X-On Electronics has gained recognition as a prominent supplier of AG GOLD 100G Thermal Interface Products across the USA, India, Europe, Australia, and various other global locations. AG GOLD 100G Thermal Interface Products are a product manufactured by AG Termopasty. We provide cost-effective solutions for Thermal Interface Products, ensuring timely deliveries around the world.

AG GOLD 100G AG Termopasty

AG GOLD 100G electronic component of AG Termopasty
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Part No.AG GOLD 100G
Manufacturer: AG Termopasty
Category: Thermal Interface Products
Description: Heat transferring paste; copper; silicone + gold; 100g; AG Gold
Datasheet: AG GOLD 100G Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 30.4395 ea
Line Total: USD 30.44 
Availability - 0
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0
Ship by Wed. 27 Nov to Fri. 29 Nov
MOQ : 1
Multiples : 1
1 : USD 30.4395
2 : USD 28.7878

   
Manufacturer
Product Category
Thermal Conductivity
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We are delighted to provide the AG GOLD 100G from our Thermal Interface Products category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the AG GOLD 100G and other electronic components in the Thermal Interface Products category and beyond.

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is a thermal interface material used in heat-dissipating components such as CPUs and GPUs. It uses a specialized combination of copper, silicon and gold particles to provide superior heat dissipation. The gold prevents oxidation and corrosion for improved performance of the device. The paste is non-toxic, lead-free and does not contain any hazardous materials. It is designed to improve the thermal resistance of electronic connections and reduce overall power consumption. AG GOLD 100G is suitable for high-power applications such as gaming and overclocking and is compatible with a wide range of consumer electronics.

Tariff Desc

8547.9 TC 8535449 SHEETING OR SHAPES, electrically insulating, thermally conductive,
being combinations of two OR more of the following:
(a) silicone rubber;
(b) glass fibre;
(c) boron nitride;
(d) polyimide;
(e) copper
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