I538 Series Product Features: Applications: TCXO Wireless Communication Low Jitter, Non-PLL Based Output Test Instruments CMOS Output GPS Compatible with Leadfree Processing Base stations Digital Compensation Telecommunications Frequency 8.000 MHz to 40.000 MHz Output Level CMOS 0 = 0.5 Vdc Max. 1 = 80% of Vcc Min. Output Load 15pF Duty Cycle 50% 10% Rise / Fall Time 10 nS Max. Frequency Stability Vs Temperature See Frequency Stability Table Vs Voltage (5%) 0.3 ppm Max. Vs Load (5%) 0.2 ppm Max. Frequency Tolerance 1.0 ppm Max. 25 C Aging 1 ppm / Year Max. 25 C Supply Voltage See Supply Voltage Table, Tolerance 5% Current 6.0 mA Max. Operating See Operating Temperature Table -40 C to +85 C Storage Recommended Pad Layout Pad Connections Phase Noise -86 dBc/Hz 10 Hz TCXO Pad/Type (Typ. 20Mhz) -115 dBc/Hz 100 Hz Ground or NC Pad 1 -138 dBc/Hz 1KHz GND Pad 2 -146 dBc/Hz 10KHz Output Pad 3 Supply Voltage (Vcc) Pad 4 Dimension Units: mm Part Number Guide Sample Part Number: I538-1Q3- 20.000 MHz Package Operating Frequency Stability vs Temperature Supply Voltage Frequency Temperature 2 = 2.7 V 7 = 0C to +50C **N = 1.0 ppm 3 = 3.3 V 1 = 0C to +70C **O = 1.5 ppm I538 6 = 2.5 V 3 = -20C to +70C P = 2.0 ppm -20.000 MHz (CMOS TCXO) 7 = 3.0 V 5 = -30C to +85C Q = 2.5 ppm 8 = 2.8 V 2 = -40C to +85C R = 3.0 ppm J = 5.0 ppm NOTE: A 0.01 F bypass capacitor is recommended between Vcc (pin 4) and GND (pin 2) to minimize power supply noise. ** Not available for all operating temperature ranges and output frequencies. Revised J: 11/23/20 Page 1 of 2 www.ilsiamerica.com I538 Series Pb Free Solder Reflow Profile: Typical Application: GND or NC *Units are backward compatible with 240C reflow processes Package Information: MSL = N.A. (package does not contain plastic storage life is unlimited under normal room conditions). Termination = e4 (Au over Ni over W base metallization). Tape and Reel Information: Quantity per 3000 Reel A 8 0.3 B 4 0.2 C 3.5 0.2 D 91 or 12 3 E 60 / 80 F 180 Environmental Specifications: Thermal Shock MIL-STD-883, Method 1011, Condition A Moisture Resistance MIL-STD-883, Method 1004 Mechanical Shock MIL-STD-883, Method 2002, Condition B Mechanical Vibration MIL-STD-883, Method 2007, Condition A Resistance to Soldering Heat J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max) Hazardous Substance Pb-Free / RoHS / Green Compliant Solderability JESD22-B102-D Method 2 (Preconditioning E) Terminal Strength MIL-STD-883, Method 2004, Test Condition D Gross Leak MIL-STD-883, Method 1014, Condition C Fine Leak MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s Solvent Resistance MIL-STD-202, Method 215 Revised J: 11/23/20 Page 2 of 2 www.ilsiamerica.com