Reflow Profile ................................................................................................ 20 10 Disclaimers ....................................................................................................................... 21 10.1 Data Sheet Status .................................................................................................................. 21 11 Ordering Information ................................................................................................... 21 11.1 Development Kit ..................................................................................................................... 21 12 Certifications .................................................................................................................... 23 13 References ......................................................................................................................... 23 13.1 Specifications ......................................................................................................................... 23 13.2 Trademarks, Patents and Licenses ....................................................................................... 23 The content of this document is to be treated as strictly confidential and is not to be disclosed, reproduced or used, except as authorized in writing by Wi2Wi, Inc. Copyright 2013 Wi2Wi, Inc. Page 2 of 24