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ZTTCR5.00MG is a part of YICN (Yield Improvement Chip-And-Wire), a proprietary high-yield chip production technology developed by TSMC. It includes three stages of yield improvement: Testing, Wire, and Chip-And-Wire. ZTTCR5.00MG focuses on the wire stage, which outlines and verifies the design parameters of wiring materials and structures used in advanced chip production. It also provides guidance to optimize combination processes, with the goal of improving manufacturing yield and reducing power consumption. The combination processes may include chip bumping, wire bonding, lithography, etc. and YICN is expected to help increase the efficiency and quality of chip production.