X-On Electronics has gained recognition as a prominent supplier of XT61M1G8C2TM-B8BEA Multichip Packages across the USA, India, Europe, Australia, and various other global locations. XT61M1G8C2TM-B8BEA Multichip Packages are a product manufactured by XTX. We provide cost-effective solutions for Multichip Packages, ensuring timely deliveries around the world.

XT61M1G8C2TM-B8BEA XTX

XT61M1G8C2TM-B8BEA electronic component of XTX
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See Product Specifications
Part No.XT61M1G8C2TM-B8BEA
Manufacturer: XTX
Category: Multichip Packages
Description: NAND MCP BGA-162(10.5x8) Memory - Serial MCP (Multi Chip Package) ROHS
Datasheet:
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 4.892 ea
Line Total: USD 4.89 
Availability - 469
Ship by Fri. 03 Jan to Wed. 08 Jan
MOQ: 1  Multiples: 1
Pack Size: 1

 XT61M1G8C2TM-B8BEA More Buying Options & Price Grid(s)

Availability Price Quantity
469
Ship by Fri. 03 Jan to Wed. 08 Jan
MOQ : 1
Multiples : 1
1 : USD 4.892
10 : USD 4.261
30 : USD 3.8844
242 : USD 3.5055
484 : USD 3.3305
968 : USD 3.2514

Specifications

   
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We are delighted to provide the XT61M1G8C2TM-B8BEA from our Multichip Packages category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the XT61M1G8C2TM-B8BEA and other electronic components in the Multichip Packages category and beyond.

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