73M2901CE V.22bis Single Chip Modem Simplifying System Integration DATA SHEET DS 2901CE 031 January 2010 DESCRIPTION FEATURES The 73M2901CE low speed modem integrates a True one chip solution for embedded systems data pump, controller, and analog front end in a As low as 9.5 mA operating with standby and 3.3 V device with a powerfulA command host power down mode available interface. The modem reduces external Power supply operation from 3.6 V to 2.7 V component count/cost by incorporating many Data modes and speeds: features like parallel phone detect, Line-In-Use V.22bis 2400 bps and Ring detection in software without requiring V.22/Bell212 1200 bps additional components. V.21/Bell103 300 bps V.23 1200/75 bps (with PAVI turnaround) The device is aone chip fits all solution for Bell202 1200 bps applications including set-top boxes, point-of-sale Bell202/V23 1200 bps FDX 4-wire operation terminals, automatic teller machines, utility V.22/Bell 212A/V.22bis synchronous modes meters, vending machines and smart card readers. International Call Progress support: FCC part 68, CTR21, JATE, etc. Another distinctive feature of this device is pin DTMF generation and detection compatibility with Teridians flagship embedded Worldwide Caller ID capability hard modems, the 73M2901CL, and the U.S. Type I and II support 73M1903 soft modem AFE. This offers EIA 777A compliant customers a cost effective method to design for SIA-2000 compliant both hard or soft modem solutions in the same SMS messaging support system as a risk-free cost reduction path. On chip hybrid driver Complete support, modem reference designs Blacklisting capability and error correction software are part of the Line-In-Use and Parallel Pick-Up (911) detection solution offered by Teridian. Our in-house with voltage or low cost energy detection method application engineering team is here to help Incoming ring energy detection through CID meet your international certification needs. path no optocoupler circuitry required Manufacturing Self Test capability Backward compatible with 73M2901CL Packaging: 32 lead QFN, 32-pin TQFP Rev. 3.4 2010 Teridian Semiconductor Corporation 1 73M2901CE Data Sheet DS 2901CE 031 Table of Contents 1 Hardware Description .................................................................................................................... 4 1.1 Power Supply ....................................................................................................................... 4 1.2 Low Power Mode .................................................................................................................. 4 1.3 Analog Line / Hybrid Interface ............................................................................................... 4 1.4 Interrupt Pins ........................................................................................................................ 4 1.5 Crystal Oscillator................................................................................................................... 5 1.5.1 Specifying a Crystal ..................................................................................................... 5 1.6 Reset .................................................................................................................................... 5 1.7 Asynchronous and Synchronous Serial Data Interface .......................................................... 5 2 Pinout ............................................................................................................................................. 6 3 Pin Descriptions ............................................................................................................................ 7 3.1 Power Pins ........................................................................................................................... 7 3.2 Analog Interface Pins ............................................................................................................ 7 3.3 Digital Interface Pins ............................................................................................................. 7 3.4 External Interrupt Pins .......................................................................................................... 8 3.5 Oscillator Pins ....................................................................................................................... 8 4 Electrical Specifications ................................................................................................................ 9 4.1 Absolute Maximum Ratings................................................................................................... 9 4.2 Recommended Operating Conditions .................................................................................... 9 4.3 Receiver ............................................................................................................................... 9 4.4 Transmitter ......................................................................................................................... 10 4.5 Maximum Transmit Level .................................................................................................... 10 4.6 DC Characteristics, Vcc = 3.3 V .......................................................................................... 11 4.6.1 DC Supply Current, VDD = 2.7 V (Battery EOL) ......................................................... 11 4.6.2 DC Supply Current , VDD = 3.0 V .............................................................................. 11 4.6.3 DC Supply Current VDD = 3.3 V ................................................................................ 12 4.6.4 DC Supply Current VDD = 3.6 V ................................................................................ 12 5 Firmware Description .................................................................................................................. 13 5.1 Firmware Overview ............................................................................................................. 13 5.2 Firmware Features .............................................................................................................. 13 6 Design Considerations ................................................................................................................ 14 6.1 Layout Considerations ........................................................................................................ 14 6.2 73M2901CE Design Compatibility ....................................................................................... 15 6.3 Telephone Line Interface .................................................................................................... 15 6.4 Functional Considerations ................................................................................................... 16 6.4.1 SMS and V.23 Half Duplex ........................................................................................ 16 6.4.2 Leased Line Mode ..................................................................................................... 16 6.4.3 73M2901CE Energy Ring Detection .......................................................................... 17 6.4.4 Caller ID Mode Changes ........................................................................................... 18 6.4.5 Selectable Answer Tone Frequency Detection ........................................................... 18 6.4.6 73M2901CE S99 Country Code Support ................................................................... 18 7 Reference Designs ...................................................................................................................... 21 7.1 Low Cost Design Using DSP Ring and Status Monitoring .................................................... 21 7.2 Reference Design Using Traditional Hardware Line Monitoring ........................................... 22 8 Modem Performance Characteristics ......................................................................................... 23 8.1 BER versus SNR ................................................................................................................ 23 8.2 BER versus Receive Level .................................................................................................. 23 9 Package Mechanical Drawing ..................................................................................................... 24 9.1 32-Pin QFN ........................................................................................................................ 24 9.2 32-Pin TQFP....................................................................................................................... 25 10 Ordering Information ................................................................................................................... 26 11 Related Documentation ............................................................................................................... 26 12 Contact Information ..................................................................................................................... 26 Revision History .................................................................................................................................. 27 2 Rev. 3.4