Series Overview SMT Devices *SOP (Small Outline Packages, Gullwing Leads) *SOP variations e.g. TSSOP... Series IC51 (Clamshell) 0.5 to 1.27mm Pitch SOP, TSOP Type I & II Speci cations Part Number (Details) Insulation Resistance: 1,000M min. at 500V DC IC51--028 2 334-1- MF Dielectric Withstanding Voltage: 700V AC for 1 minute Series No. Contact Resistance: 30m max. at 10mA/20mV max. Operating Temperature Range: 40C to +150C (for type PSF) No. of Contact Pins 55C to +170C (for type PES & PEI) Mating Cycles: 10,000 insertions min. No. of Sides with Contacts Materials and Finish Design Number Housing: Polyetherimide (PEI), glass- lled Contacts: Beryllium Copper (BeCu) MF= Flanged Plating: Gold over Nickel Unmarked = Not Flanged Series IC189 (Open Top) 0.4 to 1.27mm Pitch SOP, TSOP Type I & II Speci cations Part Number (Details) Insulation Resistance: 1,000M min. at 100V DC, pitch 0.4, 0.5 - - IC189 016016 22*09019 * 1,000M min. at 500V DC, pitch 0.65, 0.8,1.27 Dielectric Withstanding Voltage: 100V AC for 1 minute, pitch 0.4, 0.5 Series No. 500V AC for 1 minute, pitch 0.65 700V AC for 1 minute, pitch 0.8, 1.27 No. of Contact Pins Contact Resistance: 30m max. at 10mA/20mV max. Operating Temperature Range: 40C to +150C Number of Sides Mating Cycles: 10,000 insertions with Contacts Contact Force: 20g to 80g per pin Design Number Materials and Finish Positioning Pin: Housing: Polysulphone (PSF), glass- lled N=Without Positioning Pin P = With Positioning Pin Polyethersulphone (PES), glass- lled Polyetherimide (PEI), glass- lled Protection Key** Contacts: Beryllium Copper (BeCu) K=With Protection Key Plating: Gold over Nickel Unmarked=Without Protection Key **Protection Key: Prevents IC from releasing during transportation Series IC235 (Open T op) 0.8 and 1.27mm Pitch SOP, TSOP Type II Speci cations Part Number (Details) Insulation Resistance: 1,000M min. at 500V DC -- - IC235 0202*201 Dielectric Withstanding Voltage: 700V AC for 1 minute Contact Resistance: 30m max. at 10mA/20mV max. Series No. Operating Temperature Range: 40C to +150C Mating Cycles: 10,000 insertions min. No. of Contact Pins Contact Force: 20g to 80g per pin Number of Sides with Contacts Materials and Finish Housing: Polyetherimide (PEI), glass- lled Design Number Contacts: Beryllium Copper (BeCu) Plating: Gold over Nickel Positioning Pin: N = Without Positioning Pin P = With Positioning Pin Test & Burn-In SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE DIMENSIONS IN MILLIMETERSeries Overview *SOP (Small Outline Packages, Gullwing Leads) SMT Devices Series IC191 (Open Top) 0.5mm Pitch Thin Small Outline Package (TSOP Type I) Speci cations Part Number (Details) Insulation Resistance: 1,000M min. at 500V DC Dielectric Withstanding Voltage: 700V AC for 1 minute - - IC191 032032 22*00001 * Contact Resistance: 30m max. at 10mA/20mV max. Series No. Current Rating: 1A max. Operating Temperature Range: 40C to +170C No. of Contact Pins 40C to +150C (type -004*) Mating Cycles: 10,000 insertions min. Number of Sides Contact Force: 20g to 80g per pin with Contacts Design Number Materials and Finish Housing: Polyetherimide (PEI), glass- lled Positioning Pin: Contacts: Beryllium Copper (BeCu) N = Without Positioning Pin Plating: Gold over Nickel Unmarked = With Positioning Pin Protection Key** K = With Protection Key Unmarked = Without Protection Key **Protection Key: Prevents IC from releasing during transportation Series IC363 (Open T op) 0.65 and 0.8mm Pitch Thin Small Outline Package (TSOP Type II) Speci cations Part Number (Details) Insulation Resistance: 1,000M min. at 500V DC - IC363 0** 2 - 00* * Dielectric Withstanding Voltage: 700V AC for 1 minute Contact Resistance: 30m max. at 10mA/20mV max. Series No. Operating Temperature Range: 40C to +150C No. of Contact Pins Mating Cycles: 10,000 insertions min. Contact Force: 20g to 60g per pin Number of Sides Operating Force: 2.5kg max. with Contacts Materials and Finish Design No. Housing: Polyetherimide (PEI), glass- lled Contacts: Beryllium Copper (BeCu) Positioning Pin: Plating: Gold over Nickel N = Without Positioning Pin P = With Positioning Pin Series IC369 (Open Top) 0.8mm Pitch Thin Small Outline Package (TSOP Type II) Speci cations Part Number (Details) Insulation Resistance: 1,000M min. at 500V DC - IC369 054 2 - * Dielectric Withstanding Voltage: 700V AC for 1 minute Contact Resistance: 30m max. at 10mA/20mV max. Series No. Operating Temperature Range: 40C to +150C No. of Contact Pins Mating Cycles: 10,000 insertions min. Contact Force: 45g 15g per pin Number of Sides with Contacts Materials and Finish Housing: Polyetherimide (PEI), glass- lled Positioning Pin: Contacts: Beryllium Copper (BeCu) N = Without Positioning Pin P = With Positioning Pin Plating: Gold over Nickel contd next page SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE DIMENSIONS IN MILLIMETER Test & Burn-In Gullwing-Leads - SO