Winbond | X-ON

Winbond was established in September 1987 and listed on Taiwan Stock Exchange in 1995 with headquarters in Central Taiwan Science Park, Taichung, Taiwan. Winbond is a specialty memory IC company engaged in design, manufacturing and sales services. From product design, research and development, and wafer fabrication to the marketing of brand name products, Winbond endeavors to provide its global clientele top quality low to medium density memory solutions. Winbond's major product lines include Code Storage Flash Memory, Specialty DRAM and Mobile DRAM. Their advantage of technological autonomy and prudent capacity strategy enables them to build a highly flexible production system and create synergy among product lines, which allows them to meet the diverse demands of customers while building the brand image. In the area of Code Storage Flash Memory products, they focus on the “low to medium density” market by offering a full spectrum of Serial Flash and Parallel Flash products. Their Flash memory packages offer features such as low pin count, small size and low cost. They also offer SPI NAND and SLC NAND flash memory products to better meet the customer demands for code storage. With considerable market share in computer peripheral markets, they also actively develop a diversity of flash memory products for applications in mobile devices, consumer electronics, automotive electronics, IoT and wearable devices. Winbond specializes in the design of high-performance, low-power memory. With a 12-inch fab, they offer a whole series of Specialty DRAM and Mobile DRAM products that target a top-tier clientele and quality-oriented applications. Winbond’s products are used extensively in handheld devices, consumer electronics and computer peripherals. They also focus on high-barrier, high-quality applications, such as KGD, automobile and industrial electronics. To provide timely and respective services to clients around the world, Winbond has set up operations and distributor networks in the USA, Japan, China, Hong Kong and Israel. With regard to quality, Winbond implements rigorous process control and quality control, strengthening yield analysis and supply chain management to satisfy customer needs. The long-standing efforts in quality assurance have earned the Company a good reputation and resulted in the accreditation of ISO 9001, TS 16949, QC 080000, ISO 14001, and OHSAS 18001. In the future, Winbond will continue to provide customer-oriented services and concentrate their resources on the markets in which they have a competitive advantage. At the same time, riding on the strength of their advanced semiconductor design and manufacturing know-how, coupled with the innovation and wisdom of their employees, observing the core values in all operational activities, Winbond will strive towards the goal of becoming a world-class solution provider.