Series Overview SMT Devices *SOP (Small Outline Packages, Gullwing Leads) *SOP variations e.g. TSSOP... Series IC51 (Clamshell) 0.4 to 1.27mm Pitch SOP, TSOP Type I & II Part Number (Details) Specifications Insulation Resistance: 1,000M min. at 500V DC Dielectric Withstanding Voltage: 700V AC for 1 minute IC51 --028 2 334-1 - MF Contact Resistance: 30m max. at 10mA/20mV max. SeriesNo. Operating Temperature Range: 40C to +150C (for type PSF) 55C to +170C (for type PES & PEI) No.ofContactPins Mating Cycles: 10,000 insertions min. No.ofSideswithContacts Materials and Finish DesignNumber Housing: Polyetherimide (PEI), glass-filled Contacts: Beryllium Copper (BeCu) MF=Flanged Plating: Gold over Nickel Unmarked=NotFlanged Series IC189 (Open Top) 0.4 to 1.27mm Pitch SOP, TSOP Type I & II Specifications Part Number (Details) Insulation Resistance: 1,000M min. at 100V DC, pitch 0.4, 0.5 IC189 - - 1,000M min. at 500V DC, pitch 0.65, 0.8,1.27 016016 22*09019 * Dielectric Withstanding Voltage: 100V AC for 1 minute, pitch 0.4, 0.5 SeriesNo. 500V AC for 1 minute, pitch 0.65 700V AC for 1 minute, pitch 0.8, 1.27 No.ofContactPins Contact Resistance: 30m max. at 10mA/20mV max. Operating Temperature Range: 40C to +150C NumberofSides Mating Cycles: 10,000 insertions withContacts Contact Force: 20g to 80g per pin DesignNumber Materials and Finish PositioningPin: Housing: Polysulphone (PSF), glass-filled N=WithoutPositioningPin P=WithPositioningPin Polyethersulphone (PES), glass-filled Polyetherimide (PEI), glass-filled ProtectionKey** Contacts: Beryllium Copper (BeCu) K=WithProtectionKey Plating: Gold over Nickel Unmarked=WithoutProtectionKey **Protection Key:PreventsICfromreleasingduringtransportation Series IC235 (Open Top) 0.8 and 1.27mm Pitch SOP, TSOP Type II Specifications Part Number (Details) Insulation Resistance: 1,000M min. at 500V DC -- - IC235 020 2*201 Dielectric Withstanding Voltage: 700V AC for 1 minute Contact Resistance: 30m max. at 10mA/20mV max. SeriesNo. Operating Temperature Range: 40C to +150C Mating Cycles: 10,000 insertions min. No.ofContactPins Contact Force: 20g to 80g per pin NumberofSides withContacts Materials and Finish Housing: Polyetherimide (PEI), glass-filled DesignNumber Contacts: Beryllium Copper (BeCu) Plating: Gold over Nickel PositioningPin: N=WithoutPositioningPin P=WithPositioningPin 40 Test Solutions SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE DIMENSIONS IN MILLIMETERSeries Overview *SOP (Small Outline Packages, Gullwing Leads) SMT Devices Series IC191 (Open Top) 0.5mm Pitch Thin Small Outline Package (TSOP Type I) Specifications Part Number (Details) Insulation Resistance: 1,000M min. at 500V DC Dielectric Withstanding Voltage: 700V AC for 1 minute IC191 -- 032 2*001 Contact Resistance: 30m max. at 10mA/20mV max. SeriesNo. Current Rating: 1A max. Operating Temperature Range: 40C to +170C No.ofContactPins 40C to +150C (type -004*) Mating Cycles: 10,000 insertions min. NumberofSides Contact Force: 20g to 80g per pin withContacts DesignNumber Materials and Finish Housing: Polyetherimide (PEI), glass-filled PositioningPin: Contacts: Beryllium Copper (BeCu) N=WithoutPositioningPin Plating: Gold over Nickel Unmarked=WithPositioningPin Contact Styles Series IC51 Series IC (two point Series IC235 Contact) Series IC (kelvin) Series IC189 / IC191 contd next page SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE DIMENSIONS IN MILLIMETER Test Solutions 41 Gullwing-Leads - SO