X-On Electronics has gained recognition as a prominent supplier of LP-1 Soldering Flux across the USA, India, Europe, Australia, and various other global locations. LP-1 Soldering Flux are a product manufactured by AG Termopasty. We provide cost-effective solutions for Soldering Flux, ensuring timely deliveries around the world.

LP-1 AG Termopasty

LP-1 electronic component of AG Termopasty
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See Product Specifications
Part No.LP-1
Manufacturer: AG Termopasty
Category: Soldering Flux
Description: Flux: rosin based; halide-free, No Clean, Lead Free; liquid; 0.1l
Datasheet:
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the LP-1 from our Soldering Flux category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the LP-1 and other electronic components in the Soldering Flux category and beyond.

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LP-1 termopasty is a type of thermal paste (also known as thermal compound or thermal grease), a viscous material that is used to fill the microscopic air gaps between the contact surfaces of two objects in order to reduce thermal resistance. The paste is made from silicone, a combination of metals such as aluminum, tin, lead and diamond particles, and graphite. The thermal paste is applied between the processor and the heat sink to facilitate better heat transfer. LP-1 is one of the most highly-regarded thermal pastes, providing excellent thermal conductivity and a wide range of temperature and thermal expansion coefficients to ensure the best connection and heat transfer.

Tariff Desc

8311.30.00 -Coated rods and cored wire, of base metal, for soldering, brazing or welding by flame

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