UltraPort SFP+ Low Cost, Compact And Flexible SFP28 Interconnect System Amphenol ICCs UltraPort SFP+ interconnect system comprises of a 20-position hot swappable I/O connector enclosed in a metal cage mounted to a host PCB. It supports 28Gb/s applications with a backward compatibility for next generation ethernet and fibre Channel applications. UltraPort SFP+ connector shares the same unique mating interface and EMI cage dimensions as the SFP+ form factor. The cages are built to use with several board thicknesses and assembly processes to accommodate server and switch applications for cost optimized solutions. The connector accepts multiple transceivers per INF-8081 to TARGET MARKETS combine, transmit, and receive functions in a low cost, compact and flexible format. Stacked versions (2XN) consist of a 2-row cage with integrated connectors. A wide variety of cage configurations, with a two-piece construction and enhanced transceiver mating tabs are offered in press-fit or solder tail versions. Electrical interface employs 1 lane that operates up to 28Gb/s per channel UltraPort SFP+ connector shares the same unique mating interface and EMI cage dimensions as the SFP+ form factor UltraPort SFP+ connector accepts multiple transceivers per INF-8081 to combine, transmit, and receive functions in a low cost, compact and flexible format FEATURES BENEFITS Electrical interface employs 1 lane that operate up to Support next generation Ethernet and Fibre Channel 28Gb/s per channel applications UltraPort SFP+ connector shares the same unique mating Support previous generation systems interface and EMI cage dimensions as the SFP+ form factor UltraPort SFP+ connector accepts multiple transceivers Support various application requirements per INF-8081 Amphenol Information Communications and Commercial Products www.amphenol-icc.com UltraPort SFP+ TECHNICAL INFORMATION MATERIAL ELECTRICAL PERFORMANCE Housing: Black color, Glass reinforced, Lead Operating Voltage: 30 VDC per contact Free Solder Reflow Process Compatible Thermo Operating Current: 0.5 A per contact Plastic Differential Impedance: 100 +/- 10 Contacts Base Material: Phosphor Bronze ENVIRONMENTAL Plating Solder Tails: Matte tin or gold flash options Operating and (Storage) Temperature: -55 to +85C Plating Mating Area: Gold RoHS & Halogen-Free Resonance Dampening Feature: Conductive Polymer TOOLING INFORMATION Configurations: MECHANICAL PERFORMANCE 1xN (N =1, 2, 3, 4, 5, 6, 8) Durability: 250 mating cycles 2xN (N = 1, 2, 4, 5, 6, 8, 12) Mating Force: 40 N max. Contact Normal Force: 0.3 N min./PIN TARGET MARKETS/APPLICATIONS PCB Thickness Single Side Mount (Cage): 1.57 mm Cellular Infrastructure (0.062 in.) Telecommunications Hardware PCB Thickness Belly to Belly (Cage): 3.00 mm (0.118 in.) Servers Storage Unmating Force (Cage): 12.5 N max. Insertion Force to PCB (Cage): Test and Measurement Equipment 1000 N for 2 port 2100 N for 4 port Medical Diagnostic Equipment 3000 N for 6 port Disclaimer www.amphenol-icc.com Please note that the above information is subject to change without notice.