10129181-101LF Amphenol

ExaMAX 56Gb/s High Speed Orthogonal Connector System ExaMAX high speed orthogonal connector system is designed to enable superior 56Gb/s electrical performance for increasing bandwidth requirements and the data rates used for high speed signaling. To further expand the range of applications supported by the ExaMAX connector system, Amphenol has added a 6-Pair Orthogonal right angle header connector solution. The connectors enable efficient implementation of Direct-Mate orthogonal and midplane orthogonal architectures. Orthogonal architecture solutions eliminate long, complex traces, via stub effects, simplify signal links and reduce backplane layer count. TARGET MARKETS Amphenol Direct-Mate orthogonal connector system maximizes chassis cooling and airflow while improving signal integrity performance at a reduced cost. The mechanically robust connector design supports chassis alignment in a 25mm card slot configuration. The flexible connector design also enables designers to allocate rows to high speed signal, low speed signal, or integrated power. The ExaMAX high speed connector system is offered in industry standard packaging options including a broad range of backplane, coplanar, mezzanine, cable-to- board, orthogonal midplane and orthogonal direct configurations. FEATURES BENEFITS Capable of supporting data rates of 25Gb/s with scalable Supports future system performance upgrades while eliminating migration path to 56Gb/s costly redesign burden Unique beam-on-beam interface and skew equalized leadframes Superior signal integrity performance via impedance control, low cross-talk while eliminating insertion loss resonances. Mating forces reduced by 40% compared to traditional blade and beam designs Hermaphroditic mating interface protects mating beams Durable, reliable mating interface design. Eliminates crushed pins Simple efficient 92 design Supports both 85 and 100 applications 2.0mm pitch delivers 76 pair per inch density Industry leading density performance Modular, 2mm hard metric connector block design Modular design capability supports applications requiring high and low speeds, power, and mechanical guidance at lowest industry costs 0.36mm PTH for signals and 0.5mm for grounds Friendly to PCB manufacturers, improving cost and yield Additional Signal Pin per IMLA Integrate High and low speed signals in the same connector Integrated guidance Superior mating performance Amphenol Information Communications and Commercial Products www.amphenol-icc.com ExaMAX 56Gb/s High Speed Orthogonal Connector System TECHNICAL INFORMATION MATERIAL SPECIFICATION Contacts: High performance Copper Alloy Amphenol Product Specification: GS-12-1096 Plating(s): Performance-based plating at Amphenol Application Specification: GS-20-0361 separable interface (Telcordia GR-1217-CORE) Tin SIGNAL INTEGRITY PERFROMANCE over Nickel on press-fit tails See graphs below for Insertion Loss and power-summed Housings: High temperature thermoplastic, crosstalk UL 94 V-0 Impedance is tuned to 92 making ExaMAX suitable MECHANICAL PERFORMANCE forboth 85 and 100 systems Long mating wipe of > 2mm Test reports are available which show the performance in X capture: +/-1.2mm both 85 and 100 environments Y capture: +/-1.1mm OIF Specification: OIF-CEI-25G-LR Mating Force: 0.45N max. per contact TARGET MARKETS/APPLICATIONS Unmating Force: 0.10N min. per contact Hubs Optical Transport ELECTRICAL PERFORMANCE Router Contact Resistance: <10 m change from initial Switches reading after environmental exposure Wireless Infrastructure Current Rating (with 30 C T-rise above ambient) External Storage System Server Signal contact: 0.5A/Contact (both signal and Supercomputer ground contacts can carry current) Emulation Equipment ENVIRONMENTAL Test Equipment Telcordia GR-1217-CORE Central Office qualification completed Operating Temperature: -55C to +85C Disclaimer www.amphenol-icc.com Please note that the above information is subject to change without notice.