X-On Electronics has gained recognition as a prominent supplier of W949D2DBJX5I DRAM across the USA, India, Europe, Australia, and various other global locations. W949D2DBJX5I DRAM are a product manufactured by Winbond. We provide cost-effective solutions for DRAM, ensuring timely deliveries around the world.

W949D2DBJX5I Winbond

W949D2DBJX5I electronic component of Winbond
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Part No.W949D2DBJX5I
Manufacturer: Winbond
Category: DRAM
Description: DRAM 512Mb LPDDR, x32, 200MHz, Industrial Temp, 46nm
Datasheet: W949D2DBJX5I Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
240: USD 2.7604 ea
Line Total: USD 662.5 
Availability - 0
MOQ: 240  Multiples: 240
Pack Size: 240
Availability Price Quantity
0
Ship by Thu. 28 Nov to Wed. 04 Dec
MOQ : 240
Multiples : 1
240 : USD 3.8834
250 : USD 3.8438
500 : USD 3.8056
1000 : USD 3.7674
2000 : USD 3.7292
2500 : USD 3.6923
3000 : USD 3.6554
5000 : USD 3.6186
10000 : USD 3.5831
20000 : USD 3.5477

0
Ship by Tue. 26 Nov to Thu. 28 Nov
MOQ : 240
Multiples : 240
240 : USD 2.7604
480 : USD 2.6103
1200 : USD 2.5987
10080 : USD 2.5872

0
Ship by Thu. 28 Nov to Wed. 04 Dec
MOQ : 3
Multiples : 1
3 : USD 4.0529

   
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We are delighted to provide the W949D2DBJX5I from our DRAM category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W949D2DBJX5I and other electronic components in the DRAM category and beyond.

