Dimensions: mm Application Drawing: Properties: Properties Value Unit Tol. A Color White Thermal Conductivity 5 W/(m*K) Hardness (Shore C) 35 Shore C Dielectric Strength E 7 kV/mm min. BR Certification: RoHS Approval Compliant 2011/65/EU&2015/863 REACh Approval Conform or declared (EC)1907/2006 Halogen Free Conform JEDEC JS709B 400,0 5,0 Halogen Free Conform IEC 61249-2-21 Scale - 1:10 detail A General Information: PE film Operating Temperature -50 up to +150 C Storage Conditions (in original < 40 C < 75 % RH packaging) Moisture Sensitivity Level (MSL) 1 Test conditions of Electrical Properties: +20 C, 33 % RH if not specified differently PET film Fiberglass mesh Silicone with ceramic particels Scale - 1:10 CHECKED REVISION DATE (YYYY-MM-DD) GENERAL TOLERANCE PROJECTION METHOD SeMi 001.000 2021-04-20 DIN ISO 2768-1m DESCRIPTION WE-TGF Thermal Gap Filler Pad Wrth Elektronik eiSos GmbH & Co. KG ORDER CODE EMC & Inductive Solutions Max-Eyth-Str. 1 40105005 74638 Waldenburg Germany SIZE/TYPE BUSINESS UNIT STATUS PAGE Tel. +49 (0) 79 42 945 - 0 www.we-online.com Rectangle eiSos Valid 1/3 eiSos we-online.com This electronic component has been designed and developed for usage in general electronic equipment only. This product is not authorized for use in equipment where a higher safety standard and reliability standard is especially required or where a failure of the product is reasonably expected to cause severe personal injury or death, unless the parties have executed an agreement specifically governing such use. Moreover Wrth Elektronik eiSos GmbH & Co KG products are neither designed nor intended for use in areas such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network etc.. Wrth Elektronik eiSos GmbH & Co KG must be informed about the intent of such usage before the design-in stage. In addition, sufficient reliability evaluation checks for safety must be performed on every electronic component which is used in electrical circuits that require high safety and reliability functions or performance. 0,04 0,06 0,075 0,06 200,0 3,0 0,15 0,06 0,5 0,06 Do not expose the components to direct sunlight. Cautions and Warnings: The storage conditions in the original packaging are defined according to DIN EN 61760-2. The storage conditions stated in the original packaging apply to the storage time and not to the transportation time of the components. The following conditions apply to all goods within the product series of WE-TGF of Wrth Stacking height of more than seven layers is not recommended. Elektronik eiSos GmbH & Co. KG: Packaging: General: The packaging specifications apply only to purchase orders comprising whole packaging units. If the ordered quantity exceeds or is lower than the specified packaging unit, packaging in accordance with the packaging specifications cannot be ensured. This electronic component is designed and manufactured for use in general electronic equipment Wrth Elektronik must be asked for written approval (following the PPAP procedure) before incorporating the components into any equipment in fields such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, Handling: ship control), transportation signal, disaster prevention, medical, public information network, etc. where higher safety and reliability are especially required and/or if there is the possibility of direct damage or human injury. Recommended use is between 10% and 30% material compression. Use of material beyond recommended compression rate may Electronic components that will be used in safety-critical or high-reliability applications should be pre-evaluated by the customer. result in excessive silicone oil exudation. The component is designed and manufactured to be used within the datasheet specified values. If the usage and operation conditions It is recommended to compress the material with equal pressure on the whole surface. Partial excessive stress may also result in specified in the datasheet are not met, the wire insulation may be damaged or dissolved. excessive oil exudation. Do not drop or impact the component, the component may be damaged The temperature rise of the component must be taken into consideration. The operating temperature is comprised of ambient Wrth Elektronik products are qualified according to international standards, which are listed in each product reliability report. Wrth temperature and temperature rise of the component.The operating temperature of the component shall not exceed the maximum Elektronik does not warrant any customer qualified product characteristics beyond Wrth Elektroniks specifications, for its validity and temperature specified. sustainability over time. The responsibility for the applicability of the customer specific products and use in a particular customer design is always within the These cautions and warnings comply with the state of the scientific and technical knowledge and are believed to be accurate and reliable. authority of the customer. All technical specifications for standard products also apply to customer specific products. However, no responsibility is assumed for inaccuracies or incompleteness. Product Specific: Cleaning and Washing: Washing agents used during the production to clean the customer application might damage or change the characteristics of the component, marking or plating. Washing agents may have a negative effect on the long-term functionality of the product. Potting: If the product is potted in the customer application, the potting material might shrink or expand during and after hardening. Shrinking could lead to an incomplete seal, allowing contaminants into the component. Expansion could damage the component. We recommend a manual inspection after potting to avoid these effects. Storage Conditions: A storage of Wrth Elektronik products for longer than 12 months is not recommended. Within other effects, the terminals may suffer degradation, resulting in bad solderability. Therefore, all products shall be used within the period of 12 months based on the day of shipment. CHECKED REVISION DATE (YYYY-MM-DD) GENERAL TOLERANCE PROJECTION METHOD SeMi 001.000 2021-04-20 DIN ISO 2768-1m DESCRIPTION WE-TGF Thermal Gap Filler Pad Wrth Elektronik eiSos GmbH & Co. KG ORDER CODE EMC & Inductive Solutions Max-Eyth-Str. 1 40105005 74638 Waldenburg Germany SIZE/TYPE BUSINESS UNIT STATUS PAGE Tel. +49 (0) 79 42 945 - 0 www.we-online.com Rectangle eiSos Valid 2/3 eiSos we-online.com This electronic component has been designed and developed for usage in general electronic equipment only. This product is not authorized for use in equipment where a higher safety standard and reliability standard is especially required or where a failure of the product is reasonably expected to cause severe personal injury or death, unless the parties have executed an agreement specifically governing such use. Moreover Wrth Elektronik eiSos GmbH & Co KG products are neither designed nor intended for use in areas such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network etc.. Wrth Elektronik eiSos GmbH & Co KG must be informed about the intent of such usage before the design-in stage. In addition, sufficient reliability evaluation checks for safety must be performed on every electronic component which is used in electrical circuits that require high safety and reliability functions or performance.