The TS391AX50 is a thermally stable, no-clean solder paste manufactured by Chip Quik. This solder paste is composed of a Sn63/Pb37 alloy with a Type 4 (T4) mesh size, packaged in a 50-gram jar. Its innovative formula eliminates the need for refrigeration, offering a wide process window, excellent wetting compatibility, and low voiding characteristics.
Key Features:
Revolutionary Formula: The TS391AX50 solder paste does not require refrigeration, simplifying storage and handling.
Printing Capabilities: Supports printing speeds up to 125 mm/sec, making it suitable for high-speed manufacturing processes.
Extended Stencil Life: Offers a long stencil life, maintaining performance over extended periods during the printing process.
Wide Process Window: Compatible with various board finishes, providing flexibility in different manufacturing environments.
Clear Residue: Leaves minimal and clear residue after soldering, reducing the need for post-solder cleaning.
Low Voiding: Exhibits low voiding, ensuring reliable electrical connections.
Excellent Wetting Compatibility: Ensures strong adhesion and reliable solder joints across most board finishes.
Specifications:
Alloy Composition: 63% Tin (Sn) and 37% Lead (Pb)
Flux Type: Synthetic No-Clean
Flux Classification: ROL0
Metal Content: 90.25% by weight
Particle Size: Type 4 (20-38 microns)
Melting Point: 183°C (361°F)
Packaging: Available in a 50-gram jar
Shelf Life: Guaranteed for over 12 months, regardless of refrigeration
Storage and Handling:
The TS391AX50 solder paste should be stored at room temperature (20-25°C or 68-77°F) and should not be frozen. Since it is designed to be thermally stable at operating temperatures, no warming time is required before use. Before application, especially if stored in a jar, it is recommended to stir the product thoroughly for 2-3 minutes to ensure consistency.
Applications:
This solder paste is ideal for surface mount technology (SMT) applications, including:
Printed Circuit Board (PCB) Assembly: Suitable for soldering components onto PCBs in various electronic devices.
Reflow Soldering Processes: Compatible with standard reflow soldering profiles, ensuring reliable solder joints.
Prototyping and Small Batch Production: Its user-friendly properties make it suitable for both prototyping and small-scale manufacturing.
Global Availability:
Chip Quik's TS391AX50 solder paste is available through various distributors worldwide, including in the USA, India, Australia, Europe, and other regions. For instance, it can be purchased from Mouser Electronics in the USA.
In India, authorized distributors like Xon Electronics offer this product.
For other regions, it's advisable to check with local electronic component suppliers or directly contact Chip Quik for authorized distributors.Circuit Diagram and Use Case Scenario:
While the TS391AX50 is a solder paste and not an electronic component, its application is crucial in the assembly of electronic circuits. A typical use case involves applying the solder paste onto a PCB's pads, placing surface mount components, and then subjecting the assembly to a reflow soldering process to form reliable solder joints.
For detailed application guidelines and reflow profiles, please refer to the TS391AX50 datasheet available on Chip Quik's official website.
Conclusion:
The TS391AX50 solder paste by Chip Quik offers a thermally stable, no-clean solution for various soldering applications. Its innovative formula and excellent performance characteristics make it a preferred choice for professionals in the electronics manufacturing industry.
FAQs for TS391AX50 Solder Paste by Chip Quik
1. What is the TS391AX50 solder paste?
The TS391AX50 is a no-clean solder paste manufactured by Chip Quik. It is composed of a Sn63/Pb37 alloy and features a Type 4 (T4) mesh size. It comes in a 50-gram jar and is designed for use in surface mount technology (SMT) applications.
2. What is the composition of the solder paste?
The solder paste contains 63% Tin (Sn) and 37% Lead (Pb), with a synthetic no-clean flux classified as ROL0. The metal content is 90.25% by weight.
3. What are the key features of TS391AX50?
- No refrigeration required for storage.
- Extended stencil life.
- Compatible with various board finishes.
- Excellent wetting compatibility and low voiding.
- Leaves minimal, clear residue after soldering.
- Ideal for high-speed printing (up to 125 mm/sec).
4. What is the shelf life of the TS391AX50 solder paste?
The TS391AX50 solder paste has a guaranteed shelf life of over 12 months, regardless of whether it is refrigerated.
5. Can the solder paste be stored at room temperature?
Yes, the TS391AX50 solder paste can be stored at room temperature between 20-25°C (68-77°F). It should not be frozen.
6. What is the recommended procedure before applying the solder paste?
If the paste has been stored in a jar, it is recommended to stir it thoroughly for 2-3 minutes before application. This ensures consistency and optimal performance.
7. Does the TS391AX50 require post-solder cleaning?
No, the TS391AX50 is a no-clean solder paste. It leaves minimal and clear residue that does not require additional cleaning.
8. What applications is the TS391AX50 suitable for?
The solder paste is ideal for:
- Printed Circuit Board (PCB) assembly.
- Reflow soldering processes.
- Prototyping and small-batch production.
9. Is the TS391AX50 compliant with industry standards?
Yes, the TS391AX50 solder paste is compliant with industry standards and provides reliable results in various SMT applications.
10. Where can I buy the TS391AX50 solder paste?
The TS391AX50 solder paste is available through authorized distributors worldwide, including Xon Electronics, Mouser Electronics, and other electronic component suppliers. It is available in regions such as the USA, India, Australia, Europe, and more.
11. What is the melting point of the TS391AX50 solder paste?
The TS391AX50 solder paste has a melting point of 183°C (361°F).
12. What printing speed is supported by TS391AX50?
The TS391AX50 solder paste supports printing speeds of up to 125 mm/sec, making it suitable for high-speed production environments.
13. Can the TS391AX50 solder paste be used with different PCB finishes?
Yes, the TS391AX50 is compatible with various PCB finishes, offering a wide process window for different manufacturing environments.
14. Is the TS391AX50 safe to use?
Yes, the TS391AX50 solder paste is designed to be safe for use in electronics manufacturing. However, standard safety procedures, such as wearing gloves and working in a ventilated area, are recommended when handling solder paste.
15. Where can I find the datasheet for the TS391AX50 solder paste?
You can download the datasheet for the TS391AX50 solder paste from Chip Quik’s official website or authorized distributor websites.