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W949D6DB / W949D2DB 512Mb Mobile LPDDR Table of Contents- 1. GENERAL DESCRIPTION ................................................................................................................................. 4 2. FEATURES ........................................................................................................................................................ 4 3. ORDER INFORMATION .................................................................................................................................... 4 4. BALL ASSIGNMENT .......................................................................................................................................... 5 4.1 60VFBGA Ball Assignment: LPDDR x16 .............................................................................................. 5 4.2 90VFBGA Ball Assignment: LPDDR x32 .............................................................................................. 5 5. BALL CONFIGURATION .................................................................................................................................... 6 5.1 Ball description ..................................................................................................................................... 6 5.2 Addressing Table ................................................................................................................................. 7 6. BLOCK DIAGRAM .............................................................................................................................................. 8 6.1 Block Diagram ...................................................................................................................................... 8 6.2 Simplified State Diagram ...................................................................................................................... 9 7. FUNCTIONAL DESCRIPTION ......................................................................................................................... 10 7.1 Initialization ......................................................................................................................................... 10 7.1.1 Initialization Flow Diagram .................................................................................................... 11 7.1.2 Initialization Waveform Sequence ........................................................................................ 12 7.2 Mode Register Set Operation ............................................................................................................. 12 7.3 Mode Register Definition .................................................................................................................... 13 7.3.1 Burst Length ......................................................................................................................... 13 7.3.2 Burst Definition ..................................................................................................................... 14 7.3.3 Burst Type ............................................................................................................................ 15 7.3.4 Read Latency ....................................................................................................................... 15 7.4 Extended Mode Register Description ................................................................................................. 15 7.4.1 Extended Mode Register Definition ...................................................................................... 16 7.4.2 Partial Array Self Refresh ..................................................................................................... 16 7.4.3 Automatic Temperature Compensated Self Refresh ............................................................ 16 7.4.4 Output Drive Strength ........................................................................................................... 16 7.5 Status Register Read ......................................................................................................................... 17 7.5.1 SRR Register Definition........................................................................................................ 17 7.5.2 Status Register Read Timing Diagram ................................................................................. 18 7.6 Commands ......................................................................................................................................... 19 7.6.1 Basic Timing Parameters for Commands ............................................................................. 19 7.6.2 Truth Table Commands ..................................................................................................... 19 7.6.3 Truth Table - DM Operations ................................................................................................ 20 7.6.4 Truth Table CKE ................................................................................................................ 20 7.6.5 Truth Table - Current State Bank n - Command to Bank n ................................................... 21 7.6.6 Truth Table - Current State Bank n, Command to Bank m ................................................... 22 8. OPERATION .................................................................................................................................................... 24 8.1 Deselect ............................................................................................................................................. 24 8.2 No Operation ...................................................................................................................................... 24 8.2.1 NOP Command .................................................................................................................... 24 8.3 Mode Register Set .............................................................................................................................. 25 8.3.1 Mode Register Set Command .............................................................................................. 25 8.3.2 Mode Register Set Command Timing .................................................................................. 25 8.4 Active .................................................................................................................................................. 26 Publication Release Date: Jun. 01, 2018 Revision: A01-004 - 1 - W949D6DB / W949D2DB 8.4.1 Active Command .................................................................................................................. 26 8.4.2 Bank Activation Command Cycle ......................................................................................... 27 8.5 Read ................................................................................................................................................... 27 8.5.1 Read Command ................................................................................................................... 27 8.5.2 Basic Read Timing Parameters ............................................................................................ 28 8.5.3 Read Burst Showing CAS Latency ....................................................................................... 29 8.5.4 Read to Read ....................................................................................................................... 29 8.5.5 Consecutive Read Bursts ..................................................................................................... 29 8.5.6 Non-Consecutive Read Bursts ............................................................................................. 30 8.5.7 Random Read Bursts ........................................................................................................... 31 8.5.8 Read Burst Terminate .......................................................................................................... 31 8.5.9 Read to Write ....................................................................................................................... 32 8.5.10 Read to Precharge ............................................................................................................... 33 8.5.11 Burst Terminate of Read ...................................................................................................... 34 8.6 Write ................................................................................................................................................... 34 8.6.1 Write Command ................................................................................................................... 34 8.6.2 Basic Write Timing Parameters ............................................................................................ 35 8.6.3 Write Burst (min. and max. tDQSS) ...................................................................................... 36 8.6.4 Write to Write ........................................................................................................................ 36 8.6.5 Concatenated Write Bursts ................................................................................................... 37 8.6.6 Non-Concatenated Write Bursts ........................................................................................... 37 8.6.7 Random Write Cycles ........................................................................................................... 38 8.6.8 Write to Read ....................................................................................................................... 38 8.6.9 Non-Interrupting Write to Read ............................................................................................. 38 8.6.10 Interrupting Write to Read .................................................................................................... 39 8.6.11 Write to Precharge ............................................................................................................... 39 8.6.12 Non-Interrupting Write to Precharge ..................................................................................... 39 8.6.13 Interrupting Write to Precharge ............................................................................................ 40 8.7 Precharge ........................................................................................................................................... 40 8.7.1 Precharge Command ........................................................................................................... 41 8.8 Auto Precharge .................................................................................................................................. 41 8.9 Refresh Requirements ........................................................................................................................ 41 8.10 Auto Refresh ...................................................................................................................................... 42 8.10.1 Auto Refresh Command ....................................................................................................... 42 8.10.2 Auto Refresh Cycles Back-to-Back ...................................................................................... 42 8.11 Self Refresh ........................................................................................................................................ 43 8.11.1 Self Refresh Command ........................................................................................................ 43 8.11.2 Self Refresh Entry and Exit .................................................................................................. 44 8.12 Power Down ....................................................................................................................................... 45 8.12.1 Power-Down Entry and Exit .................................................................................................. 45 8.13 Deep Power Down.............................................................................................................................. 46 8.13.1 Deep Power-Down Entry and Exit ........................................................................................ 46 8.14 Clock Stop .......................................................................................................................................... 47 8.14.1 Clock Stop Mode Entry and Exit ........................................................................................... 47 9. ELECTRICAL CHARACTERISTICS ................................................................................................................. 48 9.1 Absolute Maximum Ratings ................................................................................................................ 48 9.2 Input / Output Capacitance ................................................................................................................. 48 Publication Release Date: Jun. 01, 2018 Revision: A01-004 - 2 -

Tariff Desc

8542.32.00 -- Memories
               Monolithic integrated circuits:
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA
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